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    • 41. 发明授权
    • 이중 패터닝 기술을 이용한 반도체 소자의 미세 패턴 형성방법
    • 使用双模式技术形成半导体器件精细图案的方法
    • KR100817089B1
    • 2008-03-26
    • KR1020070020574
    • 2007-02-28
    • 삼성전자주식회사
    • 이두열조한구이석주여기성곽판석홍민종
    • H01L21/027
    • H01L21/0337H01L24/98
    • A method for forming a fine pattern of a semiconductor device using a dual patterning technique is provided to disconnect a second line pattern in a second direction by easily disconnecting a first line pattern in a direction vertical to a resolution control direction regardless of resolution and by forming a jog pattern in the first line pattern adjacent to the second line pattern in the resolution control direction. A first pattern with a feature size is formed on a substrate, having an arbitrary pitch and composed of a plurality of first line patterns(14a) repeatedly formed in a first direction. A second pattern is formed between two adjacent first line patterns among the plurality of first line patterns, composed of a plurality of second line patterns(22a) repeated formed in the first direction so that a fine pattern with a half pitch is formed. The first line pattern is disconnected in a second direction vertical to the first direction, and the second line patterns positioned at both sides of the disconnected first line pattern are interconnected in the first direction. A jog pattern(14b) having an end part in the first direction is formed at one side of the first line pattern adjacent to the interconnected second line pattern to disconnect the second line pattern in the second direction. The fine pattern can be a line and space pattern.
    • 提供一种使用双重图案形成技术形成半导体器件的精细图案的方法,用于通过在与分辨率控制方向垂直的方向上容易地将第一线图案分离,而不管分辨率如何,通过形成 在分辨率控制方向上与第二线图案相邻的第一线图案中的点动图案。 具有特征尺寸的第一图案形成在具有任意间距的基板上,并且由在第一方向上重复形成的多个第一线图案(14a)组成。 在多个第一线图案中的两个相邻的第一线图案之间形成第二图案,所述第一线图案由在第一方向上重复形成的多个第二线图案(22a)组成,从而形成具有半间距的精细图案。 第一线图案在与第一方向垂直的第二方向上断开,并且位于不连接的第一线图案的两侧的第二线图案在第一方向上互连。 具有在第一方向上具有端部的点动图案(14b)形成在与互连的第二线图案相邻的第一线图案的一侧,以沿第二方向断开第二线图案。 精细图案可以是线和空格。
    • 42. 发明授权
    • 다마신 공정을 이용한 반도체 소자의 미세 금속 배선 패턴형성 방법
    • 形成半导体器件的精细金属模型的方法
    • KR100817088B1
    • 2008-03-26
    • KR1020070016797
    • 2007-02-16
    • 삼성전자주식회사
    • 고차원남정림여기성김상진정성곤
    • H01L21/28
    • H01L21/76816H01L21/0337H01L21/0338H01L21/31144H01L21/32115H01L21/32134
    • A method for forming a fine metal interconnection pattern of a semiconductor device using a damascene process is provided to easily embody various patterns with different sizes and pitches in a cell array region and a peripheral circuit region by using a layout used for directly patterning a predetermined conductive layer into an embossed pattern. An insulation layer is formed on a substrate(100). A plurality of mold patterns are disposed as a first layout on the insulation layer to expose the insulation layer through a first space. A metal hard mask pattern is formed in the first space by a damascene process. The mold pattern is eliminated. The insulation layer is etched by using the metal hard mask pattern as an etch mask to form a second space penetrating the insulation layer so that an insulation layer pattern(120a) having a positive pattern of the same layout as the first layout is formed. A metal interconnection pattern(150) having the same layout as the first layout is formed in the second space by a damascene process. The metal hard mask pattern and the metal interconnection pattern can include the same material.
