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    • 122. 发明公开
    • 에지 비드 제거/회전형 세척 건조(EBR/SRD)모듈
    • 边缘珠去除/旋转干燥模块
    • KR1020010049738A
    • 2001-06-15
    • KR1020000038869
    • 2000-07-07
    • 어플라이드 머티어리얼스, 인코포레이티드
    • 스티븐스,조이올가도,도날드코,알렉산더에스.목크,예크-화이에드윈
    • H01L21/304
    • H01L21/6708Y10S134/902
    • PURPOSE: An edge bead removal/spin rinse dry module is provided to remove deposition at the edge of a wafer without damaging the devices formed on the wafer surface. CONSTITUTION: The edge bead removal/spin rinse dry module includes a case(102), a rotating actuator mounted on the support member, a liquid feeder assembly(106) disposed in the case so as to feed etching solution to the periphery of the substrate on the substrate support member. Preferably, the substrate support member has a vacuum chuck(124), and the liquid feeder assembly is provided with one or more nozzles(150). The etching method includes a step for rotating the substrate(122) on the rotatable substrate support member, and a step for feeding the etching solution to a periphery(126) of the substrate. More preferably, the substrate is rotated at the speed of approximately 100 or 1000 rpm, and the etching solution is fed to the periphery of the substrate substantially in the tangential direction and in the incident direction of 0 to 45 deg.C from he surface of the substrate.
    • 目的:提供边缘珠去除/旋转漂洗干燥模块以去除晶片边缘处的沉积,而不会损坏晶片表面上形成的器件。 构成:边缘珠去除/旋转冲洗干燥模块包括壳体(102),安装在支撑构件上的旋转致动器,设置在壳体中的液体供给器组件(106),以将蚀刻溶液供给到基板的周边 在基板支撑构件上。 优选地,衬底支撑构件具有真空吸盘(124),并且液体供给组件设置有一个或多个喷嘴(150)。 蚀刻方法包括用于使基板(122)旋转在可旋转的基板支撑构件上的步骤,以及用于将蚀刻溶液供给到基板的周边(126)的步骤。 更优选地,基板以大约100或1000rpm的速度旋转,并且蚀刻溶液基本上沿切线方向和从0到45度的入射方向从其表面供给到基板的周边 底物。
    • 128. 发明公开
    • 세정 장치 라인 구성 및 그 설계 방법
    • 清洁装置的线路配置及其制造方法
    • KR1020010030537A
    • 2001-04-16
    • KR1020000057255
    • 2000-09-29
    • 르네사스 일렉트로닉스 가부시키가이샤
    • 와께도모꼬
    • H01L21/304
    • H01L21/67253H01L21/02063Y10S134/902Y10S438/906
    • PURPOSE: To provide a method, capable of rationally selecting a wet processing treatment, where chemicals can be shared, in a short time resting on a minimum preliminary test when utilization of common chemicals is promoted eliminating cross contamination caused, by newly adopted materials in a cleaning device line configuration in a silicon semiconductor device manufacturing process. CONSTITUTION: An element possible for causing cross contamination is added previously to chemicals which are used in a wet processing treatment, a silicon substrate is dipped into the chemicals and then cleaned, correlation between the element condensation attached to and left on the surface of the substrate and the concentration of the element dissolved in the chemicals is obtained, and when chemicals are shared based on the above result, the upper limit of the concentration of the element left in chemicals due to cross contamination is estimated, and it is determined whether the element deteriorates a semiconductor device in characteristics at its upper limit of concentration and whether chemicals can be shared.
    • 目的:提供一种方法,能够合理选择可以共享化学品的湿法处理,在短时间内,在促进普通化学品利用的同时进行最低限度的初步试验,消除由新采用的材料引起的交叉污染 清洁器件线路配置在硅半导体器件制造过程中。 构成:可以将用于引起交叉污染的元素添加到用于湿处理处理的化学品中,将硅衬底浸入化学品中,然后清洗,附着到衬底和留在衬底表面上的元件冷凝水之间的相关性 并且获得溶解在化学品中的元素的浓度,并且当基于上述结果共享化学品时,估计由于交叉污染而留在化学品中的元素的浓度的上限,并且确定元素 劣化半导体器件的特性在其浓度上限以及是否可以共享化学药品。
    • 129. 发明公开
    • 기판세정구, 기판세정장치 및 기판세정방법
    • 基板清洁装置,基板清洁系统及其相关方法
    • KR1020010015426A
    • 2001-02-26
    • KR1020000042704
    • 2000-07-25
    • 도쿄엘렉트론가부시키가이샤
    • 히로세게이조세키구치겐지이노우에도모히데미야자키다카노리우에노긴야
    • H01L21/304
    • H01L21/67046B08B1/04B08B3/04B08B2203/0288Y10S134/902
    • PURPOSE: A substrate cleaning device, a substrate cleaning system, and a method for the same are provided to protect a substrate from a friction or a scratch and clean efficiently the substrate by maintaining an initial contact pressure. CONSTITUTION: A core material(68) for supplying pure water from a pure water supply path(60) is installed at a head(66) of a cleaning device(24). A plane portion(72) is formed at a lower portion of the core material(68). An outer face of the core material(68) is coated by a porous resin sheet(69). A rod(31) presses the cleaning device(24) to a substrate. An air bearing cylinder(30) is installed to transmit power to the rod(31). The pure water supply path(60) is formed inside the rod(31). The pure water supplied from the pure water supply path(60) is passed through the core material(68) and the porous resin sheet(69). A floating layer of the pure water is formed between the head(66) and the substrate.
    • 目的:提供基板清洁装置,基板清洁系统及其方法,以保护基板免受摩擦或划痕,并通过维持初始接触压力有效地清洁基板。 构成:用于从纯净水供应路径(60)供应纯净水的芯材(68)安装在清洁装置(24)的头部(66)上。 在芯材(68)的下部形成有平面部(72)。 芯材(68)的外表面被多孔树脂片(69)涂覆。 杆(31)将清洁装置(24)按压到基板。 安装空气轴承缸(30)以将动力传递到杆(31)。 纯水供给路径(60)形成在杆(31)的内部。 从纯水供给路径(60)供给的纯水通过芯材(68)和多孔树脂片(69)。 在头部(66)和基底之间形成有纯水的漂浮层。