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1. 发明公开

KR1020040058419A 휴대폰용 리지드 플렉시블 인쇄회로기판 및 이의 제조방법 有权
标题翻译：用于手持的刚性柔性PCB及其制造方法
公开(公告)号：KR1020040058419A
公开(公告)日：2004-07-05
申请号：KR1020020084352
申请日：2002-12-26
申请人： 삼성전기주식회사
发明人： 임경환 , 조영상 , 이양제 , 임규혁 , 이봉재 , 조형주 , 양덕진
IPC分类号： H05K3/46
CPC分类号： H05K3/4691 , H05K3/28 , H05K3/4652
摘要： PURPOSE: A rigid flexible PCB for handheld and a method for manufacturing the same are provided to achieve a small size mobile phone and reduce a manufacturing cost by using a rigid flexible PCB. CONSTITUTION: A method for manufacturing a rigid flexible PCB comprises a step of providing two single side CCLs(221a,221b), a step of forming an inner layer circuit(222) on the CCLs, a step of forming a flexible part(220) by stacking a cover lay(223) on the substrate on which the inner layer circuit is formed, a step of stacking a prepreg(242) at a predetermined location except the center portion of the flexible part, and a step of forming a rigid part(240,260) by performing a plating on the prepreg and forming a circuit.
摘要翻译：目的：提供用于手持设备的刚性柔性PCB及其制造方法，以实现小尺寸移动电话，并通过使用刚性柔性PCB来降低制造成本。构成：用于制造刚性柔性PCB的方法包括提供两个单侧CCL（221a，221b）的步骤，在CCL上形成内层电路（222）的步骤，形成柔性部件（220）的步骤，通过在其上形成有内层电路的基板上堆叠盖板（223），在除了柔性部件的中心部分之外的预定位置处堆叠预浸料坯（242）的步骤，以及形成刚性部件（240,260），通过对预浸料进行电镀并形成电路。

2. 发明公开

KR1020040058418A 휴대폰용 리지드 플렉시블 인쇄회로기판의 제조방법 无效
标题翻译：用于制造用于手持电话的刚性柔性PCB的方法
公开(公告)号：KR1020040058418A
公开(公告)日：2004-07-05
申请号：KR1020020084350
申请日：2002-12-26
申请人： 삼성전기주식회사
发明人： 임경환 , 조영상 , 조형주 , 임규혁 , 이봉재 , 양덕진 , 이양제
IPC分类号： H05K3/38
CPC分类号： H05K3/4691 , H05K1/0393 , H05K3/28 , H05K2201/05
摘要： PURPOSE: A method for manufacturing rigid flexible PCB for handheld phone is provided to improve reliability of electrical connecting part and a through-hole in case of a whole surface depositing when adhering a cover lay. CONSTITUTION: A method for manufacturing rigid flexible PCB comprises the steps of providing a core material of a flexible part; forming an inner layer circuit(222) on the core material; forming a through-hole(248) at a predetermined position of the PCB; providing a cover lay(223) of the flexible part; removing only the region on which the through-hole is to be formed in the cover lay; forming the flexible part by stacking the cover lay on the core substrate having the through-hole; stacking a prepreg(242) at a predetermined location except the center portion of the flexible part; and forming a rigid part by performing a plating on the prepreg and forming a circuit.
摘要翻译：目的：提供一种用于制造手持电话的刚性柔性PCB的方法，用于在粘贴覆盖层时，在整个表面沉积的情况下，提高电连接部分和通孔的可靠性。构成：用于制造刚性柔性PCB的方法包括以下步骤：提供柔性部件的芯材; 在芯材上形成内层电路（222）; 在PCB的预定位置处形成通孔（248）; 提供柔性部件的覆盖层（223）; 在盖板上仅去除要形成通孔的区域; 通过将盖层叠在具有通孔的芯基板上来形成柔性部件; 在除柔性部分的中心部分之外的预定位置处堆叠预浸料（242）; 并通过对预浸料进行电镀并形成电路来形成刚性部分。

