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    • 1. 发明公开
    • 웨이퍼 에지 검출방법
    • 检测波形边的方法
    • KR1020120023430A
    • 2012-03-13
    • KR1020100086579
    • 2010-09-03
    • 주식회사 이오테크닉스
    • 권용락최영준
    • H01L21/66H01L21/78
    • H01L22/12
    • PURPOSE: A wafer edge detection method is provided to accurately detect edges of a wafer using an image binary-coding method, thereby easily performing a manufacturing process on the central part of the wafer. CONSTITUTION: An image with respect to a region(A) which includes an edge of a wafer is binary-coded. The edge(a) of the wafer is detected from the binary-coded image. The image which includes the edge of the wafer is a mono image. Three or more edges of the wafer are detected through the binary-coding process of the mono image. The wafer is attached on a tape.
    • 目的:提供使用图像二进制编码方法精确检测晶片边缘的晶片边缘检测方法,从而容易地在晶片的中心部分进行制造工艺。 构成:相对于包括晶片边缘的区域(A)的图像是二进制编码的。 从二进制编码图像检测晶片的边缘(a)。 包括晶片边缘的图像是单声道图像。 通过单声道图像的二进制编码处理来检测晶片的三个或更多个边缘。 将晶片连接在磁带上。