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    • 2. 发明公开
    • 전자 선반 레이블 태그
    • 电子保险杠标签
    • KR1020130054713A
    • 2013-05-27
    • KR1020110120267
    • 2011-11-17
    • 삼성전기주식회사
    • 남궁용길서정식이재찬
    • G06K19/07
    • G06K19/07707G06K19/0775G06K2017/0083G06Q20/203
    • PURPOSE: An ESL(Electronic Shelf Label) tag is provided to make an antenna touch the upper side or the lower side of a main board, thereby reducing the size of the ESL tag up to the space of the antenna. CONSTITUTION: A main board(220) comprises a communication module(210) which transmits and receives information for a product through a server and wireless communication. A display unit displays product information which is received from the server. A holder antenna includes a protrusion in one end and is connected to the main board through a wire. The holder antenna is an inverse F antenna. One end of a short axis of the inverse F antenna is connected to an antenna connection unit of the main board through a second wire and is operated as an electric supply unit. The other end of a long axis of the inverse F antenna is connected to the antenna connection unit of the main board through a first wire and is operated as the ground. [Reference numerals] (210) Communication module
    • 目的:提供ESL(电子标签)标签,以使天线接触主板的上侧或下侧,从而将ESL标签的尺寸减小到天线的空间。 构成:主板(220)包括通过服务器和无线通信发送和接收产品的信息的通信模块(210)。 显示单元显示从服务器接收的商品信息。 支架天线包括在一端的突起,并且通过导线连接到主板。 支架天线是反F天线。 逆F天线的短轴的一端通过第二线连接到主板的天线连接单元,并作为电源单元进行操作。 逆F天线的长轴的另一端通过第一线连接到主板的天线连接单元,并作为地面操作。 (附图标记)(210)通信模块
    • 3. 发明授权
    • 칩 안테나
    • 芯片天线
    • KR100867507B1
    • 2008-11-07
    • KR1020070070046
    • 2007-07-12
    • 삼성전기주식회사
    • 한창목장기원이득우이대규서정식박현도
    • H01Q13/08H01Q1/24
    • H01Q1/38H01Q9/0407
    • A chip antenna is provided to obtain a broadband frequency characteristic and a standing wave ratio of the antenna in a specific frequency band. A dielectric block(11) has an upper side(11a) and a lower part(11b) to face each other and has the rectangular parallelepiped which includes a plurality of sides connecting the upper side and the lower side. A first conductor pattern(12) is connected to an external feeding unit and is formed in one side of the dielectric block. A second conductor pattern(13) is formed in one side of the dielectric block at least in order to be connected to the first conductor pattern, and one end of the second conductor pattern is connected to the external ground unit. A third conductor pattern(14) is formed in the lower part of the dielectric block, and is separated from the first and second conductor patterns with a fixed interval. The third conductor pattern is capacitively coupled to the first and second conductor patterns and one end of the third conductor pattern is connected to the external ground part. The first conductor pattern and the second conductor pattern comprises one radiator. The radiator is installed in a first side in parallel with the longitudinal direction of the dielectric block and a second side opposite to the first side and the upper side.
    • 提供了一种芯片天线以获得特定频带中的天线的宽带频率特性和驻波比。 介质块(11)具有彼此面对的上侧(11a)和下部(11b),并且具有包括连接上侧和下侧的多个侧面的长方体。 第一导体图案(12)连接到外部馈电单元并且形成在介质块的一侧中。 至少为了连接到第一导体图形,在介质块的一侧形成第二导体图案(13),并且第二导体图案的一端连接到外部接地单元。 第三导体图案(14)形成在介质块的下部,并且以固定的间隔与第一和第二导体图案分离。 第三导体图案电容耦合到第一和第二导体图案,并且第三导体图案的一端连接到外部接地部分。 第一导体图案和第二导体图案包括一个散热器。 散热器安装在与介质块的纵向方向平行的第一侧和与第一侧和上侧相对的第二侧。
    • 4. 发明授权
    • 이동통신 단말기
    • 移动通信终端
    • KR100862493B1
    • 2008-10-08
    • KR1020080060255
    • 2008-06-25
    • 삼성전기주식회사
    • 한창목장기원이득우이대규서정식박현도
    • H01Q13/08H01Q1/24H04B1/38
    • H01Q1/243H01Q1/2283H01Q1/38H04M1/0202
    • A mobile communication terminal is provided to obtain a substrate with a ground pattern tuning resonance frequency when an antenna is set thereon. A mobile communication terminal includes a chip antenna and a printed circuit board. The chip antenna includes dielectric block(11), a first conductor pattern(12), a second conductor pattern(13), and a third conductor pattern(14). The dielectric block is hexahedral in shape. The first conductor pattern is formed on a side of the dielectric block and is connected to a feeding line. The second conductor pattern is formed on another side of the dielectric block and is connected to the first conductor pattern and a ground. The third conductor pattern is formed on another side of the dielectric block, has gaps from the first and second conductor patterns, and is connected to the ground. The printed circuit board has a chip antenna formed thereon and includes a tuning ground pattern connected to the ground for tuning frequency properties of the chip antenna.
