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1. 发明专利

JP6133228B2 接続構造体、コネクタ、及び接続構造体の製造方法有权
公开(公告)号：JP6133228B2
公开(公告)日：2017-05-24
申请号：JP2014068679
申请日：2014-03-28
申请人：古河電気工業株式会社 , 古河AS株式会社
发明人：川村幸大 , 外池翔 , 高村聡
IPC分类号： H01R4/62 , H01R13/52 , H01R4/18
CPC分类号： H01R4/20 , H01R43/048 , H01R43/0482 , H01R43/16 , H01R13/52 , H01R4/62 , Y10T29/49179

2. 发明专利

JP5830107B2 電気刺激システムのための半径方向を整列させたセグメント電極を有するリードを製造するための方法有权
标题翻译：用于电刺激系统对准用于制造具有分段电极径向的导线的方法
公开(公告)号：JP5830107B2
公开(公告)日：2015-12-09
申请号：JP2013544475
申请日：2011-10-27
申请人：ボストンサイエンティフィックニューロモデュレイションコーポレイション
发明人：ピアンカアンマーガレット , オリンスキウィリアムジョージ
IPC分类号： A61N1/36 , A61N1/05
CPC分类号： A61N1/0534 , A61N1/05 , Y10T29/49149 , Y10T29/49151 , Y10T29/49179 , Y10T29/49208 , Y10T29/49218 , Y10T29/4922

3. 发明专利

JPWO2012164957A1 電子部品実装方法、電子部品搭載装置および電子部品実装システム有权
标题翻译：电子元件安装方法，电子部件安装装置及电子部件安装系统
公开(公告)号：JPWO2012164957A1
公开(公告)日：2015-02-23
申请号：JP2013517890
申请日：2012-06-01
申请人：パナソニック株式会社
发明人：翼佐伯 , 翼佐伯 , 和田　義之 , 義之和田 , 本村　耕治 , 耕治本村 , 境　忠彦 , 忠彦境
IPC分类号： H05K3/34
CPC分类号： H05K3/305 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11822 , H01L2224/131 , H01L2224/16225 , H01L2224/16265 , H01L2224/29012 , H01L2224/2919 , H01L2224/30155 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/7501 , H01L2224/7515 , H01L2224/75611 , H01L2224/75821 , H01L2224/81011 , H01L2224/8102 , H01L2224/81024 , H01L2224/81143 , H01L2224/81193 , H01L2224/81815 , H01L2224/81903 , H01L2224/83104 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2924/19105 , H01L2924/351 , H05K3/34 , H05K3/3405 , H05K3/3436 , H05K3/3468 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K13/0465 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49179 , Y10T29/53174 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/81 , H01L2224/83
摘要：複数のバンプが設けられた主面を有する第1電子部品を準備する工程と、複数のバンプに対応する複数の第1電極が設けられた搭載領域を有する基板を準備する工程と、複数のバンプにフラックスを塗布する工程と、搭載領域の周縁部に設定された少なくとも1つの補強位置に隣接する第1電極に、フラックスを塗布する工程と、補強位置に熱硬化性樹脂を塗布して、補強位置に隣接する第1電極の少なくとも一部を熱硬化性樹脂で覆う工程と、複数のバンプがそれぞれ対応する第1電極に着地するように、第1電子部品を基板に搭載するとともに、熱硬化性樹脂を第1電子部品の周縁部に接触させる工程と、第1電子部品を搭載した基板を加熱する工程と、を含む電子部品実装方法。
摘要翻译：制备具有制备具有主表面，其中，设置有多个凸块的第一电子部件，多个其中对应于所述多个凸块设置在第一电极安装区域，多个凸块的工序的衬底的步骤在施加焊剂的步骤，相邻的至少一个加强位置上的第一电极被设置在安装区域的周围，并施加焊剂的步骤，热固性树脂施加到所述增强的位置，加强涂覆有热固性树脂，它是邻近的位置，使多个凸块焊盘上分别对应于第一电极，与所述第一电子部件安装到基板上，热固性所述第一电极的至少一部分的工序电子部件安装方法包括：在所述第一电子部件的周围，加热安装有所述第一电子部件的衬底，的步骤的性树脂接触。

