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    • 31. 发明公开
    • 검사용 데이터 작성 장치, 검사용 데이터 작성 방법, 기록 매체에 기록된 프로그램 및 그 프로그램을 기록한 기록 매체
    • 用于检查的数据创建设备,用于检查记录媒体中记录的程序的数据创建方法和记录的程序的记录媒体
    • KR1020160006119A
    • 2016-01-18
    • KR1020150096156
    • 2015-07-06
    • 히오끼 덴끼 가부시끼가이샤
    • 다케우치고로
    • G01R31/28G01R1/067
    • 양단에검사포인트가없는전자부품의검사용데이터에대한자동적인작성율을높인다. 검사대상부품을선택하는부품선택처리(81), 검사대상부품을포함하는회로망의정상회로네트리스트를작성하는처리(82), 이회로망의검사대상부품을임의의 1개의고장상태로고장나게했을때의고장회로네트리스트를작성하는처리(83), 정상인이 회로망을 1종류이상의검사기능으로검사했을때의정상시검사결과를검사기능마다시뮬레이션하여구하는처리(84), 고장나있는이 회로망을 1종류이상의검사기능으로검사했을때의고장시검사결과를검사기능마다시뮬레이션하여구하는처리(85), 및검사기능마다의정상시검사결과와고장시검사결과를비교하여상이할때, 이상이한검사기능으로이 회로망을검사한다는검사내용을개별검사용데이터로하는처리(86)를, 모든검사대상부품에대하여실행한다.
    • 本发明可以提高电子部件的检查数据的自动写入速度,而不需要两端的检查点。 本发明对所有检查对象部件执行以下处理:选择检查对象成分的部件选择处理(81) 写入包括检查对象成分的电路网络的正常电路网表的处理(82) 当生成电路网络的检查对象部件中的预期误差时,写入故障电路网列表的处理(83) (84)模拟通过对每个检查功能使用至少一个检查功能检查正常电路网络时产生的正常检查结果的处理; 通过使用至少一个检查功能来检查故障电路网络时模拟故障检查结果的处理(85); 以及当每个检查功能的故障检查结果和正常检查结果作为各个检查数据而不同时,使用检查电路网络检查内容的过程使用不同的检查功能。
    • 34. 发明公开
    • 기판 검사 장치 및 기판 검사 방법
    • 检查板的装置和方法
    • KR1020140009027A
    • 2014-01-22
    • KR1020130077629
    • 2013-07-03
    • 히오끼 덴끼 가부시끼가이샤
    • 시오이리아키히로무라야마린타로
    • G01R31/28G01R27/26
    • The present invention does not bring the higher increase of inspection costs and shortens an inspection time enough and accurately inspect a defect regardless of surface mount or built-in. When a substrate (20) in which a capacitive element (30) is mounted is inspected, each probe (11) for inspection is moved for the substrate (20) to be inspected and the probe (11) for inspection is probed on an inspection point (P1) defined on a conductor pattern (21a) in which an electrode (32a) for connection is connected at the capacitive element (30). The probe (11) for inspection is probed on an inspection point (P2) defined on a conductor pattern (21b) in which an electrode (32b) for connection is connected at the capacitive element (30). The present invention measures a dissipation factor between the inspection points (P1, P2) and determines a defect between conductor patterns (21a, 21b) when the dissipation factor which exceeds a predetermined value is measured.
    • 本发明不会带来更高的检查费用的增加,并且缩短检查时间足够准确地检查缺陷,而不管表面安装或内置。 当检查安装有电容元件(30)的基板(20)时,移动用于检查的基板(20)的检查用探针(11),对检查用探针(11)进行检查 (P1),其中在电容元件(30)处连接有用于连接的电极(32a)的导体图案(21a)。 用于检查的探针(11)在限定在导体图案(21b)上的检查点(P2)上探测,其中用于连接的电极(32b)连接在电容元件(30)处。 本发明在测量超过预定值的耗散因子时,测量检查点(P1,P2)之间的损耗因数,并确定导体图案(21a,21b)之间的缺陷。
    • 37. 发明公开
    • 회로 기판 검사 방법 및 회로 기판 검사 장치
    • 测试电路板和电路板测试装置的方法
    • KR1020110011567A
    • 2011-02-08
    • KR1020100071835
    • 2010-07-26
    • 히오끼 덴끼 가부시끼가이샤
    • 반가즈히로
    • G01R31/306G01R31/02
    • PURPOSE: A method of inspecting a circuit substrate and a apparatus thereof are provided to inspect the connecting state of the integrated circuit mounted in a circuit board regardless of a parasitic diode. CONSTITUTION: A power probe(2) and a ground probe(3) supply power voltage between wiring patterns(14h,14d) which are connected to a power terminal and a ground terminal respectively. An inspection probe(4a-4f) is connected to wire patterns(14a-14c) which are connected to the terminal group the integrated circuit(12). A power supply unit(6) supplies a reference voltage to an inspection probe. A processing unit compares a measured current consumption supplied to the integrated circuit with reference current consumption to inspect the connecting state of the integrated circuit.
    • 目的:提供检查电路基板的方法及其装置,以检查安装在电路板中的集成电路的连接状态,而不管寄生二极管如何。 构成:电源探头(2)和接地探针(3)分别在连接到电源端子和接地端子的接线图案(14h,14d)之间提供电源电压。 检查探针(4a-4f)连接到与集成电路(12)的端子组连接的导线图案(14a-14c)。 电源单元(6)向检查探针提供参考电压。 处理单元将提供给集成电路的测量电流消耗与参考电流消耗进行比较,以检查集成电路的连接状态。