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    • 1. 发明公开
    • 도금장치
    • 电镀设备
    • KR1020130039834A
    • 2013-04-23
    • KR1020110104441
    • 2011-10-13
    • 삼성전기주식회사
    • 유달현한봉환라종성유선중채성병
    • C25D17/00C25D17/02C25D17/10
    • C25D17/00C25D17/02C25D17/10
    • PURPOSE: A plating device is provided to form a plating layer with a constant thickness to surface of a plated material by preventing current from concentrating to the plated material through additionally installing a shield plate covering anode. CONSTITUTION: A plating device(100) comprises a plating bath(110), a plurality of anodes(120), a first shield plate(130), and a second shield plate(140). The plurality of anodes is arranged to face with one surface of a plurality of plated materials or both sides. The first shield plate is arranged between the plated material and the anode. The second shield plate comprises a first part and a second part which is vertically connected to the first part. The first part is located between the first shield plate and the anode and the second part is arranged to face with the end of the anode.
    • 目的:提供电镀装置,通过另外安装覆盖阳极的屏蔽板,通过防止电流集中到电镀材料,形成具有恒定的镀层厚度的镀层。 构成:电镀装置(100)包括镀浴(110),多个阳极(120),第一屏蔽板(130)和第二屏蔽板(140)。 多个阳极被布置为面对多个电镀材料的一个表面或两侧。 第一屏蔽板布置在电镀材料和阳极之间。 第二屏蔽板包括垂直连接到第一部分的第一部分和第二部分。 第一部分位于第一屏蔽板和阳极之间,第二部分布置成与阳极的端部相对。
    • 2. 发明公开
    • 인쇄회로기판 도금 장치
    • 印刷电路板的镀层装置
    • KR1020120026858A
    • 2012-03-20
    • KR1020100089026
    • 2010-09-10
    • 삼성전기주식회사
    • 유달현오세민최봉규
    • H05K3/18C25D5/08
    • PURPOSE: An apparatus for plating a printed circuit board is provided to plate the whole of a substrate by forming a strip line flowing through the whole of the substrate. CONSTITUTION: First emission units(10,20,30) are arranged in a down corner of a plating bath(100). A first guide(201) is formed at a location separated from a spray direction of the first emission unit at a predetermined interval. Second emission units(40,50,60) are formed in a lower central part of the plating bath. A second guide(202) is formed in the down corner. Plating liquid sprayed in the first emission unit and the second emission unit passes by a surface of the substrate along an inner wall of the substrate with the first guide and the second guide.
    • 目的:提供一种电镀印刷电路板的装置,通过形成流过整个基板的带状线来平板整个基板。 构成:第一个发射单元(10,20,30)布置在镀浴(100)的下角。 第一引导件(201)以预定间隔形成在与第一发射单元的喷射方向分开的位置处。 第二发射单元(40,50,60)形成在电镀浴的下部中央部分。 在下角形成第二引导件(202)。 通过第一引导件和第二引导件,喷射在第一发射单元和第二发射单元中的电镀液体沿着衬底的内壁经过衬底的表面。
    • 4. 发明授权
    • 무전해 도금장치 및 무전해 도금방법
    • 电镀镀层的装置和方法
    • KR100846318B1
    • 2008-07-15
    • KR1020070009517
    • 2007-01-30
    • 삼성전기주식회사
    • 유달현김용석윤희수김희수이성재
    • C23C18/16C23C18/54
    • An apparatus and a method for electroless plating are provided to uniformize plating conditions and improve reliability of a coating layer by positioning a heat exchanger on a bottom part of a plating pot and allowing the spray direction of a plating solution to face the heat exchanger. An apparatus for electroless plating comprises: a plating pot(110); a heat exchanger(140) disposed adjacently to a bottom face of the plating pot; a supply part(130) disposed adjacently to the heat exchanger to supply a plating solution to the heat exchanger; and baskets(120a,120b) disposed within the plating pot to contain coating objects. The apparatus further comprises a circulating part for supplying a plating solution supplied into the plating pot to the supply part again. The supply part is disposed adjacently to an one end portion of the heat exchanger. The heat exchanger is formed in a plate shape, and a plating solution supplied from the supply part moves along a face of the heat exchanger. The supply part includes a plurality of nozzle parts(131a,132a). The heat exchanger is formed in a plate shape, and the supply part includes a first nozzle part(131) disposed adjacently to a top face of the heat exchanger, and a second nozzle part(132) disposed adjacently to a bottom face of the heat exchanger, wherein a plating solution supplied from the first nozzle part moves along a top face of the heat exchanger while a plating solution supplied from the second nozzle part moves along a bottom face of the heat exchanger.
