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91. 发明公开

KR1020130041031A 금속의 표면처리용 수용액 및 금속표면의 변색방지방법 有权
标题翻译：用于表面处理金属的水溶液和用于防止金属表面的分解的方法
公开(公告)号：KR1020130041031A
公开(公告)日：2013-04-24
申请号：KR1020130034258
申请日：2013-03-29
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 오리하시마사노리
IPC分类号： C23C22/03 , C23C22/00 , B23K35/363 , C25D7/00
CPC分类号： H05K3/3473 , C25D5/48 , H01L23/49582 , H01L2224/16 , H01L2224/81801 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/19041 , H01L2924/19043 , H05K2203/0392 , H05K2203/043
摘要： PURPOSE: An aqueous solution for the surface treatment of a metal and a method for preventing the discoloration of a metal surface are provided to ensure good soldering performance and to prevent the discoloration of a tin coated film after heating by using a surface treatment solution. CONSTITUTION: An aqueous solution for the surface treatment of a metal and a method for preventing the discoloration of a metal surface comprise the following steps: activating a substrate by acid; plating the surface of substrate with a tin film; treating the tin film with an aqueous solution which contains one or more amino acid selected from a group containing glycine and L-arginine; and reflow-treating the tin film.
摘要翻译：目的：提供用于表面处理金属的水溶液和防止金属表面变色的方法，以确保良好的焊接性能，并且通过使用表面处理溶液来加热后防止锡涂膜变色。构成：用于表面处理金属的水溶液和防止金属表面变色的方法包括以下步骤：用酸活化底物; 用锡膜电镀衬底表面; 用含有一个或多个选自甘氨酸和L-精氨酸的氨基酸的水溶液处理锡膜; 并对锡膜进行回流处理。

92. 发明公开

KR1020120092683A 땜납 페이스트용 플럭스 및 땜납 페이스트 有权
标题翻译：焊膏，焊膏
公开(公告)号：KR1020120092683A
公开(公告)日：2012-08-21
申请号：KR1020127016875
申请日：2010-12-06
申请人： 아라까와 가가꾸 고교 가부시끼가이샤 , 가부시키가이샤 코키 , 하리마카세이 가부시기가이샤
发明人： 이와무라,에이지 , 고토,카즈시 , 나가사카,신스케 , 요시오카,타카야스 , 우츠노,마사요시 , 나카무라,아츠오 , 오코치,테루오 , 산지,마사키 , 스케카와,타쿠지 , 이케도,켄시 , 안도,요시유키 , 시라이,타케시 , 모리,키미아키 , 와다,리에 , 나카니시,켄스케 , 아이하라,마사미 , 쿠마모토,세이시
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： 본 발명의 하나의 땜납 페이스트용 플럭스는, C
6 이상 C
15 이하의 알킬기를 갖는 (메타)아크릴산 에스테르와 그(메타)아크릴산 에스테르 이외의 (메타)아크릴산 에스테르와의 라디칼 공중합에 의해 얻어지는 아크릴 수지와 로진류를 포함함과 동시에, 상기 로진류를 1로 했을 때의 상기 아크릴 수지의 중량비가, 0.5 이상 1.2 이하이고, 또한 10Pa 이상 150Pa 이하의 전단력을 주는 것으로 유동화된다.

