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1. 发明公开

KR1020120109752A 발광소자 패키지 및 제조방법 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：KR1020120109752A
公开(公告)日：2012-10-09
申请号：KR1020110027175
申请日：2011-03-25
申请人： 삼성전자주식회사
发明人： 편인준
IPC分类号： H01L23/00 , H01L25/075 , H01L33/52 , H01L33/56 , H01L33/48 , H01L33/62
CPC分类号： H01L33/52 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2924/12036 , H01L2924/12041 , H01L2933/005 , H01L25/0753 , H01L33/486 , H01L33/56 , H01L33/62 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE: A light emitting device package and a manufacturing method thereof are provided to prevent color dispersion failure due to non-uniform contraction of encapsulation material by preventing the shape change of the encapsulation material. CONSTITUTION: A structure(310) forms a cavity. The structure is comprised of synthetic resin material. A light-emitting device chip(330) is mounted on the bottom of the cavity. The light-emitting device chip is electrically connected to a first lead frame(321). One or more penetration holes(314) are formed on the bottom of the cavity. The cavity is evenly filled with encapsulation material. The structure comprises a substrate and a dam which is arranged on the substrate as the type of the cavity.
摘要翻译：目的：提供一种发光器件封装及其制造方法，以防止封装材料形状变化引起的封装材料的不均匀收缩引起的色散失效。构成：结构（310）形成空腔。该结构由合成树脂材料组成。发光器件芯片（330）安装在空腔的底部。发光器件芯片电连接到第一引线框架（321）。一个或多个穿孔（314）形成在空腔的底部。腔体均匀地填充有封装材料。该结构包括基板和作为空腔类型布置在基板上的坝。

2. 发明公开

KR1020090069146A 발광 다이오드 패키지 无效
标题翻译：发光二极管封装
公开(公告)号：KR1020090069146A
公开(公告)日：2009-06-29
申请号：KR1020080133439
申请日：2008-12-24
申请人： 삼성전자주식회사
发明人： 편인준 , 김홍민
IPC分类号： H01L33/48 , H01L33/62 , H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/01021 , H01L2924/01068 , H01L2924/00014
摘要： A light emitting diode package is provided to reduce a manufacturing cost by reducing an amount of light transmissive transparent resin filled in a cavity. A pair of lead frames(112,113) are connected to at least one LED(Light Emitting Diode)(111) by a metal wire. A pair of lead frames are fixed to a package body(115). A cavity(117) is formed in the package body. An upper part of the cavity is opened. A light-transmissive transparent resin(116) covers the LED chip. The light-transmissive transparent resin is filled in the cavity. A recess(118) is formed in the bottom of the cavity. The depth of the recess is 50 to 400 um. The LED chip is mounted on the recess.
摘要翻译：提供一种发光二极管封装，通过减少填充在空腔中的透光透明树脂的量来降低制造成本。一对引线框架（112,113）通过金属线连接到至少一个LED（发光二极管）（111）。一对引线框固定到封装体（115）上。在封装主体中形成空腔（117）。打开空腔的上部。透光性透明树脂（116）覆盖LED芯片。透光透明树脂填充在空腔中。凹部（118）形成在空腔的底部。凹槽的深度为50至400um。 LED芯片安装在凹槽上。

3. 发明公开

KR1020120091862A 발광소자 패키지 无效
标题翻译：发光装置包装
公开(公告)号：KR1020120091862A
公开(公告)日：2012-08-20
申请号：KR1020110011921
申请日：2011-02-10
申请人： 삼성전자주식회사
发明人： 편인준 , 이영진 , 문경미 , 최일흥
IPC分类号： H01L33/62 , H01L33/52 , H01L33/48
CPC分类号： H01L2224/48091 , H01L2924/15157 , H01L2924/181 , H01L33/62 , H01L33/20 , H01L33/52 , H01L2924/00012 , H01L2924/00014
摘要： PURPOSE: A light emitting device package is provided to improve the reliability of the light emitting device package by arranging a wire to be surrounded with a resin molding unit filled in a cavity. CONSTITUTION: A main body(110) includes a light emitting device mounting unit and a plurality of lead terminals(111,112). A light emitting device(120) is mounted on the light emitting device mounting unit. The light emitting device is electrically connected to the plurality of lead terminals using a plurality of wires(121,122). A resin molding unit is filled in the cavity to limit an area to surround the light emitting device and the plurality of wires. The cavity includes a first cavity(141) which surrounds the light emitting device and a second cavity(142a,142b) which surrounds the wire.
摘要翻译：目的：提供一种发光器件封装，以通过布置被填充在空腔中的树脂模塑单元包围的导线来提高发光器件封装的可靠性。构成：主体（110）包括发光装置安装单元和多个引线端子（111,112）。发光器件（120）安装在发光器件安装单元上。发光装置使用多根导线（121,122）与多个引线端子电连接。树脂成型单元填充在空腔中以限制围绕发光装置和多根电线的区域。空腔包括围绕发光器件的第一腔（141）和围绕线的第二腔（142a，142b）。

