会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 73. 发明公开
    • 비인화성 세정 조성물
    • 非易燃清洁剂组合物
    • KR1020100071110A
    • 2010-06-28
    • KR1020107011405
    • 2008-10-24
    • 센주긴조쿠고교 가부시키가이샤무라오카, 신이치
    • 무라오카,신이치사토,이사무
    • C11D7/30C11D7/24C11D7/50C23G5/028
    • C11D11/0047B23K1/0016B23K1/018B23K1/08B23K1/206B23K35/262B23K2201/42C11D7/244C11D7/28C11D7/5027C23G5/02858
    • A bromine-containing solvent, which has been used as an alternative solvent to a chlorofluorocarbon solvent or a chlorine-containing solvent, is characterized in that it is likely to degrade compared with a chlorofluorocarbon solvent or a chlorine-containing solvent. In the conventional bromine-containing cleaner compositions, the degradation of the compositions are prevented by using a corrosion-protecting agent or a stabilizing agent (e.g., nitroethane). However, when the cleaner compositions are used as cleaners for print circuit boards, the reduction in insulation resistance or leak failure is often caused. Thus, provided is a non-flammable cleaner composition comprising a mixture of a bromide selected from n-propylbromide, methylenebromide, bromochloromethane, n-butylbromide, isobutylbromide, sec-butylbromide and ter-butylbromide as a stabilizer for a bromine-containing solvent and an alkene-or alkyne-type hydrocarbon having 4 to 10 carbon atoms.
    • 已经用作氯氟烃溶剂或含氯溶剂的替代溶剂的含溴溶剂的特征在于与氯氟烃溶剂或含氯溶剂相比可能劣化。 在常规的含溴清洁剂组合物中,通过使用腐蚀保护剂或稳定剂(例如硝基乙烷)来防止组合物的降解。 然而,当清洁剂组合物用作印刷电路板的清洁剂时,常常引起绝缘电阻降低或泄漏故障。 因此,提供了一种不燃性清洁剂组合物,其包含选自正丙基溴,二溴甲烷,溴氯甲烷,正丁基溴,异丁基溴,仲丁基溴和叔丁基溴的溴化物作为溴含量溶剂的稳定剂的混合物,和 具有4-10个碳原子的烯烃或炔烃。
    • 78. 发明公开
    • 수지조성물 제거세정제
    • 树脂组合物的去除和洗涤剂
    • KR1020070012221A
    • 2007-01-25
    • KR1020060067620
    • 2006-07-19
    • 도쿄 오카 고교 가부시키가이샤
    • 가타노아키라하라다고지
    • C11D1/00C11D7/24G03F7/42C11D7/50
    • C11D1/00C11D7/247C11D7/5004G03F7/422
    • Provided is a cleaning agent for removing a resin composition, which removes a resin composition adhered to a coating apparatus effectively and exhibits a cleaning property effective in removing a pigment-dispersible photosensitive resin composition. The cleaning agent for removing resin composition contains at least one solvent capable of dissolving and removing a resin composition adhered to the surface of an article, and a aromatic compound that disperses pigments contained in the adhered resin composition. The aromatic compound includes alkylbenzene. An alkyl group in the alkyl benzene has 3-5 carbon atoms. The alkylbenzene is contained in an amount of 5-50wt% based on the total weight of the cleaning agent.
    • 本发明提供一种用于除去树脂组合物的清洁剂,该树脂组合物有效地除去附着在涂布装置上的树脂组合物,并且具有有效去除颜料分散性感光性树脂组合物的清洁性能。 用于除去树脂组合物的清洁剂含有至少一种能够溶解和除去附着在制品表面上的树脂组合物的溶剂和分散粘附的树脂组合物中所含颜料的芳族化合物。 芳香族化合物包括烷基苯。 烷基苯中的烷基具有3-5个碳原子。 基于清洁剂的总重量,烷基苯的含量为5-50wt%。
    • 80. 发明公开
    • 나노전자 및 마이크로전자 세정 조성물
    • 纳米电子和微电子清洁组合物
    • KR1020070003888A
    • 2007-01-05
    • KR1020067017617
    • 2005-02-11
    • 아반토르 퍼포먼스 머티리얼스, 인크.