93. 发明公开

KR1020120060773A 아민 플럭스 조성물 및 솔더링 방법 审中-实审
标题翻译：胺通量组合物和焊接方法
公开(公告)号：KR1020120060773A
公开(公告)日：2012-06-12
申请号：KR1020110128394
申请日：2011-12-02
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 , 다우 글로벌 테크놀로지스 엘엘씨
发明人： 플레밍데이비드디. , 갤래거마이크케이. , 김상호 , 리우시앙-퀴안 , 피이라에스거에크버 , 로빈슨글랜 , 톰린슨이안 , 윈클마크알.
IPC分类号： C07C211/09 , B23K35/363 , B23K1/00
摘要： PURPOSE: An amine flux composition is provided to be compatible with various epoxy base underfill material, and not to require cleansing soldering surface for forming final electrical joint before introducing underfill composition for forming final electric conjugation part. CONSTITUTION: An amine flux composition comprises a fluxing agent in chemical formula 1 as an initial component. An applying method of a solder into an electrical contact comprises: a step of providing electrical contact; a step of providing amine flux composition; a step of applying the amine flux composition into the electrical contact; a step of providing the amine flux composition to the electrical contact; a step of providing a solder; a step of melting the solder; and a step of displacing the amine flux composition applied to the electrical contact.
摘要翻译：目的：提供胺助剂组合物以与各种环氧基底料填充材料相容，并且在引入用于形成最终电接合部分的底部填充组合物之前不需要用于形成最终电接头的清洁焊接表面。构成：胺助剂组合物包含化学式1中的助熔剂作为初始组分。将焊料施加到电接触中的方法包括：提供电接触的步骤; 提供胺助剂组合物的步骤; 将胺助剂组合物施加到电接触中的步骤; 向所述电接触提供所述胺通量组合物的步骤; 提供焊料的步骤; 熔化焊料的步骤; 以及置换施加到电触点的胺通量组合物的步骤。

94. 发明公开

KR1020120003189A 알루미늄 브레이징을 위한 플럭스 페이스트 有权
标题翻译：用于铝合金的焊剂
公开(公告)号：KR1020120003189A
公开(公告)日：2012-01-10
申请号：KR1020100063909
申请日：2010-07-02
申请人： 한국켐테크(주)
发明人： 오주희 , 임옥동 , 함종오 , 이순주
IPC分类号： B23K35/363 , B23K1/19 , B23K103/10
摘要： PURPOSE: A flux paste for aluminum brazing is provided to prevent the flying of flux powder in a brazing process and to clean remaining flux paste of flux coater with water. CONSTITUTION: A flux paste for aluminum brazing comprises aluminum flux, conditioning agent, thickener, surfactant, water soluble binder and corrosion inhibitator. More particularly, the flux paste for aluminum brazing comprises aluminum flux of 25~60 parts by weight, e conditioning agent of 20~70 parts by weight, thickener of 0.1~5 parts by weight, surfactant of 0.01~3 parts by weight, water soluble binder of 1~5 parts by weight and corrosion inhibitator of 0.01~1 parts by weight. The conditioning agent comprises the glycol system organic conditioning agent. The above glycol system organic conditioning agent comprises one or more selected from the group consisting of propanediol, hexanediol and glycerol.
摘要翻译：目的：提供铝钎焊焊膏，以防止焊剂粉末在钎焊过程中飞行，并用水清洗焊剂涂层机的剩余焊膏。规定：用于铝钎焊的助焊剂包括铝助焊剂，调理剂，增稠剂，表面活性剂，水溶性粘合剂和防腐剂。更具体地说，用于铝钎焊的助焊剂包括25〜60重量份的铝焊剂，20〜70重量份的调节剂，0.1〜5重量份的增稠剂，0.01〜3重量份的表面活性剂，水可溶性粘合剂为1〜5重量份，防腐剂为0.01〜1重量份。调理剂包括二醇系有机调理剂。上述二醇系有机调理剂含有选自丙二醇，己二醇和甘油的一种或多种。

