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    • 2. 发明公开
    • 반도체 리소그래피를 위한 공중합체, 조성물 및 티올화합물
    • 用于SEMICONDUCTOR LITHOGRAPHY,COMPOSITION AND THIOL COMPOUND的共聚物
    • KR1020060126385A
    • 2006-12-07
    • KR1020060049737
    • 2006-06-02
    • 마루젠 세끼유가가꾸 가부시키가이샤
    • 이이지마미노루야마기시다카노리
    • G03F7/004
    • C07C323/17C07C2602/42C08F220/18C08F220/28G03F7/0397
    • Provided are a copolymer for semiconductor lithography preferably used in accurate processing using UV, X-ray, or electron beam, a composition comprising the copolymer, and a thiol compound forming the copolymer. The copolymer comprises at least (A) a repeating unit having a structure comprising alkali-soluble group protected with acid-dissociable, solution inhibitive group, and (B) a terminal structure represented by formula(F). In the formula(F), each X1 and X2 is independently hydrogen atom, halogen atom, or C1-C4 hydrocarbon group which may be substituted with halogen atom, each Y11 to Y14 is independently hydrogen atom, or ether bond formed between Y11 and Y12, or Y 13 and Y14 respectively, or C1-C2 hydrocarbon group, each Y21 to Y25 is independently hydrogen atom, or C1-C4 hydrocarbon group, and n is an integer of 0 or 1. The composition for semiconductor lithography comprises the copolymer and a radiation-sensitive acid generator. The thiol compound is represented by the formula F.
    • 提供一种用于半导体光刻的共聚物,优选用于使用UV,X射线或电子束的精确加工,包含该共聚物的组合物和形成该共聚物的硫醇化合物。 共聚物至少包含(A)具有由酸解离的溶液抑制基团保护的碱溶性基团的结构的重复单元和(B)由式(F)表示的末端结构。 式(F)中,X 1和X 2各自独立地为氢原子,卤素原子或可被卤原子取代的C 1〜C 4烃基,Y 11〜Y 14各自独立地为氢原子,Y 11和Y 12之间形成的醚键 或Y 13和Y 14或C 1 -C 2烃基,每个Y 21至Y 25独立地为氢原子或C 1 -C 4烃基,n为0或1的整数。半导体光刻用组合物包含共聚物和 辐射敏感的酸发生器。 硫醇化合物由式F表示。
    • 10. 发明公开
    • 레지스트용 중합체 용액 및 그 제조방법
    • 耐溶剂聚合物溶液及其制备方法
    • KR1020060107846A
    • 2006-10-16
    • KR1020067013865
    • 2004-12-10
    • 마루젠 세끼유가가꾸 가부시키가이샤
    • 야마기시다카노리바바히로미쯔
    • G03F7/039C08F6/10G03F7/26H01L21/027
    • G03F7/0392G03F7/0048G03F7/16G03F7/004
    • A resist polymer solution comprising a resist polymer containing a repeating unit decomposed by the action of an acid so as to be soluble in alkali and a repeating unit having a polar group, the resist polymer dissolved in a solvent for coating film formation, wherein the amount of impurities whose boiling point is not higher than that of the solvent for coating film formation is 1 mass% or less based on the resist polymer. Further, there is provided a process for producing a resist polymer solution, comprising the step (1) of re-dissolving a solid matter containing a resist polymer in a solvent for coating film formation (a) and/or a solvent (b) whose boiling point at atmospheric pressure is not higher than that of the solvent (a); and the impurity removing step (2) of distilling off the solvent (b) and/or any excess amount of solvent (a) in vacuum from the re-dissolution solution obtained in the step (1).
    • 一种抗蚀剂聚合物溶液,其包含抗蚀剂聚合物,所述抗蚀剂聚合物含有通过酸的作用而分解以便可溶于碱的重复单元和具有极性基团的重复单元,所述抗蚀剂聚合物溶解在用于涂膜形成的溶剂中, 的沸点不高于涂膜成膜用溶剂的杂质为1质量%以下。 另外,提供了一种抗蚀剂聚合物溶液的制造方法,其包括将含有抗蚀剂聚合物的固体成分重新溶解在涂膜成膜用溶剂(a)和/或溶剂(b)中的工序(1) 大气压下的沸点不高于溶剂(a)的沸点; 和从步骤(1)中得到的再溶解溶液中真空蒸出溶剂(b)和/或任何过量溶剂(a)的杂质去除步骤(2)。