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81. 发明公开

KR1020140083850A 서비스 제공 단말에 연결하는 방법 및 그 장치 审中-实审
标题翻译：用于连接提供终端的服务的方法及其设备
公开(公告)号：KR1020140083850A
公开(公告)日：2014-07-04
申请号：KR1020130049622
申请日：2013-05-02
申请人： 삼성전자주식회사
发明人： 강재은 , 양칠렬 , 이명환 , 이춘호 , 이태영 , 한충석
IPC分类号： H04L12/28 , H04L12/16 , H04L9/32
CPC分类号： H04L67/025 , H04L63/08 , H04L63/18
摘要： Provided are a method for connecting one device except the device, which is connected to a service providing device, to the service providing device simply, and controlling a service provided through the service providing device, and an apparatus thereof. A device control method for a first device to control a service provided through a service providing device may include the steps of connecting a second device having identification information related with the service providing device with out-of-band communications; receiving the identification information related with the service providing device through the out-of-band communications from the second device; executing at least one application related with the received identification information; and connecting the service providing device with in-band communications using the received identification information, and controlling the service provided through the service providing device.
摘要翻译：提供了一种用于将除了连接到服务提供设备的设备之外的一个设备简单地连接到服务提供设备并且控制通过服务提供设备提供的服务的方法及其设备。用于控制通过服务提供设备提供的服务的第一设备的设备控制方法可以包括以下步骤：将具有与服务提供设备相关的标识信息的第二设备连接到带外通信; 通过来自第二设备的带外通信来接收与服务提供设备相关的识别信息; 执行与所接收的识别信息相关的至少一个应用; 以及使用所接收的标识信息将服务提供设备连接到带内通信，以及控制通过服务提供设备提供的服务。

82. 发明公开

KR1020130087747A 디스플레이장치, 업그레이드장치 및 이를 포함하는 디스플레이시스템 및 그 제어방법 无效
标题翻译：显示装置，升级装置，包括其的显示系统及其控制方法
公开(公告)号：KR1020130087747A
公开(公告)日：2013-08-07
申请号：KR1020120008848
申请日：2012-01-30
申请人： 삼성전자주식회사
发明人： 신기욱 , 이태영 , 조순제 , 천세희 , 함철희
IPC分类号： H04N21/426 , H04N21/43
CPC分类号： G09G5/363 , G06F3/14 , G09G5/003 , G09G2360/06 , G09G2370/20
摘要： PURPOSE: A display device, an upgrade device, a display system including the same, and a control method thereof are provided to set the upgrade device as a communication available state based on device information about the upgrade device, stored in the first storage unit of the display device, according to the connection of the display device and the upgrade device. CONSTITUTION: An upgrade device connection unit (160) connects an upgrade device (200). A display unit (170) displays at least one of a first image, corresponding to the first output signal of a first image processing unit (130), and a second image corresponding to the second output signal of a second image processing unit (220). If the upgrade device is connected to the upgrade device connection unit, a first control unit (140) sets the upgrade device as a communication available state based on the first device information about the upgrade device stored in a first storage unit (150). [Reference numerals] (110) First image signal input unit; (120) User input unit; (130) First image processing unit; (140) First control unit; (150) First storage unit; (160) Upgrade device connection unit; (170) Display unit; (182) Conversion amplifying unit; (185) Sound output unit; (191) First connection unit; (193) Second connection unit; (210) Main body connection unit; (220) Second image processing unit; (230) Second control unit; (240) Second storage unit; (250) Second image signal input unit; (P1) First external device; (P2) Second external device
摘要翻译：目的：提供一种显示装置，升级装置，包括该显示装置的显示系统及其控制方法，基于存储在第一存储单元中的升级装置的设备信息，将升级装置设定为通信可用状态显示设备，根据显示设备和升级设备的连接。构成：升级设备连接单元（160）连接升级设备（200）。显示单元（170）显示与第一图像处理单元（130）的第一输出信号相对应的第一图像和对应于第二图像处理单元（220）的第二输出信号的第二图像中的至少一个，。如果升级设备连接到升级设备连接单元，则基于存储在第一存储单元（150）中的关于升级设备的第一设备信息，第一控制单元（140）将升级设备设置为通信可用状态。（附图标记）（110）第一图像信号输入单元; （120）用户输入单元; （130）第一图像处理单元; （140）第一控制单元; （150）第一存储单元; （160）升级设备连接单元; （170）显示单元; （182）转换放大单元; （185）声音输出单元; （191）第一连接单元; （193）第二连接单元; （210）主体连接单元; （220）第二图像处理单元; （230）第二控制单元; （240）第二储存单元; （250）第二图像信号输入单元; （P1）第一外部设备; （P2）第二外部设备