95. 发明公开

KR1020100106473A 땜납 접합 구조 및 납땜용 플럭스 有权
标题翻译：焊接结构和焊接焊接
公开(公告)号：KR1020100106473A
公开(公告)日：2010-10-01
申请号：KR1020107015360
申请日：2009-02-19
申请人： 하리마 카세이 가부시키가이샤
发明人： 아이하라마사미
IPC分类号： B23K35/363 , B23K3/00 , H05K3/34
CPC分类号： B23K1/0016 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , C21D2251/00 , H05K3/3442 , H05K3/3484 , H05K3/3489 , H05K2201/068 , Y02P10/212
摘要： 한란차가 매우 크다고 하는 가혹한 환경에 있어서도 충분한 땜납 접합 강도를 유지하고, 높은 접합 신뢰성을 확보할 수 있는 땜납 접합 구조를 제공한다.
이 땜납 접합 구조는 주면(1a)에 전극부(2) 및 절연막(3)을 구비한 기판의 주면(1a) 상에 전자부품(4)을 탑재하고, 상기 전극부(2)와 상기 전자부품(4)은 땜납부(5)를 통하여 전기적으로 접합되고, 전자부품(4)과 절연막(3) 사이에 상기 땜납부(5)로부터 침출된 플럭스 잔사(6)가 개재되어 있는 땜납 접합 구조로서, 상기 플럭스는 아크릴 수지, 활성제 및 수산기를 갖는 틱소제를 함유하고, 또한 상기 아크릴 수지의 유리전이점이 -40℃ 이하 또는 상기 플럭스 잔사의 연화 온도 이상임과 아울러, 상기 플럭스 잔사는 -40℃부터 상기 플럭스 잔사의 연화 온도까지의 온도범위에 있어서의 선팽창계수의 최대값이 300×10
-6 /K 이하이다.

96. 发明公开

KR1020100050561A 접착제 조성물 및 그것을 이용한 전자부품 탑재 기판 및 반도체장치 有权
标题翻译：粘合组合物，使用粘合组合物的电子部件安装基板和半导体器件
公开(公告)号：KR1020100050561A
公开(公告)日：2010-05-13
申请号：KR1020107006925
申请日：2008-10-02
申请人： 히타치가세이가부시끼가이샤
发明人： 콘노카오루 , 하야시히로키 , 카와모리타카시
IPC分类号： C09J9/02 , B23K35/363 , H01B1/22 , H05K3/32
CPC分类号： H01L24/16 , B22F1/0059 , B22F2001/0066 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/302 , B23K35/3613 , B23K35/3618 , B23K35/362 , B23K35/365 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01B1/22 , H01L24/12 , H01L2224/05568 , H01L2224/13099 , H01L2224/1329 , H01L2224/13347 , H01L2224/13439 , H01L2224/16 , H01L2224/16225 , H01L2224/16265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/15747 , H01L2924/19043 , H01L2924/20107 , H05K1/141 , H05K3/321 , H05K2201/0272 , H05K2203/0425 , Y10T428/31511 , Y10T428/31678 , H01L2924/00 , H01L2224/05599
摘要： This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesion, electroconductivity, TCT resistance, and mounting reliability such as high-temperature standing resistance, and an electronic component-mounted substrate using the adhesive composition and a semiconductor device.The adhesive composition comprises electroconductive particles (A) and a binder component (B). The adhesive composition is characterized in that the electroconductive particles (A) comprise a metal (a1), which has a melting point equal to or above the reflow temperature and is free form lead, and a metal (a2), which has a melting point below the reflow temperature and is free from lead, and the binder component (B) comprises a heat curable resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).
摘要翻译：本发明提供了一种粘合剂组合物，其在保持储存稳定性的同时可以在固化产物润湿组分并在组分之间良好扩散的状态下形成金属粘合剂，并且粘合性，导电性，耐TCT性和安装可靠性优异作为耐高温性的电阻，以及使用该粘合剂组合物和半导体装置的电子部件安装基板。粘合剂组合物包含导电性粒子（A）和粘合剂成分（B）。粘合剂组合物的特征在于，导电性粒子（A）含有熔点等于或高于回流温度且为游离铅的金属（a1）和具有熔点的金属（a2）低于回流温度，不含铅，粘结剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

