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    • 110. 发明授权
    • 통기성이 향상된 포장재의 제조방법 및 그 제조방법에 사용되는 전사 몰드의 제조방법
    • 生产具有增强膨胀性的包装材料的方法和以其方法生产转移模具的方法
    • KR101220865B1
    • 2013-01-10
    • KR1020110093222
    • 2011-09-16
    • 한국과학기술원
    • 이상은이강원김진하임헌광이승섭
    • B29C59/02B29C33/38G03F7/00
    • B29C33/38B29K2995/0065B29L2031/712C25D1/10C25D3/12G03F7/0041G03F7/70691
    • PURPOSE: A method for manufacturing a packing material with improved air permeability and a method for manufacturing a transfer mold used for the same are provided to easily form a fine structure with a needle shape for the transfer mold by wet etching for which the anisotropy of etching speed of water is used according to a crystallization direction. CONSTITUTION: A method for manufacturing a packing material with improved air permeability is as follows. A silicon wafer is prepared. An oxide film is formed on a surface of the silicon wafer. The oxide film is patterned by a photolithography process. The silicon wafer is wet-etched anisotropically by using different etching speeds according to a crystallization direction. The oxide film is removed. A metal layer grows on the surface of the silicon wafer. The metal layer is separated from the surface of the silicon wafer so that a transfer mold(6) is obtained. Patterns of the transfer mold are transferred on the packing material so that the air permeability of the packing material is improved.
    • 目的:制造具有改善的透气性的包装材料的制造方法和用于制造其的转移模具的制造方法,以通过湿式蚀刻容易地形成用于转印模具的针形的精细结构,其中蚀刻各向异性 根据结晶方向使用水的速度。 构成:具有改善的透气性的包装材料的制造方法如下。 制备硅晶片。 在硅晶片的表面上形成氧化膜。 通过光刻工艺对氧化膜进行图案化。 根据结晶方向,通过使用不同的蚀刻速度,各向异性地对硅晶片进行湿式蚀刻。 去除氧化膜。 金属层在硅晶片的表面上生长。 金属层与硅晶片的表面分离,从而获得转印模具(6)。 转印模具的图案转印在包装材料上,从而提高包装材料的透气性。