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1. 发明专利

JP2021063276A 銅合金摺動材料审中-公开
公开(公告)号：JP2021063276A
公开(公告)日：2021-04-22
申请号：JP2019189103
申请日：2019-10-16
申请人：大豊工業株式会社
发明人：江端祐平
IPC分类号： C22C11/10 , C22C11/06
摘要：【課題】耐摩耗性と耐焼き付き性とをともに向上させる。【解決手段】0.5〜12.0質量%のSn、2.0〜8.0質量%のBi、1.0〜5.0体積%の無機化合物を含有し、残部がCuおよび不可避不純物からなる銅合金摺動材料であって、前記無機化合物は、平均粒径が0.5〜3.0μmである第1無機化合物と、平均粒径が4.0〜20.0μmである第2無機化合物と、からなり、前記第1無機化合物の体積分率を、前記第2無機化合物の体積分率で除した値は、0.1〜1.0である、銅合金摺動材料が構成される。【選択図】図2

2. 发明专利

JP2018517842A チューブ状物品の製作方法审中-公开
公开(公告)号：JP2018517842A
公开(公告)日：2018-07-05
申请号：JP2017555708
申请日：2016-04-08
申请人：マテリオンアドバンスドマテリアルズジャーマニーゲーエムベーハー
发明人：シモンズ,クリストフ , シュロット,マルティン , ハインデル,ヨーゼフ , シュテール,カール,クリストフ
IPC分类号： C23C14/34 , C23C4/18 , C22C28/00 , C22C11/06 , C22C11/04 , C22C11/00 , C22C18/00 , C22C18/02 , C22C18/04 , C22C13/00 , C22C13/02 , C22C11/08 , C22C11/10 , C23C4/06
CPC分类号： C23C14/3414 , C22F1/16 , C23C4/08 , C23C4/123 , C23C4/131 , C23C4/18 , H01J37/342 , H01J37/3491
摘要：本発明は、チューブ状物品を製作するための方法であって、(a)担体チューブを用意するステップと、(b)担体チューブ上に液体金属相を適用し、液体金属相を固化させることによって、担体チューブ上に金属コーティングを設けるステップと、(c)少なくとも1つの緻密化ツールによって金属コーティングに接触圧力を加え、緻密化ツールと金属コーティングを互いに対して動かすステップとを含む、方法に関する。【選択図】なし

3. 发明专利

JP2000079435A CHROMIUM PLATING ANODE AND ITS MANUFACTURE 失效
公开(公告)号：JP2000079435A
公开(公告)日：2000-03-21
申请号：JP25099199
申请日：1999-09-06
申请人： KANO SEISAKUSHO KK
发明人： KANO KAZUYUKI
IPC分类号： B21F19/00 , B21F99/00 , C22C11/10 , C25D17/10 , C25D17/12 , B21F21/00
摘要： PROBLEM TO BE SOLVED: To increase a maximum current density as a voltage is suppressed low, to uniformize an anode current density and to restrain a bend of an anode. SOLUTION: In a main body 2 of this anode 1, a columnar shaped copper core 4 is prepared, knurl rolling, form rolling or the like is applied to it, surface hardening and surface area increasing treatment are executed. Next, a hollow cylindrical shaped lead alloy 5 which is formed into a shape suitable to the shape of the copper core 4 is prepared, the copper core 4 is inserted into the hollow part of the lead alloy 5 to perfectly fit to it and they are formed by press-contacting (fixing by pressure) using a rolling mill, a press-contacting machine or the like. In order to attach a hanging part 3 to the upper end part of the main body 2, the hanging part 3 is joined to the copper core 4 by brazing or welding and the copper core 4 is coated by nickel plating.

4. 发明专利

JPH03204194A PB ALLOY SOLDER HAVING EXCELLENT THERMAL FATIGUE CHARACTERISTIC 失效
公开(公告)号：JPH03204194A
公开(公告)日：1991-09-05
申请号：JP34278489
申请日：1989-12-29
申请人： TANAKA ELECTRONICS IND
发明人： KOGASHIWA TOSHINORI
IPC分类号： B23K35/26 , C22C11/06 , C22C11/10 , C22C13/00 , H01L21/52 , H01L21/60 , H05K3/34
摘要： PURPOSE:To improve a thermal fatigue characteristic and creep resistance by incorporating a specific ratio of Sb and elements which are liable to form a compd. with the Sn in the solder, and thereby precipitating intermetallic compd. particles in the crystal grain boundary parts. CONSTITUTION:The Sb at 0.01 to 10% and the elements which are liable to form the compd. with the Sn are incorporated into the Pb alloy base material contg. 1 to 60% Sn. The intermetallic compd. particles are deposited dispersedly in the crystal grain boundary parts consisting of the SbSn compd. and the Pb alloy solder having the excellent thermal fatigue resistance is obtd. The elements which are liable to form the compd. with the Sn are one kind or >=2 kinds of Cu, Ni, Au, Ag, Pt, Pd, Mg, Ca, Li, In, Ce, Cd, Co, Cr, Fe, Mn, Se, Te, and Zr and the content thereof is 0.01 to 7%. The content of the Cu or Ni is

