会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明授权
    • 이미지 드럼의 제조방법 및 이미지 드럼
    • 이미지드럼의제조방법및이미지드럼
    • KR100727899B1
    • 2007-06-14
    • KR1020050122876
    • 2005-12-14
    • 삼성전자주식회사
    • 배기덕신규호백계동권순철최원경이창승
    • G03G15/02
    • A method for manufacturing an image drum and an image drum are provided to easily manufacture the image drum by bonding a chip to a flexible PCB(Printed Circuit Board) and putting the flexible PCB around a drum body to improve printing quality. A flexible PCB(120) on which a plurality of ring electrodes(125) is formed is provided. The ring electrodes are electrically insulated from one another and arranged in parallel. A control unit(130) is bonded to the surface of the flexible PCB. The control unit independently applies voltages to the respective ring electrodes. Contact ends of the flexible PCB, which are respectively adjacent to both ends of the ring electrodes, come into contact with each other. The ring electrodes form a single ring structure. The ring electrodes are electrically connected or disconnected.
    • 提供一种用于制造图像鼓和图像鼓的方法,以通过将芯片接合到柔性PCB(印刷电路板)并将柔性PCB围绕鼓体以提高印刷质量而容易地制造图像鼓。 提供了其上形成有多个环形电极(125)的柔性PCB(120)。 环形电极彼此电绝缘并且平行布置。 控制单元(130)结合到柔性PCB的表面。 控制单元独立地向各个环形电极施加电压。 分别与环形电极的两端相邻的柔性PCB的接触端彼此接触。 环形电极形成单环结构。 环形电极电连接或断开。
    • 12. 发明授权
    • 이미지 드럼 및 이미지 드럼의 제작방법
    • 图片版权归图片所有
    • KR100728054B1
    • 2007-06-13
    • KR1020050123852
    • 2005-12-15
    • 삼성전자주식회사
    • 최원경신규호백계동권순철이창승배기덕
    • G03G15/02
    • An image drum and a method for manufacturing the image drum are provided to form connecting parts for connecting ring electrodes with a terminal of a control chip without using laser precision machining to reduce the manufacturing cost and improve productivity. A cylindrical drum body(110) is prepared. A PCB(Printed Circuit Board)(300) including a control chip for applying a voltage to an image drum and a terminal connected to the control chip is bonded to the inside of the drum body in such a manner that the terminal is exposed to the outside of the drum body. A sacrificial structure is formed on the terminal. A region of the PCB other than the sacrificial structure is coated with an insulating material. The sacrificial structure is removed to form connecting holes. The connecting holes are filled with a conductive material. A plurality of ring electrodes is formed in parallel on the drum body and the exposed portion of the PCB in such a manner that the ring electrodes come into contact with the conductive material.
    • 提供一种成像鼓和用于制造成像鼓的方法,以形成用于将环形电极与控制芯片的端子连接的连接部件,而不使用激光精密加工来降低制造成本并提高生产率。 准备圆柱形的鼓体(110)。 包括用于将电压施加到图像鼓的控制芯片和连接到控制芯片的端子的PCB(印刷电路板)(300)以这样的方式结合到鼓体的内部,使得端子暴露于 在鼓体外面。 在终端上形成牺牲结构。 除了牺牲结构之外的PCB的区域涂覆有绝缘材料。 牺牲结构被去除以形成连接孔。 连接孔填充有导电材料。 多个环形电极平行地形成在鼓体和PCB的暴露部分上,使得环形电极与导电材料接触。
    • 15. 发明授权
    • 마이크로미러 액튜에이터
    • 마이크로미러액튜에이터
    • KR100400223B1
    • 2003-10-01
    • KR1020010025984
    • 2001-05-12
    • 삼성전자주식회사
    • 윤용섭민영훈배기덕
    • G02B26/08
    • G02B6/357G02B6/3518G02B6/3546G02B6/358G02B6/3584
    • A micromirror actuator having a micromirror, which is operative using an electrostatic force with a low voltage and wherein an electrostatic force opposite to the driving force of the micromirror is blocked, and a method for manufacturing the same, are provided. The micromirror actuator includes a substrate, a trench in which at least one electrode is formed, supporting posts installed at opposite sides of the trench, a torsion bar supported by the supporting posts, and the micromirror including a driving unit which faces the trench when the micromirror is in a horizontal state, and a reflecting unit, which is elastically rotated about the torsion bar, to reflect an optical signal. The actuator also includes a shielding electrode installed to face the reflecting unit when the micromirror is in a horizontal state and to block an electrostatic force occurring between the reflecting unit and the electrode.
