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71. 发明公开

KR1020140047480A 회로패턴 및 통홀 내 도통라인을 인쇄하여 형성하는 양면인쇄회로기판 형성방법 无效
标题翻译：制造PCB形成电路图并通过印刷方法连接通孔的电路图案的方法
公开(公告)号：KR1020140047480A
公开(公告)日：2014-04-22
申请号：KR1020120113831
申请日：2012-10-12
申请人： 주식회사 잉크테크
发明人： 정광춘 , 한영구 , 윤광백 , 윤동국 , 김수한 , 문태진
IPC分类号： H05K3/46 , H05K3/40
CPC分类号： H05K3/4069 , H05K1/0386 , H05K3/1233 , H05K2203/1476
摘要： The present invention relates to a double-sided printed circuit board forming method which is formed by painting a circuit pattern and a conductive line in a via-hole. The double-sided printed circuit board forming method includes: a step for forming a via-hole which penetrates the upper and lower sides of an insulating layer; a first circuit pattern forming step for forming a first circuit pattern with a conductive material on one side of the insulating layer and forming a pattern so that a part of the conductive material is combined with the inner circumferential surface of the via-hole; and a second circuit pattern forming step for forming a second circuit pattern with a conductive material on the other side of the insulating layer which is the opposite side of the one side and forming a pattern so that a part of the conductive material is connected to the first circuit pattern by being combined with the inner circumferential surface of the via-hole. [Reference numerals] (AA) Via-hole processing process; (BB) First circuit pattern printing process; (CC,EE) Heating process; (DD) Second circuit pattern printing process
摘要翻译：本发明涉及通过在通孔中涂覆电路图案和导线而形成的双面印刷电路板形成方法。双面印刷电路板形成方法包括：形成穿透绝缘层的上侧和下侧的通孔的步骤; 第一电路图案形成步骤，用于在所述绝缘层的一侧上形成具有导电材料的第一电路图案，并形成图案，使得所述导电材料的一部分与所述通孔的内周面结合; 以及第二电路图案形成步骤，用于在绝缘层的与该一侧相反的一侧的另一侧上形成具有导电材料的第二电路图案，并形成图案，使得导电材料的一部分连接到通过与通孔的内周面组合的第一电路图案。（附图标记）（AA）通孔处理工艺; （BB）第一电路图案印刷工艺; （CC，EE）加热过程; （DD）第二电路图案印刷工艺

72. 发明公开

KR1020130126050A 연속 도금 장치 有权
标题翻译：连续涂装
公开(公告)号：KR1020130126050A
公开(公告)日：2013-11-20
申请号：KR1020120049803
申请日：2012-05-10
申请人： 주식회사 잉크테크
发明人： 정광춘 , 유명봉 , 한영구 , 온웅구
IPC分类号： C25D17/02
CPC分类号： C25D7/0628 , C25D7/0642 , C25D7/0657 , C25D7/0685
摘要： The present invention relates to a continuous plating apparatus, more specifically, to a continuous plating apparatus including: a frame; a driving roller winds and holds a plating subject which extends in one direction and which has the constant width, rotates by receiving power by a rotating means, and is installed to the frame; a driven roller which is installed to the frame and is arranged by being spaced apart from the driving roller, and around which the plating subject is wound and held; a cathode roller which is installed to the frame, is arranged on a movement route, which is between the driving roller and the driven roller and on which the plating subject moves, and charges cathode electricity with the plating subject by being contact with the plating subject; and an anode nozzle which is installed in the frame and sprays plating agent including anode ion to the part in which the cathode roller and the plating subject are in contact with each other.
摘要翻译：连续电镀装置技术领域本发明涉及一种连续电镀装置，更具体地，涉及一种连续电镀装置，包括：框架; 驱动辊绕着一个方向延伸并且具有恒定宽度的电镀对象，通过旋转装置接收电力旋转，并安装在框架上; 被驱动辊，其安装在框架上并且与驱动辊隔开布置，并且电镀对象被卷绕和保持在其周围; 安装在框架上的阴极辊布置在驱动辊和从动辊之间的运动路线上，电镀对象移动到该运动路线上，并且通过与电镀对象接触来对电镀对象施加阴极电 ; 以及阳极喷嘴，其安装在框架中并将包含阳极离子的电镀剂喷射到阴极辊和电镀对象彼此接触的部分。

