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21. 发明授权

KR101471829B1 칩 서미스터 및 그 제조 방법 有权
标题翻译：芯片热敏电阻及其制造方法
公开(公告)号：KR101471829B1
公开(公告)日：2014-12-24
申请号：KR1020137000335
申请日：2011-06-21
申请人： 티디케이가부시기가이샤
发明人： 사이토요 , 야마다고우키 , 쓰치다다이스케
IPC分类号： H01C7/04
CPC分类号： H01C7/008 , H01C1/1413 , H01C7/023 , H01C7/04 , H01C7/043 , H01C17/00 , H01C17/006 , Y10T29/49085
摘要： 칩서미스터(1)는 Mn, Ni 및 Co의각 금속산화물을주성분으로하는세라믹스로이루어지는서미스터부(7)와, Ag-Pd와 Mn, Ni 및 Co의각 금속산화물의복합재료로이루어지고또한서미스터부(7)를사이에개재하도록그 양측에배치되는한 쌍의컴포지트부(9, 9)와, 한쌍의컴포지트부(9, 9) 각각에접속되는외부전극(5, 5)을구비하고있다. 이와같이, 한쌍의컴포지트부(9, 9)를벌크전극으로서사용하고있기때문에, 칩서미스터(1)의저항값을조정하는데, 서미스터부(7)에있어서의저항을주로고려하면되고, 외부전극(5, 5)간의거리등을그다지고려할필요가없어진다.

22. 发明授权

KR101451554B1 회로 보호 장치 有权
标题翻译：电路保护装置
公开(公告)号：KR101451554B1
公开(公告)日：2014-10-17
申请号：KR1020140049889
申请日：2014-04-25
申请人： 스마트전자 주식회사
发明人： 강두원 , 김현창 , 문황제 , 신아람 , 강태헌 , 안상민
IPC分类号： H01C1/024 , H01C7/04
CPC分类号： H01C1/1413 , H01C1/024 , H01C1/16 , H01C7/04
摘要： A circuit protection device is disclosed. The circuit protection device includes a case (10), an NTC thermistor (20), and a resistor (30). An input line (23) of the NTC thermistor (20) is connected to an input line (33) of the resistor (30) by an input connecting part (40). An output line (24) of the NTC thermistor (20) is connected to an output line (34) of the resistor (30) by an output connecting part (50). The thermistor (20) has a planar shape. The resistor (30) has a rod shape. The resistor (30) is arranged on the center of the NTC thermistor (20). A central line of a longitudinal direction of the resistor (30) is parallel to the NTC thermistor (20). Thereby, thermal imbalance is reduced by the mutual thermal influence of the resistor and the NTC thermistor.
摘要翻译：公开了一种电路保护装置。电路保护装置包括壳体（10），NTC热敏电阻器（20）和电阻器（30）。 NTC热敏电阻（20）的输入线（23）通过输入连接部（40）与电阻（30）的输入线（33）连接。 NTC热敏电阻（20）的输出线（24）通过输出连接部（50）与电阻（30）的输出线（34）连接。热敏电阻（20）具有平面形状。电阻器（30）具有杆形状。电阻器（30）设置在NTC热敏电阻（20）的中心。电阻器（30）的纵向方向的中心线与NTC热敏电阻（20）平行。因此，通过电阻器和NTC热敏电阻的相互热影响，热不平衡被降低。

23. 发明公开

KR1020120111214A 바리스터 모듈 有权
标题翻译： VARISTOR模块
公开(公告)号：KR1020120111214A
公开(公告)日：2012-10-10
申请号：KR1020110029599
申请日：2011-03-31
申请人： 주식회사 아모텍
发明人： 이재욱 , 황윤호 , 류재수 , 주현태 , 임병국 , 김리언
IPC分类号： H01C7/10 , H02H9/04
CPC分类号： H01C7/18 , H01C1/1406 , H01C1/1413 , H01C7/02 , H01C7/04 , H01C7/10
摘要： PURPOSE: A varistor module is provided to prevent damage to a varistor due to an over current by reducing power supply to a varistor small body when temperature of the varistor module is increased. CONSTITUTION: Terminal parts(110a,110b) are used as an input terminal and an output terminal. A varistor part is laminated on the top of the terminal parts. Electrode parts(130a,130b) are laminated on the upper surface of the varistor part. An element protection part(140) is laminated on the top of the electrode parts. A resistance value of the element protection part is increased when temperature of the varistor part is increased. The terminal parts comprise a pair of terminal patterns.
摘要翻译：目的：提供压敏电阻模块，以防止压敏电阻模块的温度升高时，通过减少对变阻器小体的电源，由于过电流而损坏变阻器。构成：端子部分（110a，110b）用作输入端子和输出端子。端子部分的顶部层压有变阻器部分。电极部件（130a，130b）层压在压敏电阻部件的上表面上。元件保护部件（140）层压在电极部件的顶部上。当压敏电阻部件的温度升高时，元件保护部件的电阻值增加。端子部分包括一对端子图案。

