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    • 54. 发明公开
    • 패턴 형성 방법
    • 图案形成方法
    • KR1020140042671A
    • 2014-04-07
    • KR1020130109653
    • 2013-09-12
    • 도쿄엘렉트론가부시키가이샤
    • 오야마,겐이치야에가시,히데타미
    • H01L21/027
    • H01L21/306B81C1/00031B81C2201/0149H01L21/3086H01L21/0274
    • The present invention provides a pattern forming method which makes the roughness of a pattern without generating pattern collapse, increases pattern mask selectivity, and forms a fine pattern without using a guide pattern. A pattern forming method according to one embodiment of the present invention includes a process of forming a pattern material layer which has an exposure part and a non-exposure part which become a porous material and are used as an etch object layer in an exposure process, on a substrate, a process of pattern-exposing a paten forming material layer and making the exposure part porous, a process of selectively dipping a filling material in the air gap of the exposure part and reinforcing the exposure part, and a process of removing the non-exposure part of the pattern forming material layer by dry etching and forming a preset pattern. [Reference numerals] (AA) Form a DSA material film on a semiconductor wafer; (BB) Pattern and expose the DSA material film; (CC) Selectively infiltrate a filling material on at least a surface of a void formed on an exposure part; (DD) Form a predetermined pattern by removing a non-exposure part by dry etching; (EE) Process 1; (FF) Process 2; (GG) Process 3; (HH) Process 4
    • 本发明提供一种图案形成方法,其使图案的粗糙度不产生图案折叠,增加图案掩模选择性,并且在不使用引导图案的情况下形成精细图案。 根据本发明的一个实施例的图案形成方法包括形成具有曝光部分的图案材料层和成为多孔材料并在曝光过程中用作蚀刻对象层的非曝光部分的工艺, 在基板上,形成图案曝光成形材料层并使曝光部分为多孔的过程,将填充材料选择性地浸渍在曝光部分的气隙中并加强曝光部分的过程,以及去除 通过干蚀刻形成图案形成材料层的非曝光部分并形成预设图案。 (标号)(AA)在半导体晶片上形成DSA材料膜; (BB)图案并曝光DSA材料膜; (CC)在形成在曝光部分上的空隙的至少一个表面上选择性地渗透填充材料; (DD)通过干蚀刻去除非曝光部分而形成预定图案; (EE)过程1; (FF)过程2; (GG)过程3; (HH)过程4
    • 58. 发明公开
    • 패턴 형성 방법
    • 形成图案的方法
    • KR1020130120586A
    • 2013-11-05
    • KR1020120043595
    • 2012-04-26
    • 삼성전자주식회사
    • 남재우김경선김은성신철호이시용
    • G03F7/26G03F7/34G03F7/09
    • H01L21/0273B81C1/00031B81C2201/0149B81C2201/0198H01L21/0337H01L21/31144H01L21/32139
    • With a method of forming patterns, photoresist patterns are formed on a substrate in which an etching film is formed. Guide patterns having a higher heat resistance than the photoresist patterns are formed by surface- treating the photoresist patterns. A material layer including a block copolymer including at least two polymer blocks is coated on the substrate which is exposed by the guide patterns. Minute pattern layers in which mutually different polymer blocks are repeatedly arranged are formed by separating the material layer upon minute phases. A minute pattern mask is formed by removing minute patterns including at least one polymer block from the minute pattern layers. Also, patterns are formed by etching the etching film with the minute pattern mask. With the method, minute patterns are formed in simple processes.
    • 通过形成图案的方法,在其中形成蚀刻膜的基板上形成光致抗蚀剂图案。 通过对光致抗蚀剂图案进行表面处理,形成具有比光致抗蚀剂图案更高的耐热性的引导图案。 包含至少两个聚合物嵌段的嵌段共聚物的材料层被涂覆在被引导图案暴露的基板上。 通过在分相上分离材料层来形成其中重复排列相互不同的聚合物嵌段的分钟图案层。 通过从微图案层去除包括至少一个聚合物嵌段的微小图案来形成微图案掩模。 此外,通过用微图案掩模蚀刻蚀刻膜形成图案。 使用该方法,在简单的过程中形成微小图案。