83. 发明公开

KR1020130087343A 신호 처리 장치, 디스플레이 장치, 디스플레이 시스템, 신호 처리 방법 无效
标题翻译：信号处理装置，显示装置，显示系统，信号处理方法和处理音频信号的方法
公开(公告)号：KR1020130087343A
公开(公告)日：2013-08-06
申请号：KR1020120041614
申请日：2012-04-20
申请人： 삼성전자주식회사
发明人： 송영석 , 정춘식 , 함철희 , 강희범 , 이태영 , 민석인 , 이태형 , 김형길
IPC分类号： H04L29/10 , H04L29/12
CPC分类号： H04L69/323 , H04L69/08
摘要： PURPOSE: A signal processing device, a display device, a display system, and a signal processing method are provided to normally process the transfer stream packet. CONSTITUTION: A signal processing unit (100) comprises a physical layer (110), a converter (120) and a serial interface unit (130). The physical layer is connected to the external communication network. The serial interface unit connects the physical layer and the display device. The converter converts a signal, which will be transmitted to a media access control unit of the display device in the physical layer, and provides the signal to the serial interface unit. The converter converts the signal, which is received from the serial interface unit, and provides the signal to the physical layer. [Reference numerals] (110) PHY unit; (120,220) Converter; (130,210) Serial interface unit; (230) MAC unit
摘要翻译：目的：提供信号处理装置，显示装置，显示系统和信号处理方法，以正常地处理传输流分组。构成：信号处理单元（100）包括物理层（110），转换器（120）和串行接口单元（130）。物理层连接到外部通信网络。串行接口单元连接物理层和显示设备。转换器转换将被传送到物理层中的显示装置的媒体访问控制单元的信号，并将信号提供给串行接口单元。转换器转换从串行接口单元接收的信号，并将信号提供给物理层。（附图标记）（110）PHY单元; （120,220）转换器; （130,210）串行接口单元; （230）MAC单元

84. 发明公开

KR1020130076688A 전자 시스템 및 그 제어방법, 디스플레이장치, 업그레이드장치, 디스플레이장치의 데이터 입출력 처리방법 无效
标题翻译：电子系统及其控制方法，显示装置，升级装置和输入/输出数据处理方法
公开(公告)号：KR1020130076688A
公开(公告)日：2013-07-08
申请号：KR1020120094230
申请日：2012-08-28
申请人： 삼성전자주식회사
发明人： 나경석 , 신기옥 , 이태영 , 조순제 , 함철희
IPC分类号： G06F13/14 , G06F13/38 , G09G5/00
摘要： PURPOSE: An electronic system, a control method thereof, a display device thereof, an upgrade device thereof, and a data input/output processing method thereof are provided to upgrade hardware or software functions of the display device by connecting the display device with an external device. CONSTITUTION: A first system-on-chip (SOC) (100) includes function blocks (110,120) for each function a first bus network (130) for communication between the function blocks. A connection unit (200) is connected to a second SOC (400) including a third function block with a first function and a second bus network (420). A power supply unit (300) supplies power to components. If the second SOC is connected through the connection unit, the power supply unit blocks power supply to a first function block. The connection unit includes an interface for communication between the first and the second bus networks. [Reference numerals] (100) First system-on-chip (SOC); (110) First function block; (120,410) Second function block; (130) First bus network; (200) First connection unit; (300) Power supply unit; (400) Second first system-on-chip (SOC); (420) Second bus network; (500) Second connection unit
摘要翻译：目的：提供电子系统，其控制方法，显示装置，升级装置及其数据输入/输出处理方法，以通过将显示装置与外部连接来升级显示装置的硬件或软件功能设备。构成：第一片上系统（SOC）（100）包括用于每个功能的用于功能块之间的通信的第一总线网络（130）的功能块（110,120）。连接单元（200）连接到包括具有第一功能的第三功能块和第二总线网络（420）的第二SOC（400）。电源单元（300）向组件供电。如果第二SOC通过连接单元连接，则电源单元阻止向第一功能块供电。连接单元包括用于在第一和第二总线网络之间进行通信的接口。（附图标记）（100）第一片上系统（SOC）; （110）第一功能块; （120,410）第二功能块; （130）第一总线网络; （200）第一连接单元; （300）电源单元; （400）第二首系统芯片（SOC）; （420）第二总线网络; （500）第二连接单元