24. 发明公开

KR1020120018714A 세라믹 전자부품 有权
标题翻译：陶瓷电子元件
公开(公告)号：KR1020120018714A
公开(公告)日：2012-03-05
申请号：KR1020110072318
申请日：2011-07-21
申请人： 가부시키가이샤 무라타 세이사쿠쇼
发明人： 요시다아키히로
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/12 , H01C1/1406 , H01C1/1413 , H01C7/18 , H01F17/0013 , H01F27/292 , H01G4/012 , H01G4/232 , H01G4/30 , H01L41/0472
摘要： PURPOSE: A ceramic electronic component is provided to suppress cracks by forming a reinforcement layer in a ceramic body. CONSTITUTION: A ceramic electronic component includes a first reinforcement layer(17a). The first reinforcement layer is formed on a first outer layer along a length direction and a width direction. A part of the first reinforcement layer faces a first part(13a). The first reinforcement layer is not exposed to a first cross section and a second cross section.
摘要翻译：目的：提供陶瓷电子部件，通过在陶瓷体中形成加强层来抑制裂纹。构成：陶瓷电子部件包括第一加强层（17a）。第一加强层沿长度方向和宽度方向形成在第一外层上。第一加强层的一部分面向第一部分（13a）。第一加强层不暴露于第一横截面和第二横截面。

25. 发明授权

KR101110482B1 고절연 특성 부온도계수(ＮＴＣ) 써미스터 有权
标题翻译：高绝缘特性负温度系数热敏电阻
公开(公告)号：KR101110482B1
公开(公告)日：2012-02-20
申请号：KR1020110125660
申请日：2011-11-29
申请人： 디에스씨전자 주식회사
发明人： 한규수
IPC分类号： H01C7/04
CPC分类号： H01C1/024 , H01C1/1413 , H01C7/04 , H01C7/043 , H01C17/06533
摘要： PURPOSE: A highly insulated NTC(Negative Temperature Coefficient) thermistor molded in an external case is provided to improve durability and insulation property by rapidly absorbing and discharging heat generated from an element when power is applied. CONSTITUTION: An element(10) includes a lead line(11). A ceramic case(20) has a space unit(21) and a lead line outlet(22). The lead line is outputted through the lead line outlet. The ceramic case is compressed with MgO+SiO2 materials. A spacing unit(24) is formed between guide protrusions(23). The guide protrusions are protruded from both lower sides of the ceramic case. An adhesive resin unit(30) is filled between the spacing unit and the element and is made of ceramic resin.
摘要翻译：目的：提供一种在外壳中模制的高度绝缘的NTC（负温度系数）热敏电阻，用于通过在施加电力时快速吸收和排出元件产生的热量来提高耐久性和绝缘性。构成：元件（10）包括引线（11）。陶瓷壳体（20）具有空间单元（21）和引出线出口（22）。引线通过引线插座输出。陶瓷外壳用MgO + SiO2材料压制。间隔单元（24）形成在引导突起（23）之间。引导突起从陶瓷壳体的两个下侧突出。粘合树脂单元（30）填充在间隔单元和元件之间，并由陶瓷树脂制成。