    • 提供一种用于化学镀的装置和方法,以通过将热交换器放置在电镀槽的底部并允许电镀液的喷射方向面对热交换器来使电镀条件均匀化并提高涂层的可靠性。 一种用于化学镀的设备包括:电镀锅(110); 与所述电镀锅的底面相邻设置的热交换器(140); 与所述热交换器相邻设置的供应部件(130),以向所述热交换器供应电镀液; 和设置在电镀罐内的筐(120a,120b)以容纳涂覆物体。 该设备还包括循环部分,用于再次将供应到电镀罐中的镀液提供给供应部分。 供应部分设置成与热交换器的一个端部相邻。 热交换器形成为板状,从供给部供给的电镀液沿热交换器的表面移动。 供给部包括多个喷嘴部(131a,132a)。 热交换器形成为板状,供给部包括与热交换器的上表面相邻配置的第一喷嘴部(131)和与热的底面相邻配置的第二喷嘴部(132) 交换器,其中从所述第一喷嘴部供给的镀液沿着所述热交换器的顶面移动,同时从所述第二喷嘴部供给的镀液沿着所述热交换器的底面移动。
    • 5. 发明授权
    • 유체 제어 장치
    • 流体控制装置
    • KR100679071B1
    • 2007-02-05
    • KR1020050056153
    • 2005-06-28
    • 삼성전기주식회사
    • 김창성양시영유달현지수영임철택
    • G05D7/01
    • 본 발명은 유체 제어 장치에 관한 것으로, 보다 상세하게는 유체관에 포함된 전극에 양(+) 또는 음(-)의 전압을 가하여 전기적 성질을 띠는 유체와의 전기적 인력 또는 척력에 의한 유체 저항의 가감을 이용하여 유체를 전달하고 정밀하게 제어하는 장치에 관한 것이다. 초소형의 유로 내의 유체의 흐름을 제어하는 유체 제어 장치에 있어서, 전기적 성질을 가지는 유체가 흐르는 유로와, 상기 유로 벽면의 소정 지점에 위치하는 전극을 포함하는 유체관, 상기 유체의 특성을 측정하는 측정부, 상기 유체관의 전극에 소정량의 전하를 인가하는 전하 인가 장치 및 상기 측정부에서 측정된 유체의 특성에 따라, 상기 유체관 내의 유체가 소정 속도로 이동하도록 하는 전하량을 결정하여 상기 전하 인가 장치를 제어하는 제어부를 포함하되, 상기 전극에 인가되는 전하량에 따라 전기적 성질을 가지는 상기 유체와 상기 유체관 간의 마찰 저항을 조절하여 유체의 흐름을 유도 및 제어하는 유체 제어 장치에 관한 것이다.
      유체, 흐름, 제어, 전하, 척력, 인력
    • 6. 发明授权
    • 교반부재 및 이를 이용한 교반기
    • 교반부재및이를이용한교반기
    • KR100675218B1
    • 2007-01-29
    • KR1020050072236
    • 2005-08-08
    • 삼성전기주식회사
    • 유달현나은상최연규양시영
    • B01F7/18B01F7/26
    • An agitating member and an agitator using the same are provided to supply impact force, dispersion force, and shear force at the same time, to effectively disperse media even at the low RPM(Revolution Per Minute), and to make the surface of ceramic powder smooth. The agitating member(32) formed in plural stages at an agitating shaft(31) rotating in an agitating tank(20) is composed of a plurality of rod pins(321) and a disc(322) for connecting plural rod pins. The disc is separated by a slit(323). The disc is thinner than the rod pin. The agitator(10) comprises the agitating tank filled with bead-type dispersion media; an agitating unit(30) agitating the slurry type material poured into the agitating tank and comprising the agitating shaft installed in the agitating tank and the agitating member; and a centrifugal separating unit(40) combined to the agitating unit to centrifugally separate the bead-type dispersion media from the slurry type material and to discharge the slurry type material out of the agitating tank.