85. 发明公开

KR1020110046877A 키 입력 제어 장치 및 방법 无效
标题翻译：用于控制主键输入的装置和方法
公开(公告)号：KR1020110046877A
公开(公告)日：2011-05-06
申请号：KR1020090103573
申请日：2009-10-29
申请人： 삼성전자주식회사
发明人： 이태영
IPC分类号： G06F3/02
CPC分类号： G06F3/023
摘要： PURPOSE: A key input controlling apparatus and method thereof are provided to inform a central processing unit about key input by normal operation. CONSTITUTION: A key input latch unit(203) reads out an inputted key value every predetermined reading cycle. A status storage unit(205) updates a read key value as a key status value. If a stored key status value matches with a read key value, a periodical counter(211) outputs a latch signal. If the outputted latch signal is received, a key value register(213) stores the stored key state value as a final key value.
摘要翻译：目的：提供一种键输入控制装置及其方法，以通过中央处理单元通过正常操作通知键输入。构成：键输入锁存单元（203）每预定的读取周期读出输入的键值。状态存储单元（205）将读取键值更新为键状态值。如果存储的键状态值与读取键值匹配，则周期性计数器（211）输出锁存信号。如果输出的锁存信号被接收，则键值寄存器（213）将所存储的键状态值存储为最终的键值。

86. 发明公开

KR1020100055905A 어레이 타입 인쇄 헤드 클리닝장치, 이를 구비한 화상형성장치 및 어레이 타입 인쇄 헤드의 클리닝방법 无效
标题翻译：阵列型打印头清洁装置，具有该装置的图像形成装置以及清洁阵列型打印头的方法）
公开(公告)号：KR1020100055905A
公开(公告)日：2010-05-27
申请号：KR1020080114807
申请日：2008-11-18
申请人： 삼성전자주식회사
发明人： 이태영 , 허정대
IPC分类号： B41J2/165 , B41J2/01
CPC分类号： B41J2/16585
摘要： PURPOSE: An array type printing head cleaning apparatus, a picture forming apparatus comprising the same, and a method for cleaning an array type printing head are provided to clean two printing head row using a cleaning unit capable of cleaning a printing head row. CONSTITUTION: An array type printing head cleaning apparatus comprises a cleaning carriage], a cleaning unit(110), and a cleaning unit moving device(140). The cleaning carriage moves straight. The cleaning unit cleans a printing head(31) while moving between a first location and a second location in the direction perpendicular to the traveling direction of the cleaning carriage. The cleaning unit moving device is installed at the cleaning carriage and moves the cleaning unit to position the cleaning unit at one of the first location and the second location. The cleaning unit moving device comprises a rotating link and a bar link(160). The rotating link is connected to the cleaning unit. The bar link is connected to the rotating link to operate the rotating link.
摘要翻译：目的：提供一种阵列式打印头清洁装置，包括该打印头的图像形成装置和清洁阵列型打印头的方法，以使用能够清洁打印头列的清洁单元清洁两个打印头列。构成：阵列型打印头清洁装置包括清洁托架]，清洁单元（110）和清洁单元移动装置（140）。清洁支架直线移动。清洁单元在与清洁托架的行进方向垂直的方向上在第一位置和第二位置之间移动的同时清洁打印头（31）。清洁单元移动装置安装在清洁托架上并移动清洁单元以将清洁单元定位在第一位置和第二位置中的一个位置。清洁单元移动装置包括旋转连杆和杆连杆（160）。旋转连杆连接到清洁单元。连杆连接到旋转连杆以操作旋转连杆。

