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    • 3. 发明专利
    • ADHESIVE TAPE FOR CONNECTING ELECTRONIC COMPONENT
    • JP2002226793A
    • 2002-08-14
    • JP2001023336
    • 2001-01-31
    • NITTO DENKO CORP
    • SHIRAI MITSUYOSHIICHIKAWA HIROKINANZAKI YOSHIHIROBABA NORIHIDE
    • C09J7/02C09J133/02C09J139/02C09J179/02
    • PROBLEM TO BE SOLVED: To provide an adhesive tape for connecting electronic components, which has good adhesive properties and creep characteristics, can tape electronic components at low temperatures, and yet is excellent in impact resistance. SOLUTION: The adhesive tape for connecting electronic components is an adhesive tape for connecting electronic components which arranges and retains electronic components with lead wires in the state of a reed screen by way of the lead wires by a pressure-sensitive adhesive layer provided on a supporting base material, the pressure-sensitive adhesive layer comprising a pressure-sensitive adhesive base layer for the pressure-sensitive adhesive and a surface modified layer formed by modifying the surface of the pressure- sensitive adhesive base layer with a functional group showing an adhesion- reactivity by an interfacial catalytic reaction. The component to form the surface modified layer is at least one reactive functional-group containing compound selected from a reactive functional-group containing compound containing a plurality of amino groups in the molecule, a reactive functional group- containing compound containing a plurality of carboxyl groups or derivative groups thereof in the molecule, and a reactive functional group-containing compound containing a carboxyl group and an amino group in the molecule.
    • 8. 发明专利
    • Pressure-sensitive adhesive modified with surface- reactive functional group, and pressure-sensitive adhesive tape or sheet
    • 用表面反应功能组改性的压敏粘合剂和压敏粘合胶带或薄片
    • JP2003321666A
    • 2003-11-14
    • JP2002130056
    • 2002-05-01
    • Nitto Denko Corp日東電工株式会社
    • NANZAKI YOSHIHIROBABA NORIHIDE
    • C09J7/02C09J139/00C09J139/02C09J179/02C09J201/02
    • PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive effectively maintaining high adhesive characteristics which the pressure-sensitive adhesive inherently has at an initial stage in application thereof, and exhibiting strong adhesive strength to an adherend after the application.
      SOLUTION: This pressure-sensitive adhesive modified with the surface-reactive functional groups is given by coating a surface of the pressure-sensitive adhesive with an amino group-containing polymer (A) through interfacial contact reaction, so that the surface of the pressure-sensitive adhesive is modified with amino groups, wherein the polymer (A) is given by substituting hydrogen atoms of at least a part of the amino groups in its molecule with organic groups each composed of five or more atoms. Adhesive strength of the pressure-sensitive adhesive to the specified adherend may be increased with time, after the application. A hydrocarbon residue which may have a substituent is preferably used as the organic group for substituting the amino group in the amino group-containing polymer (A). The amino group- containing polymer (A) is prepared by reacting the amino groups in (b) a polymer having the amino groups with amino group-reacting functional groups in (c) compounds containing the amino group-reacting functional group.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种压敏粘合剂,其有效地保持了粘合剂在其应用的初始阶段固有地具有的高粘合特性,并且在涂布后对被粘物表现出强的粘合强度。 解决方案:用表面反应性官能团改性的压敏粘合剂是通过界面接触反应将含有氨基的聚合物(A)的压敏粘合剂的表面涂覆在表面, 用氨基改性压敏粘合剂,其中聚合物(A)是通过用分子中的至少一部分氨基取代有机基团而给出的,该有机基团由5个或更多个原子构成。 在施加后,压敏粘合剂对指定粘合剂的粘合强度可随时间增加。 优选使用可具有取代基的烃残基作为用于取代含氨基的聚合物(A)中的氨基的有机基团。 含有氨基的聚合物(A)通过使(b)具有氨基的聚合物中的氨基与(c)含有氨基反应性官能团的化合物中的氨基反应官能团的氨基反应来制备。 版权所有(C)2004,JPO