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    • 6. 发明公开
    • 반도체 소자 및 그 제조 방법
    • 半导体器件及其制造方法
    • KR1020090041168A
    • 2009-04-28
    • KR1020070106741
    • 2007-10-23
    • 삼성전자주식회사
    • 배용국이시형안태혁오석환
    • H01L27/108H01L21/8242
    • H01L27/10894H01L27/10852H01L28/91
    • A semiconductor device and a method for manufacturing the same are provided to surround a bottom electrode with a support stably by forming the support for supporting the bottom electrode of a capacitor between the bottom electrodes in a stripe shape to have different height in adjacent supports. After forming a bottom electrode(910), a first mold layer, a second mold layer and a protective mold layer are removed by the wet etching. The first mold layer, the second mold layer, the protective mold layer, and a buried layer are removed by using a lift-off process method by using the hydrofluoric acid or LAL(Limulus amoebocyte lysate). The bottom electrode is supported while being surrounded with a first support(600a) or a second support(610a). One bottom electrode is supported by one of the first support and the second support. After removing the first mold layer, the second moldy layer, the protective mold layer, and the buried layer, a capacitor(950) is made by forming a dielectric layer(920) and a top electrode(930) on the bottom electrode.
    • 提供半导体器件及其制造方法,通过在底部电极之间形成用于支撑电容器的底部电极的支撑件,以条形形状稳定地围绕底部电极,以便在相邻支撑件中具有不同的高度。 在形成底部电极(910)之后,通过湿蚀刻去除第一模具层,第二模具层和保护模具层。 通过使用氢氟酸或LAL(鲎变形细胞溶胞产物)的剥离法除去第一模具层,第二模具层,保护性模具层和掩埋层。 底部电极在被第一支撑件(600a)或第二支撑件(610a)围绕的同时被支撑。 一个底部电极由第一支撑件和第二支撑件中的一个支撑。 在去除第一模具层,第二发霉层,保护模具层和掩埋层之后,通过在底部电极上形成介电层(920)和顶部电极(930)来制造电容器(950)。
    • 7. 发明公开
    • 반도체 소자 및 이의 제조 방법
    • 半导体器件及其制造方法
    • KR1020080103277A
    • 2008-11-27
    • KR1020070050371
    • 2007-05-23
    • 삼성전자주식회사
    • 이혜란최시영강상범이시형
    • H01L29/78
    • H01L21/823842H01L21/82385
    • A semiconductor device and a manufacturing method thereof are provided to improve the gate depletion phenomenon by setting up the first and the second conductive layer pattern at the bottom part of the gate located on the first and second area. A semiconductor device comprises the semiconductor substrate(100) including the first area and the second area; the gate insulating layer formed on the first and second area of the semiconductor substrate; the first gate(140) including the first poly silicon film pattern(120) formed on the first conductive layer pattern and the first conductive layer pattern; the second conductive layer pattern(110b) thicker than the first conductive layer pattern(110a); the second gate(150) including the second polysilicon layer pattern formed on the second conductive layer pattern and the second conductive layer pattern. The second conductive layer pattern is formed on the gate insulating layer of the second part.
    • 提供半导体器件及其制造方法,以通过在位于第一和第二区域的栅极的底部设置第一和第二导电层图案来改善栅极耗尽现象。 半导体器件包括包括第一区域和第二区域的半导体衬底(100) 所述栅极绝缘层形成在所述半导体衬底的所述第一和第二区域上; 所述第一栅极(140)包括形成在所述第一导电层图案上的所述第一多晶硅图案(120)和所述第一导电层图案; 所述第二导电层图案(110b)比所述第一导电层图案(110a)厚; 第二栅极(150)包括形成在第二导电层图案上的第二多晶硅层图案和第二导电层图案。 第二导电层图案形成在第二部分的栅极绝缘层上。
    • 8. 发明授权
    • 반도체 소자 및 이를 형성하는 방법
    • 半导体器件及制造半导体器件的方法
    • KR100852212B1
    • 2008-08-13
    • KR1020070057450
    • 2007-06-12
    • 삼성전자주식회사
    • 이혜란최시영강상범이시형현상진
    • H01L21/336H01L29/78
    • H01L29/4958H01L21/823828H01L27/092H01L29/4966
    • A semiconductor device and a method for forming the same are provided to reduce an optimum time delay value by reducing an ion implantation process and simplifying a manufacturing process. A first gate structure including a first insulating layer pattern(112), a first conductive layer pattern(114), and a first polysilicon layer pattern(116) doped with a first impurity of a first conductive type is formed on a first region of a substrate(100). A first source/drain(132) doped with a second impurity is formed on the first region of the substrate. A second gate structure including a second insulating layer pattern(122), a second conductive layer pattern, and a second polysilicon layer pattern(126) doped with a third impurity of the same conductive type is formed on a second region of the substrate. A second source/drain(134) doped with a fourth impurity of an opposite conductive type to the second impurity is formed on a second region of the substrate.
    • 提供一种半导体器件及其形成方法,通过减少离子注入工艺并简化制造工艺来减少最佳时间延迟值。 包括第一绝缘层图案(112),第一导电层图案(114)和掺杂有第一导电类型的第一杂质的第一多晶硅层图案(116)的第一栅极结构形成在 基板(100)。 掺杂有第二杂质的第一源极/漏极(132)形成在衬底的第一区域上。 在衬底的第二区域上形成包括掺杂有相同导电类型的第三杂质的第二绝缘层图案(122),第二导电层图案和第二多晶硅层图案(126)的第二栅极结构。 在衬底的第二区域上形成掺杂有与第二杂质相反的导电类型的第四杂质的第二源极/漏极(134)。