4. 外观设计

KR3007038070000S 有权
公开(公告)号：KR3007038070000S
公开(公告)日：2013-08-05
申请号：KR3020120015222
申请日：2012-03-30
申请人： 삼성전자주식회사
设计人： 백호선 , 오방원 , 편인준 , 조영진

5. 发明公开

KR1020120096214A 광원 모듈 및 이를 구비하는 조명 장치 无效
标题翻译：光源模块和具有相同功能的照明设备
公开(公告)号：KR1020120096214A
公开(公告)日：2012-08-30
申请号：KR1020110015481
申请日：2011-02-22
申请人： 삼성전자주식회사
发明人： 정석호 , 최일흥 , 안세환 , 편인준
IPC分类号： F21S2/00 , F21V17/00
摘要： PURPOSE: A light source module and a lighting device including the same are provided to maximize optical efficiency by enlarging the exposure area of a metal base to the utmost while maintaining a wire length available for wire bonding. CONSTITUTION: A light source module(10) comprises a metal base(100) having a light emitting device, an insulating layer, a wiring layer(300), an electric connection unit(400), a cover layer(500), and a lens unit. The metal base easily releases heat from a light emitting device(110) embedded on the top thereof. The insulating layer, the wiring layer, and the cover layer are successively laminated on the metal base.
摘要翻译：目的：提供一种光源模块和包括该光源模块的照明装置以通过在保持可用于引线接合的导线长度的同时最大限度地扩大金属基底的曝光面积来最大化光学效率。构造：光源模块（10）包括具有发光器件的金属基底（100），绝缘层，布线层（300），电连接单元（400），覆盖层（500）和镜头单元。金属基底易于从嵌入其顶部的发光器件（110）释放热量。绝缘层，布线层和覆盖层依次层压在金属基底上。

6. 发明公开

KR1020100044637A 측면 발광형 발광다이오드 패키지 无效
标题翻译：侧视类型发光二极管封装
公开(公告)号：KR1020100044637A
公开(公告)日：2010-04-30
申请号：KR1020080103847
申请日：2008-10-22
申请人： 삼성전자주식회사
发明人： 신현수 , 박성수 , 편인준
IPC分类号： H01L33/60
摘要： PURPOSE: A side view type light emitting diode package is provided to emit light to the outside of the light emitting package by adjusting the angle of the inner sidewall of the light emitting package. CONSTITUTION: A first sidewall(140a) is used as a mounting surface. A second sidewall(140b) opposes to the first sidewall. A groove is formed on the sidewall which is a light emitting surface between the first and the second sidewalls. A third sidewall(140c) and a forth sidewall(140d) surround the groove. A pair of lead frames(120a, 120b) are formed on the main body of a side view type light emitting diode package. A light emitting chip(150) is mounted on the lower side of the groove to be connected to the lead frames.
摘要翻译：目的：提供一种侧视型发光二极管封装，通过调节发光封装的内侧壁的角度将光发射到发光封装的外部。构成：将第一侧壁（140a）用作安装表面。第二侧壁（140b）与第一侧壁相对。在作为第一和第二侧壁之间的发光表面的侧壁上形成凹槽。围绕凹槽的第三侧壁（140c）和第四侧壁（140d）。一对引线框架（120a，120b）形成在侧视型发光二极管封装的主体上。发光芯片（150）安装在凹槽的下侧以与引线框架连接。

7. 发明授权

KR101762174B1 발광소자 패키지 및 제조방법 有权
标题翻译：发光器件封装和制造方法
公开(公告)号：KR101762174B1
公开(公告)日：2017-08-07
申请号：KR1020110027175
申请日：2011-03-25
申请人： 삼성전자주식회사
发明人： 편인준
IPC分类号： H01L23/00 , H01L25/075 , H01L33/52 , H01L33/56 , H01L33/48 , H01L33/62
CPC分类号： H01L33/52 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2924/12036 , H01L2924/12041 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： 발광소자패키지및 제조방법이개시된다. 개시된발광소자패키지제조방법은각 발광소자칩이장착된복수의캐버티가형성되며, 상기캐버티의바닥에관통홀이형성된패키지본체와, 상기캐버티를막는제1면을제공하는고정몰드를준비하는단계; 상기캐버티의단부가상기제1면과접촉하도록상기패키지본체를상기고정몰드에체결하고, 상기캐버티내로상기관통홀을통해서봉지제를공급하는단계; 상기봉지제를경화시킨후, 상기패키지본체를상기고정몰드로부터분리하고, 상기패키지본체를각 단품으로싱귤레이션하는단계;를포함한다. 상기봉지제공급은상기봉지제가중력방향으로공급되게상기고정몰드위에상기패키지본체를배치한상태에서수행한다.
摘要翻译：公开了一种发光器件封装及其制造方法。所公开的发光器件封装的制造方法与多个各发光器件芯片的空腔的形成被安装，且具有在所述空腔的底部的通孔腔封装体，所述固定半模，以提供一第一表面，以防止在腔制备的步骤; 其中所述封装主体的固定端部的空腔的第一面接触到固定模，并供给袋jereul通过通孔进入空腔; 在封装剂固化后将封装体与固定模具分离，并将封装体分成单独的部分。所述袋供应以间歇hansangtae在固定模具所以在重力的方向上的密封剂供给进行到封装体。

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