5. 发明专利

JPH02285041A LEAD ALLOY FOR FOIL COVERING CABLE 失效
公开(公告)号：JPH02285041A
公开(公告)日：1990-11-22
申请号：JP10486489
申请日：1989-04-25
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MATSUMOTO TETSUO , UEMATSU TADAYUKI
IPC分类号： C22C11/10 , H01B7/22
摘要： PURPOSE:To obtain the lead alloy for a cable covering foil having remarkably excellent thermal fatigue resistance and by which cracks in a lead alloy foil can be prevented under the condition of high temp. use by specifying the compsn. constituted of Sn, Sb, Cu and Pb. CONSTITUTION:The lead alloy for a cable covering foil is constituted of the compsn. contg., by weight,

6. 发明专利

JPS5010220A 失效
公开(公告)号：JPS5010220A
公开(公告)日：1975-02-01
申请号：JP6160773
申请日：1973-06-01
IPC分类号： C22C9/00 , C22C1/04 , C22C11/00 , C22C11/10 , C22C30/00 , F16C33/12

7. 发明专利

JP5839892B2 半田材および半導体装置有权
标题翻译：焊料材料和半导体器件
公开(公告)号：JP5839892B2
公开(公告)日：2016-01-06
申请号：JP2011187391
申请日：2011-08-30
申请人：三菱電機株式会社
发明人：出田吾朗 , 川端亮平 , 西堀弘 , 園田宏貴
IPC分类号： H05K3/34 , B23K1/00 , C22C11/10 , C22C11/06 , B23K101/40 , B23K35/26

8. 发明专利

JP3113895B2 失效
公开(公告)号：JP3113895B2
公开(公告)日：2000-12-04
申请号：JP10330690
申请日：1990-04-18
IPC分类号： H01M4/68 , C22C11/10

9. 发明专利

JPH09206981A SOLDER MATERIAL 失效
公开(公告)号：JPH09206981A
公开(公告)日：1997-08-12
申请号：JP1415196
申请日：1996-01-30
申请人： TAIHO KOGYO CO LTD , TOYOTA MOTOR CORP , SORUDAA KOOTO KK
发明人： TANAKA YASUHISA , ISHIDA HIDEKI , NARITA KATSUHIKO , HARA SHIRO
IPC分类号： B23K35/26 , C22C11/10 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To reduce defective joining on soldering by containing (by wt. %) a first element composing of one kind or two kinds of Ag and Bi equal to or more than the containing amount (by wt. %) of a second element composing of one kind or two kinds or more of a specified element such as In and Sb, etc., in Pb-Sn solder alloy. SOLUTION: In Pb-Sn solder alloy, the containing amount (by wt. %) of the first element composing of one kind or two kinds of Ag and Bi and improving a spreading ratio is specified to be equal to or more than the containing amount (by wt. %) of the second element composing of one kind or two kinds or more of In, Sb, As, Ni, Mg, Ca, Ta, Ti, Zn, Sr, Be, Tl, Ge and one kind or two kinds or more of Ga and reducing the spreading ratio. As a result of an experiment performed for holding the same spreading ratio as a eutectic solder, sufficient wettability is secured by adding Ag (%) of one times or more the second element (%). By this way, defective joining due to the defective wettability of solder is largely reduced, and soldering between substrates and parts is improved.

10. 发明专利

JPH06269984A LOW MELTING SOLDER ALLOY 失效
公开(公告)号：JPH06269984A
公开(公告)日：1994-09-27
申请号：JP9642093
申请日：1993-03-18
申请人： KAWAKATSU ICHIRO
发明人： KAWAKATSU ICHIRO
IPC分类号： B23K35/26 , C22C11/10 , C22C30/04
摘要： PURPOSE:To improve the joint strength of an Sn-Pb solder alloy by adding specific ratios of low melting elements, such as Bi and In, and Ge to this solder alloy. CONSTITUTION:Ge is incorporated at 0.1 to 1% by weigh and >=1 kinds of Ag and Pd at 0.01 to 3% by weight into the Sn-Pb solder alloy contg. 2.7 to 20% Bi by weight, by which the boundary strength of the alloy is improved and the joint strength is improved. A low melting solder alloy formed by adding 2.7 to 20% Bi to a solder alloy consisting of Sn in a 20 to 80% component range and Pb in a 20 to 80% component range has the m. p. falling with an increase in the amt. of the Bi to be added and the degradation in the joint strength is significant as well and, therefore, such defect is ameliorated by adding the Ge, Ge-Ag or Ge-Ag-Pb to this alloy The amt. of the Ge to be added at this time is most adequately 0.1 to 1.0%. There are substantially no effects of addition if the amt. is =1.0%. The addition of the Ag leads to an improvement in the strength and elongation of the solder itself. The addition of the Pd contributes to an improvement in soldering strength by dispersing in the form of fine particles into the solder.

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