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    • 1. 发明公开
    • 와이어 접합기 및 와이어 접합기를 교정하는 방법
    • 一种线接合器和一种校准电线接头的方法
    • KR1020140095993A
    • 2014-08-04
    • KR1020140008652
    • 2014-01-24
    • 에이에스엠 테크놀러지 싱가포르 피티이 엘티디
    • 송켕예우리와이와왕이빈
    • H01L21/60
    • H01L24/78H01L24/48H01L24/85H01L2224/48247H01L2224/78268H01L2224/78301H01L2224/78801H01L2224/85045H01L2224/85205H01L2224/859H01L2924/00014H01L2924/12042H01L2224/45099H01L2224/05599H01L2924/00
    • Disclosed is a wire binder including: a processor; a bonding head coupled to the processor and configured to allow the processor to control the motion of the binding head; a binding frame mounted on the binding head and driven by the binding head in order for mutual electrical connection to be made between a substrate having a semiconductor die mounted thereon and the semiconductor die through a binding wire; and a measurement device coupled to the binding head to measure the deformation of a binding part of the binding wire when the binding frame is driven by the binding head in order for the binding wire to be connected with the semiconductor die through the binding part. In detail, disclosed is a method of correcting the wire binder, in which the processor deduces at least one correlation between the measured deformation of the binding part and operating parameters of the wire binder, compares at least one deduced correlation with a correlation preset between the operating parameters of the wire binder and desirable deformation of the binder, and corrects the operating parameters based on the comparison between at least one deduced correlation and the preset correlation between the operating parameters of the wire binder and the deformation of the binding part.
    • 公开了一种线夹,包括:处理器; 结合头,其耦合到所述处理器并且被配置为允许所述处理器控制所述装订头的运动; 安装在装订头上并由装订头驱动的装订框架,以便在其上安装有半导体管芯的基板和通过装订线的半导体管芯之间进行相互电连接; 以及耦合到所述装订头的测量装置,用于当所述装订框架被所述装订头驱动时,以测量所述装订线的装订部分的变形,以便所述装订线通过所述装订部分与所述半导体模具连接。 详细地,公开了一种校正线材粘合剂的方法,其中处理器推断测量的结合部分的变形与线材粘合剂的操作参数之间的至少一个相关性,将至少一个推导的相关性与 焊接工具的操作参数和粘合剂的理想变形,并且基于至少一个推导的相关性与线粘合剂的操作参数与结合部的变形之间的预设相关性之间的比较来校正操作参数。