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    • 81. 发明公开
    • 반도체 집적회로
    • 半导体IC及其测试系统,特别提高了测试时间的准确性
    • KR1020040067773A
    • 2004-07-30
    • KR1020030034366
    • 2003-05-29
    • 가부시끼가이샤 르네사스 테크놀로지
    • 타니무라마사아키
    • G01R31/303
    • G11C29/50G01R31/31725G01R31/31905G01R31/31937G11C11/401G11C29/028G11C29/50012
    • PURPOSE: A semiconductor IC and a test system for testing an interface part of the same are provided to test the interface part with high accuracy of timing as well as a test system for performing such a test. CONSTITUTION: A semiconductor IC includes a pin part(8), internal circuit(2-6), an interface part(7), an expectation value generation circuit(11), a comparison circuit(12), and a waveform generation circuit(13). The pin part includes a plurality of pins. The interface part is used for producing operation signals for operating the internal circuits and outputting read data to the outside through the pin part. At a first test mode, the expectation value generation circuit generates an expectation value of the operation signal of the interface part according to a first test signal. At this time, the comparison circuit outputs a compared result between the operation signal and the expectation value of the operation signal. At a second mode, the waveform generation circuit supplies a second test signal to the interface part. At this time, the interface part outputs test output signals having the same waveform to the outside.
    • 目的:提供一种用于测试其接口部分的半导体IC和测试系统,以高精度定时测试接口部分以及用于执行此类测试的测试系统。 构成:半导体IC包括引脚部分(8),内部电路(2-6),接口部分(7),期望值产生电路(11),比较电路(12)和波形发生电路 13)。 销部分包括多个销。 接口部分用于产生用于操作内部电路的操作信号,并通过引脚部分向外部输出读取数据。 在第一测试模式下,期望值产生电路根据第一测试信号产生接口部分的操作信号的期望值。 此时,比较电路输出运算信号与运算信号的期望值之间的比较结果。 在第二模式下,波形发生电路向接口部提供第二测试信号。 此时,接口部向外部输出具有相同波形的测试输出信号。
    • 82. 发明公开
    • 공정 중의 칩 상의 변화를 용이하게 모니터링할 수 있는스피드 비닝 테스트 회로를 구비한 반도체 장치, 및 그테스트 방법
    • 具有用于监测制造工艺中的OCV(切片变化)的速度结合测试电路的半导体器件及其测试方法
    • KR1020040063428A
    • 2004-07-14
    • KR1020030000839
    • 2003-01-07
    • 삼성전자주식회사
    • 이회진
    • H01L21/822H01L27/04G01R31/26H01L21/66
    • G11C29/025G01R31/31718G01R31/31725G11C29/02G11C29/50012
    • PURPOSE: A semiconductor device having a speed binning test circuit for monitoring an OCV(On Chip Variation) in a fabrication process and a testing method thereof are provided to minimize a speed prediction error in chip operation by inserting a speed correlation circuit pattern into a peripheral boundary of a core block. CONSTITUTION: A semiconductor device having a speed binning test circuit for monitoring an OCV in a fabrication process includes a first speed correlation circuit, a second speed correlation circuit, a third speed correlation circuit, a fourth speed correlation circuit, and a plurality of pads. The first speed correlation circuit(120) is used for outputting the first delay signal for delaying a final delay signal. The second speed correlation circuit(130) is used for outputting the second delay signal for delaying the first delay signal. The third speed correlation circuit(140) is used for outputting the third delay signal for delaying the second delay signal. The fourth speed correlation circuit(150) is used for outputting the fourth delay signal for delaying the third delay signal. The pads(160) are connected to output terminals of unit delay circuits.
    • 目的:提供一种具有用于在制造过程中监视OCV(片上变化)的速度合并测试电路的半导体器件及其测试方法,以通过将速度相关电路图案插入外设来最小化芯片操作中的速度预测误差 核心块的边界。 构成:具有用于在制造工艺中监视OCV的速度合并测试电路的半导体器件包括第一速度相关电路,第二速度相关电路,第三速度相关电路,第四速度相关电路和多个焊盘。 第一速度相关电路(120)用于输出用于延迟最终延迟信号的第一延迟信号。 第二速度相关电路(130)用于输出用于延迟第一延迟信号的第二延迟信号。 第三速度相关电路(140)用于输出用于延迟第二延迟信号的第三延迟信号。 第四速度相关电路(150)用于输出用于延迟第三延迟信号的第四延迟信号。 焊盘(160)连接到单位延迟电路的输出端。
    • 85. 发明公开
    • 가변 클럭 오퍼레이션을 갖는 마이크로 프로세서
    • 具有可变时钟操作的微处理器
    • KR1020000026227A
    • 2000-05-15
    • KR1019980043680
    • 1998-10-19
    • 현대반도체 주식회사
    • 방대성
    • G06F15/76
    • G01R31/31725G01R31/31727G06F1/08
    • PURPOSE: A micro processor having a variable clock operation is provided to minimize a power consumption by maintaining a clock signal at a low level when a micro processor is at an idle state. CONSTITUTION: A critical path operation(CPO) is composed in an inner portion of a micro processor(20). An input clock of the micro processor(20) is connected to an output signal of a phased locked loop(PLL) circuit(22). An output signal of the micro processor(20) is inputted to a decis ion circuit(23). An output signal of the decis ion circuit(23) is inputted to a multiplexer(MUX) unit(24). An output signal of the MUX unit(24) is inputted to a control unit(25). An output signal of the control unit(25) is inputted to the PLL circuit(22). An operation speed of the micro processor(20) is determined by an input clock of the PLL circuit(22). Data with n bits is recorded in an external memory unit(26) and is provided to the control unit(25).
    • 目的:提供具有可变时钟操作的微处理器,以在微处理器处于空闲状态时将时钟信号保持在低电平来最小化功耗。 构成:关键路径操作(CPO)由微处理器(20)的内部组成。 微处理器(20)的输入时钟连接到相位锁定环(PLL)电路(22)的输出信号。 微处理器(20)的输出信号被输入到判定电路(23)。 决定电路(23)的输出信号被输入到多路复用器(MUX)单元(24)。 MUX单元(24)的输出信号被输入到控制单元(25)。 控制单元(25)的输出信号被输入到PLL电路(22)。 微处理器(20)的操作速度由PLL电路(22)的输入时钟决定。 具有n位的数据被记录在外部存储单元(26)中,并被提供给控制单元(25)。