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    • 33. 发明授权
    • 감광성 폴리이미드 조성물, 폴리이미드 필름 및 이를 이용한 반도체 소자
    • 感光性聚酰亚胺组合物,聚酰亚胺膜和使用其的半导体器件
    • KR100833706B1
    • 2008-05-29
    • KR1020070010485
    • 2007-02-01
    • 삼성전자주식회사
    • 정명섭이상목이진규
    • C08L79/08C08G73/00C08J5/18H01L21/00
    • C08L79/08C08G73/101C08G73/1014C08G73/1039G03F7/0392Y10S430/107
    • A chemically amplified photosensitive polyimide composition, a polyimide film prepared by using the composition, and a semiconductor device containing the polyimide film are provided to allow the composition to be cured at a low temperature of 150 deg.C or less and to improve production yield and reliance remarkably in highly integrated memory semiconductor packaging process. A chemically amplified photosensitive polyimide composition comprises a polyhydroxyimide represented by the formula 1 as a base resin; a crosslinking aid having at least two vinyl ether groups; and a photoacid generator which is dissociated by the irradiation of UV rays so as to generate an acid, wherein X is a tetravalent aromatic or aliphatic organic group; Y is a tetravalent aromatic or aliphatic organic group; Z is H or a crosslinkable monovalent organic group; and n is an integer of 1-1,000.
    • 提供化学放大光敏聚酰亚胺组合物,使用该组合物制备的聚酰亚胺膜和含有聚酰亚胺膜的半导体装置,以使组合物在150℃或更低的低温下固化并提高产率和 在高度集成的存储器半导体封装过程中显着地依赖。 化学增幅光敏聚酰亚胺组合物包含由式1表示的聚羟基酰亚胺作为基础树脂; 具有至少两个乙烯基醚基团的交联助剂; 以及通过紫外线的照射而离解以产生酸的光致酸产生剂,其中X为四价芳族或脂族有机基团; Y是四价芳族或脂族有机基团; Z是H或可交联的一价有机基团; n为1-1000的整数。