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81. 发明公开

KR1020120092838A 형광체 및 이의 제조방법 有权
标题翻译：磷光体及其制备方法
公开(公告)号：KR1020120092838A
公开(公告)日：2012-08-22
申请号：KR1020110012712
申请日：2011-02-14
申请人： 삼성전자주식회사
发明人： 원형식 , 김성민 , 민찬숙 , 윤철수
IPC分类号： C09K11/64 , H01L33/00 , H01J17/49
CPC分类号： C09K11/7728 , C09K11/0883 , C09K11/7734
摘要： PURPOSE: A Sialon phosphor is provided to have a short wavelength of 525-537 nm, and to prevent degradation of color reproducibility and color index. CONSTITUTION: A Sialon phosphor comprises a compound in chemical formula 1: Sr_ySi_(6-z)Al_zO_zN_(8-z):Re_x. In chemical formula 1, x, y and z is respectively 0.005
摘要翻译：目的：提供Sialon荧光体，使其具有525-537nm的短波长，并防止颜色再现性和颜色指数的降低。构成：Sialon荧光体包含化学式1中的化合物：Sr_ySi_（6-z）Al_zO_zN_（8-z）：Re_x。在化学式1中，x，y和z分别为0.005≤x≤0.05,0.05≤y≤0.5,0.001≤z≤0.50，Re为稀土元素。稀土元素选自Eu和Ce。荧光体的制造方法包括：通过混合锶前体，硅前体，铝前体和活性物质的前体产生混合物的步骤，以及在氮气氛下烧结该混合物的步骤。

82. 发明公开

KR1020120092785A 발광 디바이스 失效
标题翻译：发光装置
公开(公告)号：KR1020120092785A
公开(公告)日：2012-08-22
申请号：KR1020110012604
申请日：2011-02-14
申请人： 삼성전자주식회사
发明人： 한옥식 , 박민정 , 윤창번 , 윤철수
IPC分类号： H01L33/50
CPC分类号： H01L33/502 , H01L33/505 , H01L33/56 , H01L2933/0091
摘要： PURPOSE: A light emitting device is provided to minimize the degradation of luminous efficiency due to color distribution, resorption, and scattering by including a wavelength converter with a composite crystal structure. CONSTITUTION: A light emitting diode chip(101) generates light through the recombination of a hole and an electron. A substrate(102) comprises a wiring structure for being electrically connected to the light emitting diode chip. A wavelength converter(103) is arranged on a route of the light emitted in the light emitting diode chip. The wavelength converter comprises a plurality of plates which is separate from each other A transparent resin(104) solders the light emitting diode chip and the wavelength converter. The transparent resin comprises optical transformation material.
摘要翻译：目的：提供一种发光装置，通过包括具有复合晶体结构的波长转换器来最小化由于颜色分布，吸收和散射引起的发光效率的劣化。构成：发光二极管芯片（101）通过孔和电子的复合产生光。基板（102）包括用于电连接到发光二极管芯片的布线结构。波长转换器（103）布置在发光二极管芯片中发出的光线的路线上。波长转换器包括彼此分离的多个板。透明树脂（104）焊接发光二极管芯片和波长转换器。透明树脂包括光学转化材料。

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