87. 发明公开

KR1020090121011A 필름 기판을 이용한 적층 반도체 패키지 및 그 제조방법 无效
标题翻译：具有薄膜基板的堆叠半导体封装及其制造方法
公开(公告)号：KR1020090121011A
公开(公告)日：2009-11-25
申请号：KR1020080047093
申请日：2008-05-21
申请人： 삼성전자주식회사
发明人： 이태영 , 김형석 , 이강수
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/73265 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2224/48227 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： PURPOSE: A stacked semiconductor package having a film substrate and a fabrication method thereof are provided to perform various functions while having low thickness by removing an upper interconnection substrate of an upper semiconductor package and removing a solder connecting an upper and a lower semiconductor package. CONSTITUTION: In a stacked semiconductor package having a film substrate and a fabrication method thereof, a film substrate(10) includes a conductivity hole pattern, a conductive connection pattern, and a conductive lid. The conductivity hole patterns are formed at the center. A conductive connection patterns are connected to the conductivity hole patterns and the outer side. The conductive lid(16) is connected to the conductive connection patterns. A ball land is formed at the bottom of the interconnection substrate and a lower semiconductor chip inside a sealing material. The semiconductor package is laminated so that the ball land is placed on the conductivity hole patterns.
摘要翻译：目的：提供具有薄膜基板的叠层半导体封装及其制造方法，通过去除上部半导体封装的上部互连基板并去除连接上部和下部半导体封装的焊料，来实现各种功能，同时具有低厚度。构成：在具有薄膜基板的叠层半导体封装及其制造方法中，薄膜基板（10）包括导电孔图案，导电连接图案和导电盖。导电孔图案形成在中心。导电连接图案连接到导电孔图案和外侧。导电盖（16）连接到导电连接图案。在互连基板的底部形成有球面，在密封材料内部形成有下半导体芯片。层叠半导体封装，使得焊盘放置在导电孔图案上。

88. 发明公开

KR1020090050810A 접합 신뢰성이 향상된 적층형 반도체 패키지 无效
标题翻译：包装与包装改善联合可靠性
公开(公告)号：KR1020090050810A
公开(公告)日：2009-05-20
申请号：KR1020070117443
申请日：2007-11-16
申请人： 삼성전자주식회사
发明人： 이태영 , 이동하 , 이철우
IPC分类号： H01L23/12
CPC分类号： H01L24/97 , H01L23/3128 , H01L24/16 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01087 , H01L2924/078 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247 , H01L2224/45099 , H01L2224/05599
摘要： 접합 신뢰성이 향상된 적층형 반도체 패키지를 개시한다. 적층형 반도체 패키지는 하부 패키지; 상기 하부 패키지상에 장착되는 상부 패키지; 및 상기 하부 패키지와 상기 상부 패키지를 전기적으로 연결시켜 주기 위한 조인트 부재들을 구비한다. 상기 하부 패키지는 하부 기판; 및 상기 하부 기판의 일면상에 장착되는 하부 반도체 칩을 구비한다. 상기 상부 패키지는 상부 기판; 및 상기 상부 기판의 일면상에 장착되는 적어도 하나이상의 상부 반도체 칩을 구비한다. 상기 조인트 부재는 상기 하부 패키지와 상기 상부 패키지사이에 배열된다. 상기 하부 패키지는 상기 상부 패키지의 상기 상부 기판과 상기 하부 패키지의 상기 하부 기판사이의 공간에 완전히 충전되어, 상기 조인트 부재들을 둘러싸고 상기 하부 반도체 칩을 보호하는 하부 봉지재를 더 포함한다.

