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    • 3. 发明授权
    • 발광 다이오드 모듈
    • 发光二极管模块
    • KR100850312B1
    • 2008-08-04
    • KR1020070052256
    • 2007-05-29
    • 삼성전기주식회사
    • 오경섭이태홍이민상
    • H01L33/62
    • H01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00014
    • A light emitting diode module is provided to reduce contamination in a manufacturing process by forming electrode terminals and an electrode connection part with one body. A pair of lead terminals(111) are partially mounted in a package(110). The package includes a radiation window for radiating light. An LED chip(113) is mounted on the lead terminals in the inside of the package. An electrical connection unit(114) connects electrically the LED chip and the lead terminals to each other. The inside of the package is filled with a molding material(115). The LED chip and the electrical connection unit are protected by using the molding material. An LED module includes two or more LED packages. Lead terminals having the same polarity of the LED package have flexibility. An electrode connection part(120) and the lead terminals are formed with one body.
    • 提供一种发光二极管模块,用于通过将一个电极端子和一个电极连接部分形成一体来减少制造过程中的污染。 一对引线端子(111)部分地安装在封装(110)中。 该包装包括用于照射光的辐射窗口。 LED芯片(113)安装在封装内部的引线端子上。 电连接单元(114)将LED芯片和引线端子彼此电连接。 包装件的内部填充有成型材料(115)。 LED芯片和电连接单元通过使用模制材料进行保护。 LED模块包括两个或更多个LED封装。 具有与LED封装相同极性的引线端子具有灵活性。 电极连接部分(120)和引线端子形成有一个主体。
    • 4. 发明公开
    • LED 광원모듈
    • 发光二极管光源模块
    • KR1020080083406A
    • 2008-09-18
    • KR1020070023888
    • 2007-03-12
    • 삼성전기주식회사
    • 오경섭김병만민경익정명식김창욱이태홍이민상
    • H01L33/00
    • An LED(Light Emitting Diode) light source module is provided to extend lifespan of an LED light source by dividedly forming a metal layer in an LED module unit and a circuit module unit on a rear surface of a PCB(Printed Circuit Board). An LED light source module(100) includes a PCB(110), LED modules(120), and circuit modules(130,140). An LED module unit(150a) and a circuit module unit(150b) are defined on the PCB. The PCB has electrodes of circuit patterns on an upper surface and a metal layer(150) insulated from the electrodes on a rear surface. The LED modules are formed in the LED module unit on the PCB and have terminal units electrically connected to the electrodes. The circuit modules are formed in the circuit module unit on the PCB and electrically connected to the LED modules through the circuit patterns to drive the LED modules.
    • 提供LED(发光二极管)光源模块,以通过在LED模块单元中分开形成金属层和PCB(印刷电路板)的后表面上的电路模块单元来延长LED光源的寿命。 LED光源模块(100)包括PCB(110),LED模块(120)和电路模块(130,140)。 LED模块单元(150a)和电路模块单元(150b)被定义在PCB上。 PCB具有在上表面上的电路图案的电极和与后表面上的电极绝缘的金属层(150)。 LED模块形成在PCB上的LED模块单元中,并且具有电连接到电极的端子单元。 电路模块形成在PCB上的电路模块单元中,并通过电路图案与LED模块电连接以驱动LED模块。
    • 6. 发明授权
    • 발광 다이오드 모듈 어레이
    • 发光二极管模块阵列
    • KR100850781B1
    • 2008-08-06
    • KR1020070052259
    • 2007-05-29
    • 삼성전기주식회사
    • 이태홍이민상오경섭
    • H01L33/00
    • A light emitting diode module array is provided to increase easily the number of unit LED modules according to the number of cavities of an extended frame by inserting the unit LED modules into the cavities. An extended frame(110) includes a plurality cavities for receiving a plurality of unit LED modules, a first opening for radiating light to one direction of the cavities, and a second opening for applying electric power to the other direction of the cavities. A unit LED module(120) is inserted and fixed into the cavities of the extended frame. A power supply unit supplies the electric power to the unit LED module through the second opening of the extended frame. The extended frame includes a fixing part for fixing the unit LED module into the cavities of the extended frame.
    • 提供发光二极管模块阵列,通过将单元LED模块插入空腔中,根据扩展框架的空腔数量容易地增加单元LED模块的数量。 延伸框架(110)包括用于接收多个单元LED模块的多个空腔,用于向空腔的一个方向辐射光的第一开口和用于向空腔的另一个方向施加电力的第二开口。 单元LED模块(120)插入并固定到扩展框架的空腔中。 电源单元通过延伸框架的第二开口向单元LED模块提供电力。 延伸框架包括用于将单元LED模块固定到延伸框架的空腔中的固定部件。