97. 发明公开

KR1020100034750A 납땜용 플럭스 및 땜납 페이스트 조성물 有权
标题翻译：用于焊接和焊接组合物的焊剂
公开(公告)号：KR1020100034750A
公开(公告)日：2010-04-01
申请号：KR1020107001047
申请日：2008-11-25
申请人： 하리마 카세이 가부시키가이샤
发明人： 이시카와순스케 , 시노즈카아키라 , 아이하라마사미
IPC分类号： B23K35/363 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/0244 , B23K35/025 , B23K35/362 , B23K2201/36 , H05K3/3489
摘要： A flux for soldering is provided which reduces the tackiness of a flux residue and attains diminished volatilization in reflow while maintaining high reliability to enable environmentally friendly soldering. Also provided is a soldering paste composition containing the flux. The flux for soldering comprises a base resin, an activator, and a solvent. The solvent comprises an oil ingredient having an iodine value of 120-170. Preferably, the content of the oil ingredient is 22-80 wt.% based on the whole flux. The oil ingredient preferably comprises at least either of one or more drying oils and one or more semi-drying oils, and more preferably comprises one or more members selected from the group consisting of tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soybean oil. The soldering paste composition comprises the flux for soldering and a soldering alloy powder.
摘要翻译：提供用于焊接的焊剂，其降低焊剂残留物的粘性并且在回流中获得减少的挥发，同时保持高可靠性以实现环境友好的焊接。还提供了含有助熔剂的焊膏组合物。用于焊接的焊剂包括基础树脂，活化剂和溶剂。溶剂包含碘值为120-170的油成分。优选地，基于整个通量，油成分的含量为22-80重量％。油成分优选包含一种或多种干性油和一种或多种半干性油中的至少一种，更优选包含一种或多种选自桐油，罂粟籽油，核桃油，红花油，向日葵油和大豆油。焊膏组合物包括用于焊接的焊剂和焊接合金粉末。

98. 发明公开

KR1020080106888A 알루미늄 납땜용 페이스트상 조성물, 그것이 도포된알루미늄 함유 부재 및 그것을 이용한 알루미늄 함유부재의 납땜 방법 有权
标题翻译：用于制铝的过渡组合物，其包含的含铝的构件以及与其相容的含铝构件的方法
公开(公告)号：KR1020080106888A
公开(公告)日：2008-12-09
申请号：KR1020087012186
申请日：2007-03-20
申请人： 도요 알루미늄 가부시키가이샤
发明人： 가토하루조 , 와츠지다카시 , 마츠무라겐
IPC分类号： B23K35/28 , B23K35/363 , B23K35/362
CPC分类号： B23K35/28 , B22F1/0011 , B23K35/025 , B23K35/286 , B23K35/404 , C22C1/0416 , Y10T428/12063
摘要： A pasty composition for aluminum brazing which has excellent applicability and gives a brazed product having satisfactory dimensional accuracy, less apt to suffer erosion, and having a satisfactory appearance of the brazed part (fillet). The pasty composition for aluminum brazing contains an aluminum-containing powder. The aluminum-containing powder has a cumulative particle size curve in which when the particle diameter, D mum, corresponding to Q vol.% is expressed by D(Q) mum, then D(50) mum is 20-150 mum and the value of D(90) mum /D(10) mum is 5 or less. In the aluminum-containing powder, the proportion of particles which pass through a sieve having an opening size of 45 mum is up to 50 mass%. The aluminum-containing powder has a fluidity of 80 sec/50 g or lower. ® KIPO & WIPO 2009
摘要翻译：铝钎焊的糊状组合物具有优异的适用性，并提供具有令人满意的尺寸精度，较不易遭受侵蚀的钎焊产品，并且具有令人满意的钎焊部分（圆角）的外观。用于铝钎焊的糊状组合物含有含铝粉末。含铝粉末具有累积粒径曲线，其中当D（Q）mum表示对应于Q体积％的粒径D mum时，D（50）mum为20-150μm，并且值的D（90）mum / D（10）mum为5以下。在含铝粉末中，通过开口尺寸为45μm的筛子的粒子的比例为50质量％以下。含铝粉末的流动性为80秒/ 50g以下。 ®KIPO＆WIPO 2009

