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    • 5. 发明公开
    • 전자소자 테스트를 위한 장치 및 방법
    • 用于测试电子设备的装置和方法
    • KR1020140104907A
    • 2014-08-29
    • KR1020140017969
    • 2014-02-17
    • 물티테스트 엘렉트로니쉐 지스테메 게엠베하
    • 피흘,프란쯔예저러,귄터헤르트코른,미햐엘
    • G01R31/26
    • G01R31/2891G01R31/2874
    • The invention relates to an apparatus for testing an electronic device (10), which includes a test head (2) coupled to at least one immovably mounted test socket (8), a positioning device (4) for positioning the electronic device (10) in testing position, and a lead-backer (5) attached to the positioning device (4) for supporting the electronic device (10) and pressing it against the test socket (8). According to the invention, a supply port (11, 13, 14, 15) for supplying a temperature control medium to a temperature control system (16, 17) of the lead-backer (5) is immovably mounted beside the test socket (8), and the temperature control system(16, 17) of the lead-backer (5) and the supply port (11, 13, 14, 15) communicate with each other when the electronic device (10) is in a testing position. Therefore, the temperature control medium flows from the temperature control system (16, 17) to the supply port (11, 13, 14, 15) of the lead-backer (5).
    • 本发明涉及一种用于测试电子设备(10)的设备,其包括耦合到至少一个不可移动安装的测试插座(8)的测试头(2),用于定位电子设备(10)的定位设备(4) 以及附接到所述定位装置(4)的用于支撑所述电子装置(10)并将其按压在所述测试插座(8)上的引导装置(5)。 根据本发明,用于向温度控制系统(16,17)供应温度控制介质的供应端口(11,13,14,15)不可移动地安装在测试插座(8)的旁边 ),并且当电子设备(10)处于测试位置时,引导器(5)和供给端口(11,13,14,15)的温度控制系统(16,17)彼此连通。 因此,温度控制介质从温度控制系统(16,17)流向引导器(5)的供给口(11,13,14,15)。