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    • 1. 发明公开
    • 플라즈마 전자 온도의 측정 방법 및 장치
    • 等离子体电子温度测量方法和装置
    • KR1020090116779A
    • 2009-11-11
    • KR1020097018412
    • 2008-03-24
    • 미쯔이 죠센 가부시키가이샤
    • 타키자와카즈키
    • H01L21/205H01L21/3065H05H1/00
    • H05H1/0043G01J3/443H01J37/32926H01J37/32954H01J37/32972
    • A laser beam with a wavelength capable of pumping atoms of helium in the metastable state is directed to a produced plasma, and atoms in the metastable state are excited. Absorption amount information representing the amount of laser beam absorbed is acquired, and the density of atoms of helium in the metastable state in the plasma is computed from the absorption amount. The emissions of light from helium gas in the plasma caused by transition from two different excited states to the lower level are measured, and the ratio between the intensities of the emissions is determined. The electron temperature of the produced plasma is computed from the computed density of the atoms of helium gas in the metastable state and the computed emission intensity ratio. With this, the plasma electron temperature can be computed with a relatively high accuracy irrespective of the condition of the plasma atmosphere.
    • 具有能够在亚稳态的氦原子的波长的激光束被引导到产生的等离子体,并且激发亚稳态的原子。 获取表示吸收的激光束的量的吸收量信息,根据吸收量计算等离子体中的亚稳态的氦原子的密度。 测量从两个不同的激发态转换到较低的等离子体所产生的等离子体中氦气的光的发射,确定发射强度之间的比例。 所产生的等离子体的电子温度是从亚稳态中氦气原子的计算密度和计算出的发射强度比计算的。 由此,与等离子体气氛的条件无关地,可以以相对高的精度计算等离子体电子温度。
    • 4. 发明公开
    • 플라즈마 생성 장치 및 플라즈마 성막 장치
    • 等离子体生成装置和等离子体膜形成装置
    • KR1020090108730A
    • 2009-10-16
    • KR1020097018549
    • 2008-03-28
    • 미쯔이 죠센 가부시키가이샤
    • 모리야스나리타키자와카즈키
    • H05H1/46C23C16/505H01L21/205H01Q21/12
    • H01Q21/0006C23C16/509H01J37/32082H01J37/32183H01P5/12H01Q1/26H05H1/46
    • A plasma generating apparatus is provided with an impedance matching member, which is connected to a feed line that supplies an antenna element with a high frequency signal, and has variable characteristic parameters for impedance matching; a distribution wiring, which is arranged corresponding to the impedance matching member and connects the impedance matching member with at least two antenna elements; and a control section which changes at the same time impedance matching statuses of at least the two antenna elements connected to the impedance matching member through the distribution wiring by changing the characteristic parameters of the impedance member. Thus, the number of impedance matching devices is smaller than that of the antenna elements, and a mechanism relating to impedance matching is made relatively small.
    • 一种等离子体发生装置具有阻抗匹配部件,该阻抗匹配部件连接到向天线元件供给高频信号的馈电线,并且具有用于阻抗匹配的可变特性参数; 分配布线,其对应于所述阻抗匹配部件布置并将所述阻抗匹配部件与至少两个天线元件连接; 以及控制部,其通过改变阻抗部件的特性参数,通过分配配线同时改变与阻抗匹配部件连接的至少两个天线元件的阻抗匹配状态。 因此,阻抗匹配装置的数量小于天线元件的数量,并且与阻抗匹配有关的机构相对较小。
    • 8. 发明授权
    • 플라즈마 처리 장치
    • 等离子处理设备
    • KR101076674B1
    • 2011-10-26
    • KR1020097018413
    • 2008-03-26
    • 미쯔이 죠센 가부시키가이샤
    • 모리야스나리타치바나히로유키미야타케나오마사타키자와카즈키
    • H01L21/205C23C16/455H01L21/3065H05H1/46
    • H05H1/46C23C16/402C23C16/45519C23C16/505H01J37/3244H01J37/32495
    • 플라즈마처리장치는, 처리대상기판이배치되는기판스테이지와, 안테나어레이를이용하여플라즈마를생성하는플라즈마생성부와, 상기안테나어레이의상방(上方)에설치된복수의가스방사구를가지는가스방사판을구비하는가스방사부와, 상기가스방사판의복수의가스방사구의일부분으로부터상기기판스테이지의표면으로향하여방사하여상기안테나소자의표면을통하도록, 제1 원료가스를공급하는제1 가스공급부와, 상기가스방사판의복수의가스방사구의다른부분으로부터상기기판스테이지의표면으로향하여방사하여상기안테나소자의간극(間隙)을통하도록, 제2 원료가스를공급하는제2 가스공급부를가진다. 제1 원료가스는, 안테나소자에노출된경우, 부착물이생기지않거나, 또는제2 원료가스보다도부착량이적다. 이것에의하여, 성막(成膜) 속도를향상시키는것과함께, 파티클의발생을억제할수 있다.