    • 수,치엔핀셔먼
    • C11D11/00C11D7/50C11D7/34B82Y40/00G03F7/42
    • C11D11/0047C11D3/3947C11D3/3956C11D7/22C11D7/261C11D7/34C11D7/5004C11D7/5009C11D7/5022G03F7/422G03F7/425G03F7/426C11D11/0005B82Y40/00C11D7/5013G03F7/42
    • Nanoelectronic and microelectronic cleaning compositions for cleaning nanoelectronic and microelectronic substrates under supercritical fluid state conditions, and particularly cleaning compositions useful with and having improved compatibility with nanoelectronic and microelectronic substrates characterized by silicon dioxide, sensitive low-kappa or high-kappa dielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallization, as well as substrates of Al or Al(Cu) metallizations and advanced interconnect technologies, are provided by nanoelectronic and microelectronic cleaning compositions comprising nanoelectronic and microelectronic cleaning compositions of this invention are provided by compositions comprising: (1) a supercritical main fluid reaching a supercritical fluid state at a temperature of 250‹C or less and a pressure of 600 bars or less (592.2 atm, 8702.3 psi), and (2) as a secondary fluid, a modifier formulation selected from the following formulations: a) a formulation comprising: an oxidizing agent; a polar organic solvent selected from the group consisting of amides, sulfones, sulfolenes, selenones and saturated alcohols; and optionally other components; b) a silicate free formulation comprising: a polar organic solvent selected from the group consisting of amides, sulfones, selenones and saturated alcohols; a strong alkaline base; and optionally other components; c) a formulation comprising: from about 0.05% to 30% by weight of one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions; from about 0.5 to about 99.95% by weight of one or more corrosion inhibiting solvent compounds, said corrosion inhibiting solvent compound having at least two sites capable of complexing with metals; and optionally other components; d) a formulation comprising: from about 0.05 to 20% by weight of one or more non-ammonium producing, non-HF producing fluoride salt; from about 5 to about 99.95% by weight of water, organic solvent or both water and organic solvent; and optionally other components; and e) a formulation comprising: from about 0.05% to 30% by weight of one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions; from about 5 to about 99.95% by weight of one or more steric hindered amide solvents; and optionally other components. ® KIPO & WIPO 2007
    • 用于在超临界流体状态条件下清洁纳米电子和微电子衬底的纳米电子和微电子清洁组合物,特别是与二氧化硅,敏感的低kappa或高kappa电介质以及铜,钨的纳米电子和微电子衬底有用并具有改进的相容性的清洁组合物 ,钽,镍,金,钴,钯,铂,铬,钌,铑,铱,铪,钛,钼,锡等金属化,以及Al或Al(Cu)金属化和先进互连技术的基板 由包括本发明的纳米电子和微电子清洁组合物的纳米电子和微电子清洁组合物提供由以下组合物提供,所述组合物包含:(1)在250℃或更低的温度和600巴的压力下达到超临界流体状态的超临界主流体, 少(592.2 atm,8702.3 psi),和(2)作为第二流体,选自以下配方的改性剂制剂:a)制剂,其包含:氧化剂; 选自酰胺,砜,环丁烯砜,硒酮和饱和醇的极性有机溶剂; 和任选的其它组分; b)无硅酸盐制剂,其包含:选自酰胺,砜,硒酮和饱和醇的极性有机溶剂; 强碱性碱; 和任选的其它组分; c)一种制剂,其包含:约0.05%至30%重量的一种或多种含非亲核带正电荷的抗衡离子的产生非铵的强碱; 约0.5-约99.95%(重量)的一种或多种腐蚀抑制溶剂化合物,所述腐蚀抑制溶剂化合物具有至少两个能与金属络合的位点; 和任选的其它组分; d)一种制剂,其包含:约0.05至20重量%的一种或多种非铵生产的非HF产生氟化物盐; 约5至约99.95重量%的水,有机溶剂或水和有机溶剂; 和任选的其它组分; 和e)一种制剂,其包含:约0.05%至30%重量的一种或多种含非亲核带正电荷的抗衡离子的产生非铵的强碱; 约5至约99.95重量%的一种或多种空间位阻酰胺溶剂; 和任选的其它组分。 ®KIPO&WIPO 2007