    • 当设置天线时,提供移动通信终端以获得具有接地模式调谐共振频率的基板。 移动通信终端包括芯片天线和印刷电路板。 芯片天线包括介质块(11),第一导体图案(12),第二导体图案(13)和第三导体图案(14)。 介质块的形状为六面体。 第一导体图案形成在介质块的一侧并连接到馈电线。 第二导体图案形成在介质块的另一侧上并且连接到第一导体图案和地。 第三导体图案形成在介质块的另一侧上,具有与第一和第二导体图案的间隙,并且连接到地面。 印刷电路板具有形成在其上的芯片天线,并且包括连接到地面的调谐接地图案,用于调谐芯片天线的频率特性。
    • 5. 发明授权
    • 역F 안테나 및 이를 장착한 이동통신 단말기
    • 역F안테나및이를장착한이동통신단말기
    • KR100691631B1
    • 2007-03-12
    • KR1020060040486
    • 2006-05-04
    • 삼성전기주식회사
    • 장기원이득우서정식
    • H01Q9/04H01Q1/24
    • An inverse F antenna and a mobile terminal having the same are provided to minimize a mounting area of an antenna and an interference due to a peripheral metallic device. An inverse F antenna includes a flexible substrate(32), a radiating plate(34), and a signal line(31). The radiating plate(34) is formed on the flexible substrate(32). A signal line(31) is formed on the flexible substrate(32), and has a first terminal(31c) connected to the radiating plate(34) and a second terminal(33) extended from the first terminal(31c) and provided as a connection terminal for feeding and grounding.
    • 提供倒F型天线和具有该倒F型天线的移动终端,以最小化天线的安装面积和由于外围金属装置引起的干扰。 反F天线包括柔性基板(32),辐射板(34)和信号线(31)。 散热板(34)形成在柔性基板(32)上。 信号线(31)形成在柔性基板(32)上,并具有连接到散热板(34)的第一端子(31c)和从第一端子(31c)延伸并设置为 用于馈电和接地的连接端子。
    • 6. 发明公开
    • 지상파 DMB용 칩 안테나
    • 地面数字多媒体地球天线广播天线
    • KR1020050111265A
    • 2005-11-24
    • KR1020040036502
    • 2004-05-21
    • 삼성전기주식회사
    • 김현학김철호도기태박일환서정식
    • H01Q13/08
    • H01Q1/2283H01Q1/22H01Q1/362H01Q1/38H01Q21/30
    • 본 발명은 LTCC 공정을 이용하여 안테나를 칩 형태로 소형화시키고, 전류분포의 다양한 분산구조를 이용하여 대역폭을 확대시킬 수 있는 지상파 DMB용 칩 안테나를 제공하는데 그 목적이 있다.
      본 발명의 칩 안테나는, XY 평면을 갖는 복수개의 유전체층이 Z축 방향으로 적층된 유전체 블록(100) 내부에, XZ평면의 Z축 방향으로 민더라인 구조를 갖는 도전성 패턴의 단위 적층 구조체(LYn)가 Y축 방향으로 복수개 배열되고, 서로 이웃하는 각각의 단위 적층 구조체와 Y축 방향으로 민더라인 구조로 연결된 적층 구조체(An)를 형성하고, 상기 적층 구조체(An)는 X축 방향으로 복수개 배열되어, 서로 이웃하는 각각의 적층 구조체와 X축 방향으로 민더라인 구조로 연결된 주 안테나 소자(200); 및 상기 주 안테나 소자(200)의 상측 또는 하측의 유전체층에 T자형으로 형성되어, 상기 주 안테나 소자(200)의 하나의 단부에 도전성 비아홀을 통해 연결되어, 상기 주 안테나 소자(200)의 전류분포를 분산시켜 대역폭을 확대하는 보조 안테나 소자(300)를 포함하여 이루어진 것을 특징으로 한다.
    • 10. 发明授权
    • 칩 안테나 및 이를 포함하는 이동통신 단말기
    • 芯片天线和移动通信终端包括它
    • KR100799875B1
    • 2008-01-30
    • KR1020060115951
    • 2006-11-22
    • 삼성전기주식회사
    • 장기원서정식박현도성재석
    • H01Q1/38H01Q1/24
    • H01Q1/2283H01Q1/243H01Q9/42H05K1/0243H05K2201/10636Y02P70/611H04B1/3833
    • A chip antenna and a mobile-communication terminal including the same are provided to adjust a resonance frequency at the time of setting the chip antenna in the mobile-communication terminal. A chip antenna includes a dielectric block(11), a first conductive pattern(12), a second conductive pattern(13), and a third conductive pattern(14). The dielectric block has a top surface(11a) and a bottom surface(11b) which face each other and a plurality of side surfaces(11c,11d,11e,11f) for connecting the top surface and the bottom surface. The first conductive pattern is formed on at least one surface of the dielectric block and is connected to an external power feeding unit. The second conductive pattern is formed on at least one surface of the dielectric block and is separated from the first conductive pattern at a predetermined interval so as to serve as a radiation unit by coupling with the first conductive pattern. One end of the third conductive pattern is connected to an external ground part. A coupling capacitance between the first conductive pattern and the second conductive pattern is larger than a coupling capacitance between the first conductive pattern and the third conductive pattern.
    • 提供一种芯片天线和包括该芯片天线的移动通信终端,以在移动通信终端中设置芯片天线时调整谐振频率。 芯片天线包括介质块(11),第一导电图案(12),第二导电图案(13)和第三导电图案(14)。 介质块具有彼此面对的顶表面(11a)和底表面(11b)和用于连接顶表面和底表面的多个侧表面(11c,11d,11e,11f)。 第一导电图形形成在介质块的至少一个表面上并连接到外部供电单元。 第二导电图案形成在介质块的至少一个表面上,并以预定间隔与第一导电图案分离,以便通过与第一导电图案耦合而用作辐射单元。 第三导电图案的一端连接到外部接地部分。 第一导电图案和第二导电图案之间的耦合电容大于第一导电图案和第三导电图案之间的耦合电容。