26. 发明授权

KR100369312B1 온도 센서, 온도 센서의 제조 방법, 및 온도 센서를 회로기판에 장착하는 방법 失效
标题翻译： 온도센서，온도센서의제조방법，및온도센서를회로기판에장착하는방법
公开(公告)号：KR100369312B1
公开(公告)日：2003-01-24
申请号：KR1020000017569
申请日：2000-04-04
申请人： 가부시키가이샤 무라타 세이사쿠쇼
发明人： 가와모토데츠야 , 야마다히데키 , 고바야시히로유키 , 시마다미노루 , 오무라긴고 , 와카바야시아사미
IPC分类号： G01K1/08
CPC分类号： G01K1/14 , H01C1/1413
摘要： Temperature sensors are produced by first producing temperature sensing elements each having electrodes on its mutually oppositely facing main surfaces, next forming a lead frame comprising a linearly elongated base part and a plurality of pairs of planar lead parts extending perpendicularly from said base part, twisting each of these planar lead parts such that each of the pairs has top end parts which face each other with a gap therebetween, inserting one of the temperature sensing elements between the mutually facing top end parts of each pair in the corresponding gap and electrically connecting the electrodes on the inserted temperature sensing element individually to the top end parts of the corresponding pair, and cutting each of the planar lead parts from said base part to form lead terminals of specified lengths for the temperature sensors. Each of the planar lead parts is provided with a semicircular kinked part distal from the top end part such that the kinked parts of each of the pairs of planar lead parts are bent in a same direction with respect to each other and in a side-by-side relationship.
摘要翻译：温度传感器通过首先产生温度传感元件来制造，每个温度传感元件在其相互面对的主表面上具有电极，接下来形成引线框架，该引线框架包括线性细长的基座部分和从该基座部分垂直延伸的多对平面引线部分，这些平面引线部分中的每一对具有顶端部分，所述顶端部分彼此相对并具有间隙，将温度传感元件中的一个插入在每对的相互面对的顶端部分之间的相应间隙中，并且将电极在所插入的温度感测元件上单独地连接到相应的一对的顶端部分，并且从所述基底部分切割每个平面引线部分以形成用于温度传感器的特定长度的引线端子。每个平面引线部分设置有远离顶端部分的半圆形弯折部分，使得每对平面引线部分的弯折部分在相同方向上相对于彼此弯曲并且以并排方式弯曲边关系。

27. 发明公开

KR1020020063121A 서미스터 및 제조 방법 失效
标题翻译：热敏电阻及其制造方法
公开(公告)号：KR1020020063121A
公开(公告)日：2002-08-01
申请号：KR1020020004097
申请日：2002-01-24
申请人： 코너스톤 센서스, 인코포레이티드
发明人： 라베누타그렉
IPC分类号： H01C7/02
CPC分类号： H04L67/025 , G01K7/226 , H01C1/1406 , H01C1/1413 , H01C17/28 , H01C17/288 , H04L29/06 , H04L67/02 , H04L69/329
摘要： PURPOSE: A thermistor and a method of manufacture are provided to obtain a cost effective thermistor with electrodes having a high degree of solder leach resistance and which is able to withstand soldering processes operating at temperatures between 200 Deg.C and 380 Deg.C with dwell times between 5 seconds and 3 minutes. CONSTITUTION: A thermistor(100) comprises a semiconductor body having two surfaces, a first electrode layer deposited outward of the surfaces of the semiconductor body, wherein the first layer is formed of a first electrode material containing a conductive metal and has a thickness of 5 micrometers or larger, a second electrode layer deposited outward of the first layer, wherein the second layer is formed of a second electrode material containing a reactive metal and has a thickness of 5 micrometers or smaller, a third electrode layer deposited outward of the second layer, wherein the third layer is formed of a third electrode material containing a barrier metal and has a thickness of 5 micrometers or smaller, and optionally, a fourth electrode layer(12d) deposited outward of the third layer, wherein the fourth layer is formed of a fourth electrode material and has a thickness of 5 micrometers or smaller.
摘要翻译：目的：提供一种热敏电阻和制造方法，以获得具有高度焊料浸出电阻的电极的成本效益的热敏电阻，并且能够承受在200Cg和380Ce之间的温度下操作的焊接工艺时间在5秒到3分钟之间。构造：热敏电阻（100）包括具有两个表面的半导体本体，从半导体本体的表面向外沉积的第一电极层，其中第一层由包含导电金属的第一电极材料形成，并且具有5 微米或更大的第二电极层，其中第二电极层沉积在第一层的外部，其中第二层由包含反应性金属的第二电极材料形成，并且具有5微米或更小的厚度;第三电极层，其沉积在第二层的外侧，其中所述第三层由包含阻挡金属的第三电极材料形成并且具有5微米或更小的厚度，以及任选地，沉积在所述第三层的外侧的第四电极层（12d），其中所述第四层由第四电极材料，并且具有5微米或更小的厚度。