    • 提供一种使用镶嵌工艺形成半导体器件的精细金属互连图案的方法,以便通过使用用于直接图案化预定导电的布局容易地体现在单元阵列区域和外围电路区域中具有不同尺寸和间距的各种图案 层成为压花图案。 在基板(100)上形成绝缘层。 在绝缘层上设置多个模具图案作为第一布局,以通过第一空间暴露绝缘层。 金属硬掩模图案通过镶嵌工艺形成在第一空间中。 模具图案被消除。 通过使用金属硬掩模图案作为蚀刻掩模来蚀刻绝缘层,以形成穿过绝缘层的第二空间,从而形成具有与第一布局相同布局的正图案的绝缘层图案(120a)。 通过镶嵌工艺在第二空间中形成具有与第一布局相同布局的金属互连图案(150)。 金属硬掩模图案和金属互连图案可以包括相同的材料。
    • 43. 发明授权
    • 핀 형태의 활성영역을 갖는 반도체소자 및 그의 제조방법
    • 具有FIN类型活性区域的半导体器件及其制造方法
    • KR100817074B1
    • 2008-03-26
    • KR1020060110180
    • 2006-11-08
    • 삼성전자주식회사
    • 강현재이지영조한구여기성
    • H01L21/336
    • H01L29/7851H01L29/66795
    • A semiconductor device having an active region of a fin type is provided to easily form an active region by performing an isolation process on the major axis of an active region and by forming an active region while an isolation process is performed. A first isolation layer(110) of a groove type is disposed along the direction of the major axis of an active region(130) of an island type, separated from the active region by a predetermined interval. A trench is formed in the direction of the minor axis of the active region to define the active region. Mutually insulated gate electrodes are formed, covering the exposed sidewall of the active region. The process for forming the first isolation layer can include the following steps. A hard mask layer is formed on a semiconductor substrate(100c). A first resist pattern for defining a first isolation region is formed on the hard mask layer. The hard mask layer and the semiconductor substrate are etched according to the shape of the first resist pattern to form a groove. An isolation material layer is filled in the groove to form the first isolation layer.
    • 提供具有翅片型活性区域的半导体器件,以通过在有源区的长轴上进行隔离处理并且在进行隔离处理的同时形成有源区来容易地形成有源区。 沿着与有源区分离预定间隔的岛型有源区(130)的长轴的方向设置有沟槽型的第一隔离层(110)。 在有源区的短轴方向上形成沟槽以限定有源区。 形成相互绝缘的栅电极,覆盖有源区的暴露的侧壁。 形成第一隔离层的方法可以包括以下步骤。 在半导体衬底(100c)上形成硬掩模层。 用于限定第一隔离区域的第一抗蚀剂图案形成在硬掩模层上。 根据第一抗蚀剂图案的形状蚀刻硬掩模层和半导体衬底,以形成沟槽。 隔离材料层填充在沟槽中以形成第一隔离层。
    • 47. 发明授权
    • 반도체 소자의 정렬키
    • 半导体器件的对准键
    • KR100591774B1
    • 2006-06-26
    • KR1020040065145
    • 2004-08-18
    • 삼성전자주식회사
    • 이두열여기성우상균
    • H01L21/027
    • 반도체 소자의 정렬키를 제공한다. 이 정렬키는 일변의 폭이 대향하는 변의 폭보다 넓은 사다리꼴의 트렌치 패턴 및 메사 패턴이 번갈아 반복적으로 배열되어 이루어지되, 상기 트렌치 패턴의 장변과 상기 메사 패턴의 단변이 이웃하여 배열된다. 상기 트렌치 패턴 및 상기 메사 패턴의 배열은 박스 형상을 이룰 수 있다. 또한, 상기 트렌치 패턴 및 상기 메사 패턴의 배열과 인접하여 이들의 배열과 면대칭인 배열이 위치할 수도 있다.
    • 并提供半导体器件的对准键。 对准键被jidoe梯形比计数器宽度单变量交替重复排列,长边和沟槽图案的台面图案的短边被布置在附近的宽度的宽侧的沟槽图案和台面图案制成。 沟槽图案和台面图案的布置可以是盒形的。 另外,邻近于所述沟槽图案的布置,和台面可以是这些阵列的图案和平面对称的阵列位置。