99. 发明公开

KR1020080022058A 납땜용 플럭스 및 땜납 페이스트 조성물 无效
标题翻译：焊剂和焊膏组合物
公开(公告)号：KR1020080022058A
公开(公告)日：2008-03-10
申请号：KR1020070089558
申请日：2007-09-04
申请人： 가부시키가이샤 덴소 , 하리마 카세이 가부시키가이샤
发明人： 야마모토마사야스 , 시오미타쿠미 , 나카니시켄스케 , 와타나베마사히로 , 아이하라마사미
IPC分类号： B23K35/363 , B23K35/36
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/025 , C08K5/04 , C08K5/1535 , C08K5/16
摘要： A flux for soldering and solder paste composition is provided to realize wettablility with respect to plating of metal having no solder. Flux for soldering includes base resin and an activator. The activator includes heterocyclic compound with oxygen with at least one carboxyl group. The heterocyclic compound with oxygen includes a five-membered ring structure including one selected from the group consisting of furan, hydro-furan and oxazol. The activator includes at least one of heterocyclic compound with nitrogen and heterocyclic compound with sulfur having at least one carboxyl group. The content of at least one of the heterocyclic compound with nitrogen and the heterocyclic compound with sulfur is 0.1weight% to 20weight% of a total amount of flux. The soldering paste composition includes soldering flux and soldering alloy powder.
摘要翻译：提供用于焊接和焊膏组合物的焊剂，以实现相对于不具有焊料的金属的镀覆的润湿性。用于焊接的焊剂包括基础树脂和活化剂。活化剂包括具有至少一个羧基的氧的杂环化合物。具有氧的杂环化合物包括五元环结构，其包括选自呋喃，氢呋喃和恶唑中的一种。活化剂包括氮杂环化合物和具有至少一个羧基的硫的杂环化合物中的至少一种。至少一种杂环化合物与氮和杂环化合物与硫的含量为总量的0.1重量％至20重量％。焊膏组合物包括助焊剂和焊接合金粉末。

100. 发明公开

KR1020060126677A 납땜용 플럭스 및 납땜 방법 无效
标题翻译：焊接焊接和焊接方法
公开(公告)号：KR1020060126677A
公开(公告)日：2006-12-08
申请号：KR1020067013032
申请日：2005-01-27
申请人： 파나소닉 주식회사
发明人： 마에다다다시 , 사카이다다히코
IPC分类号： B23K35/363
CPC分类号： B23K35/0244 , B23K35/025 , B23K35/3006 , B23K35/3013 , B23K35/36 , B23K35/3613 , H01L21/6835 , H01L24/11 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/11003 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/81011 , H01L2224/81801 , H01L2924/00013 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12044 , H05K3/3489 , H05K2201/0215 , Y10T29/49144 , H01L2224/29099 , H01L2924/00014 , H01L2924/01083 , H01L2924/00
摘要： Disclosed is a soldering flux which enables to obtain a high-quality soldered joint without causing a joint defect or deterioration of insulation. Also disclosed is a soldering method using such a flux. When a first electrode provided with a solder portion is joined to a second electrode with solder, this soldering flux is interposed between the solder portion and the second electrode. This soldering flux comprises a liquid base material wherein a resin component is dissolved in a solvent, an active component having a function of removing oxide films, and a metal powder composed of a metal having a melting point higher than that of the solder portion; and the metal powder is contained in an amount of 1-9 vol%.
摘要翻译：公开了一种能够获得高质量焊接接头而不引起接合缺陷或绝缘劣化的助焊剂。还公开了使用这种焊剂的焊接方法。当具有焊料部分的第一电极与焊料接合到第二电极时，该焊剂夹在焊料部分和第二电极之间。这种焊剂包括其中树脂成分溶解在溶剂中的液体基材料，具有去除氧化膜功能的活性成分和由熔点高于焊料部分的金属组成的金属粉末; 金属粉末的含量为1-9体积％。

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