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    • 1. 发明公开
    • 절연성 기판 위의 MR 센서 및 제조방법
    • 绝缘基板传感器及其制造方法
    • KR1020060130242A
    • 2006-12-18
    • KR1020067020928
    • 2005-03-09
    • 에스에이이 마그네틱스 (에이치.케이) 리미티드
    • 주,리-얀야수다,카즈마사리우,쳉이호세,윈스톤
    • G11B5/127G11B5/33G11B5/39
    • G11B5/40B82Y10/00B82Y25/00G11B5/11G11B5/3906G11B2005/3996Y10T29/49044
    • According to an embodiment of the present invention, a slider design (409) is presented that provides improved protection for the head/sensor (613) of the slider (409). In one embodiment, the design of the slider (409) is such that ESD protection is provided during the slider wafer (407) process, the "back-end" processes (e.g., when the completed slider/head is incorporated into an HGA), and during operation in a disk drive or the like. In this embodiment, a conductive film (403) is provided that surrounds the insulating-material slider substrate (407). The conductive film (403) provides a grounding path during the wafer fabrication processes. This conductive layer (403) may be further patterned during head fabrication to provide a ground path for back-end fabrication processes. A conductive stripe may be added for discharging debris in the slider-to-disk interface.
    • 根据本发明的实施例,提出了一种滑块设计(409),其提供了对滑块(409)的头部/传感器(613)的改进的保护。 在一个实施例中,滑块(409)的设计使得在滑块晶片(407)处理期间提供ESD保护,“后端”处理(例如,当完成的滑块/头被并入到HGA中时) ,并且在磁盘驱动器等操作期间。 在本实施例中,提供围绕绝缘材料滑块基板(407)的导电膜(403)。 导电膜(403)在晶片制造工艺期间提供接地路径。 该导电层(403)可以在头部制造期间被进一步构图以提供用于后端制造工艺的接地路径。 可以添加导电条,用于在滑块对盘接口中排出碎片。