73. 发明公开

KR1020130096689A 박막 금속적층필름의 제조방법 无效
标题翻译：层压金属膜的制备方法
公开(公告)号：KR1020130096689A
公开(公告)日：2013-08-30
申请号：KR1020130094203
申请日：2013-08-08
申请人： 주식회사 잉크테크
发明人： 정광춘 , 조현남 , 조남부 , 유지훈
IPC分类号： B32B15/08 , B32B27/00
摘要： PURPOSE: A manufacturing method of laminated metal film is provided to reduce the production time for a manufacturing process and ensure the advantage of mass production and cost reduction. CONSTITUTION: A manufacturing method of laminated metal film comprises steps of: preparing release film or release paper; forming a resin layer on the release film with high thermal resistance and an excellent adhesive property with metals; and forming a thin metal layer by coating or printing a metallic ink composition on the resin layer. The laminated metal film is applied to a product after removing the release film. One or mixed resin for the resin forming the resin layer is selected among an epoxy resin, a melamine resin, a phenol resin, a phenol modified alkyd resin, an epoxy modified alkyd resin, a silicon modified alkyd resin, an acryl melamine resin, a polyimide resin, or their precursor.
摘要翻译：目的：提供层压金属膜的制造方法，以减少制造过程的生产时间，并确保大量生产和降低成本的优点。构成：层压金属膜的制造方法包括以下步骤：制备脱模膜或脱模纸; 在剥离膜上形成具有高耐热性和与金属的优异粘合性的树脂层; 以及通过在所述树脂层上涂覆或印刷金属油墨组合物来形成薄金属层。去除剥离膜后将层压金属膜施加到产品上。形成树脂层的树脂的一种或混合树脂选自环氧树脂，三聚氰胺树脂，酚醛树脂，酚改性醇酸树脂，环氧改性醇酸树脂，硅改性醇酸树脂，丙烯酸三聚氰胺树脂，聚酰亚胺树脂或其前体。

74. 发明公开

KR1020130073851A 금속 인쇄회로기판의 제조방법 有权
标题翻译：制造金属印刷电路板的方法
公开(公告)号：KR1020130073851A
公开(公告)日：2013-07-03
申请号：KR1020120151216
申请日：2012-12-21
申请人： 주식회사 잉크테크
发明人： 정광춘 , 조남부 , 한영구 , 유명봉 , 온웅구
IPC分类号： H05K3/46 , H05K3/12 , H05K3/18
CPC分类号： H05K3/007 , H05K3/0014 , H05K3/0061 , H05K3/207 , H05K2201/0376 , Y10T29/49155
摘要： PURPOSE: A metal printed circuit board manufacturing method is provided to attach a circuit pattern and a thermally conductive insulating layer to a base layer by a hot press process, thereby improving adhesion. CONSTITUTION: A circuit pattern is printed on a release film. A thermally conductive insulating layer is applied on the circuit pattern. A thermally conductive base layer is placed on the thermally conductive insulating layer. The thermally conductive base layer is pressurized on the thermally conductive insulating layer. The release film is removed by the pressurization. [Reference numerals] (AA) Release film; (BB) Print an electrode circuit; (CC) Print a thermally conductive insulating layer; (DD) Thermally conductive base layer and hot pressing; (EE) Metal PCB is formed after a release film is removed
摘要翻译：目的：提供一种金属印刷电路板制造方法，通过热压法将电路图案和导热绝缘层附着到基底层，从而提高粘附性。构成：剥离膜上印有电路图案。导电绝缘层被施加在电路图案上。将导热基底层放置在导热绝缘层上。导热基层在导热绝缘层上加压。通过加压除去脱模膜。（附图标记）（AA）剥离膜; （BB）打印电极电路; （CC）打印导热绝缘层; （DD）导热基层和热压; （EE）在去除剥离膜之后形成金属PCB

75. 外观设计

KR3006903020001S 有权
公开(公告)号：KR3006903020001S
公开(公告)日：2013-04-30
申请号：KR3020120002004
申请日：2012-01-13
申请人： 주식회사 잉크테크 , 차금환
设计人： 정광춘 , 심민수 , 구경모 , 차금환

76. 外观设计

KR3006903030000S 有权
公开(公告)号：KR3006903030000S
公开(公告)日：2013-04-23
申请号：KR3020120019313
申请日：2012-04-23
申请人： 주식회사 잉크테크 , 차금환
设计人： 차금환 , 정광춘 , 심민수 , 구경모

77. 外观设计

KR3006903010000S 有权
公开(公告)号：KR3006903010000S
公开(公告)日：2013-04-23
申请号：KR3020120002002
申请日：2012-01-13
申请人： 주식회사 잉크테크 , 차금환
设计人： 정광춘 , 심민수 , 구경모 , 차금환