    • 该等离子体处理装置具备:载置被处理基板的基板载置台,使用该天线阵列来生成等离子体的等离子体生成部,以及在该天线阵列的上方具有多个气体放出口的气体放射板 第一气体供应部分,用于通过从所述气体辐射板的多个气体辐射工具的一部分朝向所述基板台的表面辐射来通过所述天线元件的表面供应第一源气体; 以及第二气体供给部,其供给第二原料气体,以从气体辐射板的多个气体喷出口的另一部分朝向基板载台的表面照射,以通过天线元件的间隙。 当第一原料气体暴露于天线元件时,不形成沉积物,或沉积量小于第二原料气体的沉积量。 因此,可以提高沉积速度并且可以抑制颗粒的发生。
    • 10. 发明公开
    • 플라즈마 처리 장치
    • 等离子体加工设备
    • KR1020090117777A
    • 2009-11-12
    • KR1020097018413
    • 2008-03-26
    • 미쯔이 죠센 가부시키가이샤
    • 모리야스나리타치바나히로유키미야타케나오마사타키자와카즈키
    • H01L21/205C23C16/455H01L21/3065H05H1/46
    • H05H1/46C23C16/402C23C16/45519C23C16/505H01J37/3244H01J37/32495
    • A plasma processing apparatus is provided with a substrate stage whereupon a substrate to be processed is arranged; a plasma generating section for generating plasma by using an antenna array; a gas radiating section having a gas radiating plate which is arranged above the antenna array and has a plurality of gas radiating ports; a first gas supply section, which supplies the first material gas by radiating the gas from some of the gas radiating ports on the gas radiating plate toward the surface of the substrate stage so that the gas passes over the surface of the antenna element; and a second gas supply section, which supplies a second material gas by radiating the gas from other gas radiating ports among the gas radiating ports on the gas radiating plate toward the surface of the substrate stage so that the gas passes through a space between the antenna elements. When the first material gas is exposed to the antenna element, the first material gas does not generate an attaching material or generates a smaller quantity of the attaching material compared with a case where a second material gas is used. Thus, film forming speed can be improved and generation of particles can be suppressed.
    • 等离子体处理装置设置有基板台,其中布置有待处理的基板; 用于通过使用天线阵列产生等离子体的等离子体产生部分; 气体辐射部分,具有布置在天线阵列上方并具有多个气体辐射口的气体辐射板; 第一气体供给部,其通过从气体辐射板上的一些气体排出口朝向基板台的表面喷射气体来供给第一原料气体,使得气体越过天线元件的表面; 以及第二气体供给部,其通过从气体辐射板的气体喷出口中的其它气体喷出口向基板台的表面喷射气体来供给第二原料气体,使得气体通过天线 元素。 当第一材料气体暴露于天线元件时,与使用第二材料气体的情况相比,第一材料气体不产生附着材料或产生较少量的附着材料。 因此,可以提高成膜速度,并且可以抑制颗粒的产生。