    • 提供一种搅拌部件和使用该搅拌部件的搅拌器,以同时提供冲击力,分散力和剪切力,即使在低RPM(每分钟转数)下也有效地分散介质,并且使陶瓷粉末的表面 光滑。 在搅拌槽(20)内旋转的搅拌轴(31)上形成多级的搅拌构件(32)由多个杆销(321)和用于连接多个杆销的盘(322)组成。 光盘由狭缝(323)分开。 碟片比杆销更薄。 搅拌器(10)包括填充有珠状分散介质的搅拌罐; 搅拌单元(30),其搅拌注入到搅拌罐中的浆料型材料并且包括安装在搅拌罐和搅拌部件中的搅拌轴; 和结合到搅拌单元的离心分离单元(40),以将浆液型分散介质与浆液型材料离心分离并将浆液型材料排出搅拌罐。
    • 7. 发明授权
    • 기판과 기판 반송용 트레이 반송장치 및 반송방법
    • 用于传输基板和托盘以传输基板的装置和方法
    • KR101433516B1
    • 2014-08-27
    • KR1020130030914
    • 2013-03-22
    • (주)에스티아이삼성전기주식회사
    • 김동일이명우한규용최갑수황현덕유달현박우철이훈조
    • H01L21/677B65G49/06
    • H01L21/68707H01L21/67028H01L21/67346H01L21/67715H01L21/67736B65G49/06
    • The present invention is to provide a device and a method of transferring substrates and trays for transferring substrates capable of rapidly, accurately, and stably performing the continuous processing of substrates by continuously transferring trays for transferring substrates at high speed and precision in a clean state. The device comprises a loader part (200) to which the substrates and the trays (10) for storing the substrates are entered by a substrate loading device (100); a loader part lifting/lowering part (300) having a loader part lifter (330) lifted along a guide rail (310) arranged in one side of the loader part (200) to transfer the trays (10) to the loader part (200); a substrate processing part (400) for performing a substrate processing process while the trays in which the substrates are stored are transferred; an unloader part (500) for discharging the substrates separated from the trays (10) in which the substrates passing the substrate processing part (400) are stored; an unloader part lifting/lowering part (600) having an unloader part lifter (630) lifted along a guide rail (610) arranged in one side of the unloader part (500) to move the trays (10) separated from the substrates to the upper part of the guide rail (610); and a return part (700) for returning the trays (10) from the unloader part lifting/lowering part (600) to the loader part lifting/lowering part (300).
    • 本发明是提供一种转印基板和托盘的装置和方法,该基板和托盘能够通过在清洁状态下以高速和精确的方式连续地转印用于传送基板的托盘,从而快速,准确和稳定地执行基板的连续加工。 装置包括装载部分(200),用于存储基板的基板和托盘(10)通过基板装载装置(100)进入其中; 具有装载部件升降器(330)的装载部分升降部件(300),其沿着布置在装载部件(200)一侧的导轨(310)提升,以将托盘(10)转移到装载部件(200) ); 用于在存储基板的托盘的同时进行基板处理工序的基板处理部(400); 用于排出从通过基板处理部分(400)的基板的托盘(10)分离的基板的卸载部分(500); 具有设置在卸载器部件(500)的一侧的导轨(610)提升的卸载部件升降器(630)的卸载部件升降部件(600),以将从基板分离的托盘(10)移动到 导轨的上部(610); 以及用于将托盘(10)从卸载部升降部(600)返回到装载部升降部(300)的返回部(700)。
    • 9. 发明公开
    • 교반기를 구비한 도금 장치
    • 涂装设备
    • KR1020120127569A
    • 2012-11-22
    • KR1020120127486
    • 2012-11-12
    • 삼성전기주식회사
    • 유달현오세민최봉규
    • B01F7/22C25D21/10C25D17/00
    • PURPOSE: A plating device including stirrers is provided to enhance the plating process efficiency by enhancing the agitation efficiency of plating solution. CONSTITUTION: A plating device including stirrers comprises a plating process unit(20) and a plating solution stirring unit(10). The plating process unit performs the plating process. The plating solution stirring unit agitates the plating solution(101) and supplies the agitated plating solution to the plating processing unit. The plating solution agitating unit comprises a storage vessel(110), a plating solution feeding line(150), a rotary shaft(130), and an impeller structure(140). The storage vessel stores the plating solution. The plating solution feeding line supplies the plating solution from the storage vessel to the plating process unit.
    • 目的:提供包括搅拌器的电镀装置,通过提高电镀液的搅拌效率来提高电镀工艺的效率。 构成:包括搅拌器的电镀装置包括电镀处理单元(20)和电镀液搅拌单元(10)。 电镀处理单元进行电镀处理。 电镀溶液搅拌单元搅拌电镀液(101),并将搅拌的电镀液供给电镀处理单元。 电镀溶液搅拌单元包括储存容器(110),电镀液供给管线(150),旋转轴(130)和叶轮结构(140)。 储存容器存储电镀溶液。 电镀液供给线将电镀液从储存容器供给到电镀处理单元。