78. 发明公开

KR1020120124844A 인쇄 소재 审中-实审
标题翻译：印刷材料
公开(公告)号：KR1020120124844A
公开(公告)日：2012-11-14
申请号：KR1020110042715
申请日：2011-05-04
申请人： 주식회사 잉크테크
发明人： 정광춘 , 주명희 , 김창수 , 최민수
IPC分类号： B41M5/50 , B41M5/00
CPC分类号： B41M5/50 , B41M5/00 , B41M5/385 , B41M5/52
摘要： PURPOSE: A printing material is provided to maximize the metallic expression after printing by forming an ink absorbent layer having constant opacity and glossiness. CONSTITUTION: A printing material includes an ink absorbing layer containing a metal layer, a substrate layer, resin, and inorganic filler. The ink layer is UV ink layer. The ink-absorbing layer has the opacity of 10-25% and the luster drawing of 10-25%. The ink layer is solvent ink layer. The ink-absorbing layer has the opacity of 1-10% and the luster drawing of 30-50%. The ink-absorbing layer is formed with the ink-absorbing layer coating solution for UV ink. The ink-absorbing layer coating solution for UV ink comprises 20-40wt% of resin, 5-15 wt% of inorganic filler, 50-70wt% of solvent and 0.1-2wt% of additive. [Reference numerals] (AA) Ink absorbing layer; (BB) Substrate 1; (CC) Aluminum vaporized layer
摘要翻译：目的：提供印刷材料，以通过形成具有不透明度和光泽度的油墨吸收层来最大化印刷后的金属表达。构成：印刷材料包括含有金属层的墨水吸收层，基底层，树脂和无机填料。油墨层是UV油墨层。吸墨层的不透明度为10-25％，光泽度为10-25％。油墨层是溶剂油墨层。吸墨层的不透明度为1-10％，光泽度为30-50％。吸墨层由UV油墨的吸墨层涂布液形成。用于UV油墨的吸墨层涂布液包含20-40重量％的树脂，5-15重量％的无机填料，50-70重量％的溶剂和0.1-2重量％的添加剂。（附图标记）（AA）吸墨层; （BB）基板1; （CC）铝蒸发层

79. 发明公开

KR1020120118886A 은 잉크 조성물 有权
标题翻译：银墨组合物
公开(公告)号：KR1020120118886A
公开(公告)日：2012-10-30
申请号：KR1020110036520
申请日：2011-04-20
申请人： 주식회사 잉크테크
发明人： 정광춘 , 조현남 , 유지훈 , 한대상
IPC分类号： C09D11/52 , H01B1/22 , H05K3/10
CPC分类号： C09D11/00 , C09D11/52 , C09D17/006 , H01B1/22 , H05K3/10
摘要： 본발명은, 화학식 1로부터선택되는하나이상의은 화합물및 화학식 2 내지화학식 4로부터선택되는하나이상의암모늄카바메이트계화합물또는암모늄카보네이트계화합물을반응시켜얻어지는은 착체화합물과; 옥심계화합물을포함하는은 잉크조성물을제공한다.
摘要翻译：目的：提供银油墨组合物以具有优异的油墨储存稳定性，使低温烧结成为可能，可用于各种聚合物基材中，以减少烧结时间并提高生产效率。构成：一种银墨水组合物，其包含通过使选自化学式1的一种或多种银化合物和氨基甲酸铵基化合物或选自化学式2-4的碳酸化化合物与肟基化合物反应而获得的银络合物，基化合物。在化学式1中，n为1-4的整数，x为选自氧，硫，卤素，氰基，氰酸酯，碳酸根，硝酸根，亚硝酸根，硫酸根，磷酸根，硫氰酸根，氯酸根，高氯酸根，四氟硼酸根，乙酰丙酮化物，羧酸酯及其衍生物。

80. 发明公开

KR1020120107814A 금속 박막 필름 제조방법 有权
标题翻译：制造薄膜薄膜
公开(公告)号：KR1020120107814A
公开(公告)日：2012-10-04
申请号：KR1020110025563
申请日：2011-03-22
申请人： 주식회사 잉크테크
发明人： 정광춘 , 조현남 , 조남부 , 진석필 , 박광진 , 권혁환 , 임태호 , 진선미 , 이돈신
IPC分类号： G02B5/08 , G02F1/13357
CPC分类号： G02B5/0816 , C09D5/38 , G02F1/133605
摘要： 본발명은, a) 기재층상에금속층을구비하는단계; 및 b) 상기금속층상에, 실란커플링제(silane coupling agent) 및에시드(acid) 중선택된 1종이상을포함하는표면처리제로표면처리층을형성하는단계를포함하는것을특징으로하는금속박막필름의제조방법을제공한다.
摘要翻译：目的：提供一种制造金属薄膜的方法，通过增加耐候性来提供优质的金属薄膜。构成：金属层形成在基材层（10）上。金属层的厚度为0.05〜0.4微米。在具有表面处理剂的金属层上形成表面处理层（40）。表面处理剂包括硅烷偶联剂或酸化合物。表面处理剂另外包括无机填料以改善光学性能。

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