专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明公开

KR1020010088058A 반도체 패키지용 매거진 失效
标题翻译：半导体封装杂志
公开(公告)号：KR1020010088058A
公开(公告)日：2001-09-26
申请号：KR1020000012057
申请日：2000-03-10
申请人： 주식회사 엘지화학 , 김명복
发明人： 이시호 , 이명구 , 김정환 , 한상훈 , 김명복
IPC分类号： H01L21/677
CPC分类号： H01L21/6773
摘要： PURPOSE: A semiconductor package magazine is provided to reduce time and cost necessary for manufacturing the semiconductor package magazine, by separately manufacturing a plurality of upper/lower plates satisfying various specifications of a body and a semiconductor strip, and by assembling the upper/lower plates to form the semiconductor package magazine so that semiconductor strips of various specifications can be loaded without a separate magazine. CONSTITUTION: A semiconductor package magazine(30) is loaded in a semiconductor package process to transfer a semiconductor strip. The semiconductor strip is loaded in a body(31,31'). A plurality of guides is formed on respective surfaces of the body. Upper/lower plates(32,33) have the width corresponding to the width of the semiconductor strip separated from the body. A coupling unit couples the body with the upper/lower plates.
摘要翻译：目的：通过单独制造满足不同规格的主体和半导体条的多个上/下板，并且通过组装上/下板来提供半导体封装盒，以减少制造半导体封装盒所需的时间和成本以形成半导体封装盒，使得可以在没有单独的盒的情况下加载各种规格的半导体条。构成：在半导体封装工艺中加载半导体封装盒（30）以转移半导体条。半导体条被装载在主体（31,31'）中。多个引导件形成在主体的各个表面上。上板/下板（32,33）具有与从主体分离的半导体带的宽度对应的宽度。联接单元将主体与上/下板连接。

IPRDB

热门服务

关于我们

友情链接

联系方式