    • 提供一种微镜致动器及其制造方法,该微镜致动器具有利用低电压的静电力进行动作并且与微镜的驱动力相反的静电力被阻止的微镜。 微镜致动器包括基板,其中形成至少一个电极的沟槽,安装在沟槽的相对侧处的支柱,由支柱支撑的扭杆以及包括驱动单元的微镜,当驱动单元 微反射镜处于水平状态,反射单元围绕扭杆弹性旋转,以反射光信号。 致动器还包括屏蔽电极,当微反射镜处于水平状态时,该屏蔽电极被安装为面对反射单元并且阻挡在反射单元和电极之间发生的静电力。
    • 16. 发明公开
    • 점착 방지 미세 구조물 제조 방법
    • 用于制造MEMS防止结构的方法
    • KR1020020091856A
    • 2002-12-11
    • KR1020010030085
    • 2001-05-30
    • 삼성전자주식회사
    • 배기덕윤용섭
    • H01L21/00
    • B81B3/0005
    • PURPOSE: A method for manufacturing a structure of MEMS(Micro Electro Mechanical System) for preventing stiction is provided to prevent micro-structures from being sticked to a substrate. CONSTITUTION: A substrate(100) is prepared. A removable stiction preventing layer(101) used in a dry-etching is formed on the substrate(100). A removable sacrificial layer(103) used in a wet-etching is then formed on the stiction preventing layer(101). A post hole is formed to expose the surface of the substrate(100) by selectively etching the stiction preventing layer(101) and the sacrificial layer(103). A structure layer(109) is formed on the resultant structure including the post hole. An SOG(Silicon On Glass), polysilicon, or photoresist is used as the stiction preventing layer(101). Also, the sacrificial layer(103) is one selected from group consisting of PSG(Phosphosilicaglass), SiO2, Cu, Fe, Mo, Ni, Cr, and TEOS(Tetra Ethyl Ortho Silicate) glass.
    • 目的:提供一种用于制造用于防止静电的MEMS(微机电系统)的结构的方法,以防止微结构粘附到基板上。 构成:制备基材(100)。 在基板(100)上形成有用于干法蚀刻的可移除的防粘层(101)。 然后,在静电防止层(101)上形成用于湿式蚀刻的可移除牺牲层(103)。 通过选择性地蚀刻防止粘着层(101)和牺牲层(103),形成通孔以使基板(100)的表面露出。 在包括柱孔的所得结构上形成结构层(109)。 使用SOG(玻璃上硅),多晶硅或光致抗蚀剂作为防止静电层(101)。 此外,牺牲层(103)是选自由PSG(Phosphosilicaglass),SiO 2,Cu,Fe,Mo,Ni,Cr和TEOS(四乙基正硅酸盐)组成的组中的一种。
    • 20. 发明公开
    • 수동형 유기발광다이오드의 제조방법
    • 无源矩阵有机发光二极管的制造方法
    • KR1020080053736A
    • 2008-06-16
    • KR1020060125658
    • 2006-12-11
    • 삼성전자주식회사
    • 심홍식기인서고익환황억채배기덕이영구
    • H05B33/22H05B33/10
    • H01L51/5237H01L27/3244H01L51/5246H01L51/5253H01L51/56
    • A method for manufacturing a passive matrix organic light emitting diode is provided to improve productivity by reducing the numbers of photoresist layer forming processes and of baking processes accompanied in forming a photoresist layer. A method for manufacturing a passive matrix organic light emitting diode includes the steps of: forming an anode layer(120) on a substrate(110); forming a photoresist layer(130) on the anode layer; forming a cathode isolation films(131) by exposing and etching the photoresist layer; and forming insulating units on a lower part of the cathode isolation films by exposing and etching the photoresist layer with the cathode isolation films again. The method for manufacturing the passive matrix organic light emitting diode includes the steps of: forming light emitting layers between the insulating units; and forming cathode layers between the cathode isolation films.
    • 提供一种用于制造无源矩阵有机发光二极管的方法,通过减少光致抗蚀剂层形成过程的数量和伴随形成光致抗蚀剂层的烘烤过程来提高生产率。 无源矩阵有机发光二极管的制造方法包括以下步骤:在衬底(110)上形成阳极层(120); 在所述阳极层上形成光致抗蚀剂层(130); 通过曝光和蚀刻光致抗蚀剂层形成阴极隔离膜(131); 以及通过再次用阴极隔离膜曝光和蚀刻光致抗蚀剂层,在阴极隔离膜的下部上形成绝缘单元。 无源矩阵有机发光二极管的制造方法包括以下步骤:在绝缘单元之间形成发光层; 并在阴极隔离膜之间形成阴极层。