28. 发明授权

KR100312734B1 부특성 서미스터 有权
标题翻译： NTC热敏电阻
公开(公告)号：KR100312734B1
公开(公告)日：2001-11-03
申请号：KR1019990018463
申请日：1999-05-21
申请人： 가부시키가이샤 무라타 세이사쿠쇼
发明人： 미하라겐지로
IPC分类号： H01C7/04
CPC分类号： H01C1/1413 , H01C1/014 , H01C1/022
摘要： 본발명은, 평면부특성(NTC) 서미스터소자, 한쌍의전원-공급단자들및 상기서미스터소자및 상기단자들이내부에수납되는케이스로구성된부특성서미스터를제공한다. 상기평면부특성서미스터는, 서로대향하는한 쌍의측면상에형성되고, 상기전원-공급단자들중 하나와각각접속되는전극들을갖는다. 상기평면부특성서미스터의주면중 적어도하나는상기케이스의내벽과면 접촉(surface-to-surface contact)되어, 상기서미스터소자의유효열용량을증가시킨다. 이러한부특성서미스터는, 전자복사기의전원과전기적열원사이에직렬로삽입되면, 상기전원이스위치-온될때, 돌입전류(rush current)를효과적으로억제할수 있다.

29. 发明公开

KR1020010025653A 칩부품의 외부단자전극 및 그 제조방법 无效
标题翻译：芯片部件的终止及其制造方法
公开(公告)号：KR1020010025653A
公开(公告)日：2001-04-06
申请号：KR1020010002125
申请日：2001-01-15
申请人： 주식회사 모다이노칩
发明人： 엄우식 , 김덕희 , 박인길
IPC分类号： H05K3/40
CPC分类号： H01G4/232 , H01C1/1406 , H01C1/1413 , H01C17/283 , H05K3/3442
摘要： PURPOSE: A termination of a chip part and a method for manufacturing the terminal electrode are provided to obtain an excellent soldering efficiency by specially designing the termination of the chip part to prevent the leaching phenomenon. CONSTITUTION: A molding sheet for a device is manufactured by using a slurry. An electrode paste is printed on a sheet so as to have a wanted shape. By printing the electrode paste, an interior electrode is formed. The molding sheet in which the interior electrode is printed is stacked so as to have at least two layers. By stacking the molding sheet, an element assembly for a device is formed. The first termination(45) is formed at both end portions of the element assembly. The termination is connected to an interior electrode by using an Ag/Pd, Ag/Pt, or Ag/Pd/Pt paste. An Sn or Sn/Pb gilding layer is formed on the first termination(45).
摘要翻译：目的：通过专门设计芯片部件的端接以防止浸出现象，提供芯片部件的端接和端子电极的制造方法以获得优异的焊接效率。构成：通过使用浆料制造装置用成型片。将电极浆料印刷在片材上以具有想要的形状。通过印刷电极浆料，形成内部电极。印刷有内部电极的成型片层叠成至少两层。通过堆叠成型片，形成用于器件的元件组件。第一终端（45）形成在元件组件的两个端部处。端子通过使用Ag / Pd，Ag / Pt或Ag / Pd / Pt浆料连接到内部电极。在第一端子（45）上形成Sn或Sn / Pb镀金层。

30. 发明公开

KR1019990088480A 부특성 서미스터 有权
标题翻译： NTC热敏电阻
公开(公告)号：KR1019990088480A
公开(公告)日：1999-12-27
申请号：KR1019990018463
申请日：1999-05-21
申请人： 가부시키가이샤 무라타 세이사쿠쇼
发明人： 미하라겐지로
IPC分类号： H01C7/04
CPC分类号： H01C1/1413 , H01C1/014 , H01C1/022
摘要： 본발명은, 평면부특성(NTC) 서미스터소자, 한쌍의전원-공급단자들및 상기서미스터소자및 상기단자들이내부에수납되는케이스로구성된부특성서미스터를제공한다. 상기평면부특성서미스터는, 서로대향하는한 쌍의측면상에형성되고, 상기전원-공급단자들중 하나와각각접속되는전극들을갖는다. 상기평면부특성서미스터의주면중 적어도하나는상기케이스의내벽과면 접촉(surface-to-surface contact)되어, 상기서미스터소자의유효열용량을증가시킨다. 이러한부특성서미스터는, 전자복사기의전원과전기적열원사이에직렬로삽입되면, 상기전원이스위치-온될때, 돌입전류(rush current)를효과적으로억제할수 있다.

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