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    • 1. 发明公开
    • 불휘발성 반도체 기억장치
    • 非易失性半导体存储器件
    • KR1020080008234A
    • 2008-01-23
    • KR1020070069245
    • 2007-07-10
    • 가부시끼가이샤 도시바
    • 히로시아카호리와카코다케우치아츠히로사토
    • H01L27/115H01L21/8247
    • H01L27/11521H01L21/28273H01L27/115H01L29/42336H01L27/2463
    • A non-volatile semiconductor memory device is provided to improve electrical reliability by suppressing a leakage current through an inter-electrode insulating layer. A plurality of memory elements are formed in a matrix pattern on a semiconductor substrate. A plurality of bit lines selectively come in contact with the memory elements in a column direction. A plurality of word lines come in contact with the memory elements in a row direction. Each of the memory elements includes a first gate insulating layer formed on the semiconductor substrate, a charge accumulation layer formed on the first gate insulating layer, a second gate insulating layer formed on the charge accumulation layer, and a control electrode formed on the second gate insulating layer. A ratio r/d is equal to and more than 0.5 where r is a radius of curvature of an upper corner part or surface roughness of the charge accumulation layer and d is an equivalent oxide thickness of the second gate insulating layer in a cross section along a direction vertical to the bit lines.
    • 提供一种非易失性半导体存储器件,通过抑制通过电极间绝缘层的漏电流来提高电可靠性。 在半导体衬底上以矩阵形式形成多个存储元件。 多个位线选择性地沿列方向与存储元件接触。 多个字线在行方向上与存储元件接触。 每个存储元件包括形成在半导体衬底上的第一栅极绝缘层,形成在第一栅极绝缘层上的电荷累积层,形成在电荷累积层上的第二栅极绝缘层,以及形成在第二栅极上的控制电极 绝缘层。 比率r / d等于大于0.5,其中r是上角部的曲率半径或电荷累积层的表面粗糙度,d是沿着截面的第二栅极绝缘层的等效氧化物厚度 垂直于位线的方向。