3. 发明公开

KR1020160078187A 인쇄회로기판 审中-实审
标题翻译：印刷电路板
公开(公告)号：KR1020160078187A
公开(公告)日：2016-07-04
申请号：KR1020140189113
申请日：2014-12-24
申请人： 삼성전기주식회사
发明人： 조현철 , 이봉재
IPC分类号： H05K1/02
CPC分类号： H05K1/02 , H05K1/0201 , H05K1/0203
摘要： 본발명은절연층; 상기절연층을관통하며, 동일절연층내에서서로이격되게배치된제 1 방열비아; 및상기절연층을관통하며, 동일절연층내에서서로중첩되는제 2 방열비아;를포함하는인쇄회로기판에관한것이다.
摘要翻译：本发明涉及一种印刷电路板，包括：绝缘层; 穿过所述绝缘层并且设置成与所述绝缘层内部的所述绝缘层分离的第一辐射通孔; 以及穿过绝缘层并与绝缘层内的绝缘层重叠的第二辐射通路。因此，印刷电路板可以具有改进的辐射功能。

4. 发明授权

KR100467844B1 휴대폰용 리지드 플렉시블 인쇄회로기판 및 이의 제조방법 有权
标题翻译： 휴대폰용리지드플렉시블인쇄회로기판및이의제조방휴
公开(公告)号：KR100467844B1
公开(公告)日：2005-01-25
申请号：KR1020020084352
申请日：2002-12-26
申请人： 삼성전기주식회사
发明人： 임경환 , 조영상 , 이양제 , 임규혁 , 이봉재 , 조형주 , 양덕진
IPC分类号： H05K3/46
摘要： PURPOSE: A rigid flexible PCB for handheld and a method for manufacturing the same are provided to achieve a small size mobile phone and reduce a manufacturing cost by using a rigid flexible PCB. CONSTITUTION: A method for manufacturing a rigid flexible PCB comprises a step of providing two single side CCLs(221a,221b), a step of forming an inner layer circuit(222) on the CCLs, a step of forming a flexible part(220) by stacking a cover lay(223) on the substrate on which the inner layer circuit is formed, a step of stacking a prepreg(242) at a predetermined location except the center portion of the flexible part, and a step of forming a rigid part(240,260) by performing a plating on the prepreg and forming a circuit.
摘要翻译：目的：提供一种用于手持设备的刚性柔性PCB及其制造方法，以实现小尺寸移动电话并通过使用刚性柔性PCB降低制造成本。用于制造刚性柔性PCB的方法包括提供两个单侧CCL（221a，221b）的步骤，在CCL上形成内层电路（222）的步骤，形成柔性部分（220）的步骤，通过在其上形成有内层电路的基板上层叠覆盖层（223），在除了挠性部分的中心部分之外的预定位置堆叠预浸料坯（242）的步骤以及形成刚性部分（240,260）通过对预浸料坯进行电镀并形成电路。

5. 发明公开

KR1020030080546A 다층 인쇄회로기판의 제조방법 无效
标题翻译：制造多层PCB的方法
公开(公告)号：KR1020030080546A
公开(公告)日：2003-10-17
申请号：KR1020020019234
申请日：2002-04-09
申请人： 삼성전기주식회사
发明人： 유재수 , 이병호 , 김굉식 , 안동기 , 이봉재 , 박건섭 , 안석준 , 양덕진
IPC分类号： H05K3/46
CPC分类号： H05K3/4602 , H05K3/381 , H05K3/386 , H05K2203/0307
摘要： PURPOSE: A method for fabricating a multi-layered PCB(Printed Circuit Board) is provided to remove a post-process and simplify a total process by performing a preprocess for a core member by means of a stiffening agent. CONSTITUTION: A stiffening agent is coated on a surface of a copper substrate to form the surface roughness and an organic layer. A pattern etching process is performed on the surface of the copper substrate including the surface roughness and the organic layer. The first cleaning process is performed to remove alien substances from the surface of the copper substrate. The second cleaning process is performed to remove the acid solution from the surface of the copper substrate. A dry process is performed to remove the moisture from the surface of the copper substrate. A stacking process is performed to adhere substrates to each other.
摘要翻译：目的：提供一种用于制造多层PCB（印刷电路板）的方法以通过借助于硬化剂对芯构件进行预处理来去除后处理并简化总体工艺。构成：在铜基材的表面上涂布硬化剂以形成表面粗糙度和有机层。在包括表面粗糙度和有机层的铜基板的表面上进行图案蚀刻处理。执行第一清洗处理以从铜基板的表面去除异物。进行第二清洗处理以从铜基板的表面除去酸溶液。执行干法以从铜基材的表面除去水分。进行堆叠处理以使基板彼此粘合。

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