89. 发明公开

KR1020080076605A 서브 샘플링된 영상을 보간하는 방법 및 장치 无效
标题翻译：用于插入次采样图像的方法和装置
公开(公告)号：KR1020080076605A
公开(公告)日：2008-08-20
申请号：KR1020070016770
申请日：2007-02-16
申请人： 삼성전자주식회사
发明人： 조기원 , 박창대 , 이태영 , 이동훈
IPC分类号： H04N19/59 , H04N19/80 , G06T3/40
CPC分类号： H04N19/59 , H04N19/117 , H04N19/136 , H04N19/172 , H04N19/80
摘要： A method and an apparatus for interpolating a sub-sampled image are provided to interpolate the sub-sampled image more exactly, thereby achieving more exact intra/inter prediction based on an interpolated image in image decoding. Interpolation is performed by using plural different interpolation filters with respect to a sub-sampled image(610). An error is calculated by comparing the interpolated pixels with pixels included in an image before sub sampling(620). One of the interpolation filters is selected as an interpolation filter of the sub-sampled image based on the calculated error(630).
摘要翻译：提供了用于内插子采样图像的方法和装置，以更精确地内插子采样图像，从而基于图像解码中的内插图像获得更精确的帧内/帧间预测。通过使用关于子采样图像的多个不同的内插滤波器来执行插值（610）。通过将内插像素与在次采样之前的图像中包括的像素进行比较来计算错误（620）。基于计算出的误差，选择内插滤波器之一作为子采样图像的内插滤波器（630）。

90. 发明授权

KR100829613B1 반도체 칩 패키지 및 그 제조 방법 失效
标题翻译：半导体芯片封装及其制造方法
公开(公告)号：KR100829613B1
公开(公告)日：2008-05-14
申请号：KR1020070001954
申请日：2007-01-08
申请人： 삼성전자주식회사
发明人： 이철우 , 김보성 , 이광열 , 이태영
IPC分类号： H01L23/28
CPC分类号： H01L25/0657 , H01L23/3121 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip package and a manufacturing method thereof are provided to prevent an erroneous molding of a second insulation member due to an ineffective flow of an insulation material on a semiconductor chip by preventing the insulation material from being supplied on the semiconductor chip. A semiconductor chip package includes a substrate(110), semiconductor chips(132,142), bonding wires(150,152), a first insulation member(162), and a second insulation member(170). A line pattern is formed on the substrate. The semiconductor chips are mounted on the substrate. Plural electrode pads are formed on the semiconductor chip. The bonding wires electrically couple the line pattern with the electrode pads. The first insulation member is arranged on an upper surface of the semiconductor chip. The second insulation member is arranged on the substrate and seals the semiconductor chip, the bonding wires, and the first insulation member. Heights of the upper surfaces of the first and second insulation members are as same as each other.
摘要翻译：提供一种半导体芯片封装及其制造方法，以防止绝缘材料在半导体芯片上的无效流动而导致第二绝缘构件的错误模制，这是因为通过防止在半导体芯片上提供绝缘材料。半导体芯片封装包括衬底（110），半导体芯片（132,142），接合线（150,152），第一绝缘构件（162）和第二绝缘构件（170）。在基板上形成线图形。半导体芯片安装在基板上。多个电极焊盘形成在半导体芯片上。接合线将线路图案与电极焊盘电耦合。第一绝缘构件设置在半导体芯片的上表面上。第二绝缘构件设置在基板上并密封半导体芯片，接合线和第一绝缘构件。第一和第二绝缘构件的上表面的高度彼此相同。

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