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    • 93. 发明授权
    • 고전기전도도 및 내연화성을 갖는 전기 전자부품용 동합금
    • 用于电气和电子部件的铜合金,具有高导电性和抗软化性
    • KR1019910004379B1
    • 1991-06-26
    • KR1019890002364
    • 1989-02-28
    • 풍산금속공업주식회사
    • 이근수박동규임윤성
    • C22C9/06
    • Cu alloy for electric and electronic parts is composed of 0.02- 0.6 wt.% Cr, 0.02-0.6% wt.% Ni, 0.005-0.20 wt.% Al, 0.01-0.06 wt.% P and the remainder of Cu. Cr has the advantages of promoting strength and annealing resistance property in the composition ranges of 0.01 wt.% and above but it has disadvantages of diminishing electrical conductivity and the additive effect of Ni and P above 0.08 wt.%. The effect of Ni, P and Al on strength and electrical conductivity is similar to Cr. In optimization of Cr, Ni, P and Al contents in Cu matrix, its tensile strength and ductility can be controlled to 42-51 kgf/mm2 and 6.9-9.5%, respectively, its hardness and electrical conductivity can be controlled to 118- 134 in HV and 86.5-95 in IACS%, respectively, and its annealing temperature can be controlled to 500-600 deg.C. The Cu alloy is used for a surface mounting IC and a transistor.
    • 用于电气和电子部件的Cu合金由0.02-0.6重量%的Cr,0.02-0.6重量%的Ni,0.005-0.20重量%的Al,0.01-0.06重量%的P和余量的Cu组成。 Cr具有在0.01重量%以上的组成范围内促进强度和耐退火性能的优点,但是具有降低导电性和Ni和P的添加效果高于0.08重量%的缺点。 Ni,P和Al对强度和导电性的影响与Cr类似。 在Cu基体中Cr,Ni,P和Al含量的优化中,其拉伸强度和延展性分别控制在42-51 kgf / mm2和6.9-9.5%,其硬度和电导率可控制在118〜134 在HV和86.5-95分别在IACS%,其退火温度可以控制在500-600℃。 Cu合金用于表面贴装IC和晶体管。