4. 发明专利

JP5570016B2 Connector for a flat cable, harness, and a manufacturing method of the harness 有权
公开(公告)号：JP5570016B2
公开(公告)日：2014-08-13
申请号：JP2010230835
申请日：2010-10-13
申请人：日本圧着端子製造株式会社
发明人：誠森田
IPC分类号： H01R12/77 , H01R4/02 , H01R43/00 , H01R43/02
CPC分类号： H01R12/592 , H01R43/0249 , Y10T29/49179

5. 发明专利

JP2011228704A Micro pin hybrid interconnect array and method of manufacturing same 有权
标题翻译： MICRO PIN HYBRID INTERCONNECT ARRAY AND METHOD OF MANUFACTURING THE SAME
公开(公告)号：JP2011228704A
公开(公告)日：2011-11-10
申请号：JP2011088708
申请日：2011-04-13
申请人： General Electric Co , ゼネラル・エレクトリック・カンパニイ
发明人： CHARLES GERALD WOJCIK , JOHN ERIC TKACZYK , BRIAN DAVID JANOV , TANG TUANG
IPC分类号： H01L21/60 , H01L23/50
CPC分类号： H01L24/16 , H01L21/563 , H01L22/20 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L24/83 , H01L27/14618 , H01L27/14636 , H01L2224/0401 , H01L2224/051 , H01L2224/05568 , H01L2224/0558 , H01L2224/056 , H01L2224/05644 , H01L2224/1134 , H01L2224/13007 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/1411 , H01L2224/1601 , H01L2224/16106 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/81121 , H01L2224/81143 , H01L2224/81191 , H01L2224/81194 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2224/8191 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15787 , H01L2924/351 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49162 , Y10T29/49179 , H01L2924/05432 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2224/05552
摘要： PROBLEM TO BE SOLVED: To provide a structure for interconnecting CZT and/or CdTe to an interposer that offers low local strain and that can accommodate conventional attachment methods available today to manufacturers.SOLUTION: A micro pin hybrid interconnect array (10) includes a crystal anode array (18) and a ceramic substrate (14). The array (18) and substrate (14) are joined together using an interconnect (12) geometry having a large aspect ratio of height to width. The joint affixing the interconnect (12) to the crystal anode array (18) is devoid of solder.
摘要翻译：要解决的问题：提供用于将CZT和/或CdTe互连到提供低局部应变并且可以适应当今可用于制造商的常规附接方法的插入器的结构。解决方案：微针混合互连阵列（10）包括晶体阳极阵列（18）和陶瓷衬底（14）。阵列（18）和衬底（14）使用具有高宽比大的纵横比的互连（12）几何结合在一起。将互连（12）固定到晶体阳极阵列（18）上的接头没有焊料。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011040754A Method for joining two electronic components 审中-公开
标题翻译：接合两个电子元件的方法
公开(公告)号：JP2011040754A
公开(公告)日：2011-02-24
申请号：JP2010180904
申请日：2010-08-12
申请人： Commissariat A L'energie Atomique & Aux Energies Alternatives , コミッサリアアレネルジーアトミークエオゼネルジザルタナテイヴ
发明人： MARION FRANCOIS
IPC分类号： H01L21/60 , H05K1/18
CPC分类号： H01L25/50 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/13005 , H01L2224/13011 , H01L2224/13014 , H01L2224/13015 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/13184 , H01L2224/13186 , H01L2224/1357 , H01L2224/13644 , H01L2224/13669 , H01L2224/1601 , H01L2224/16105 , H01L2224/81099 , H01L2224/81193 , H01L2224/81194 , H01L2224/81201 , H01L2224/81898 , H01L2225/06513 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , Y10T29/49149 , Y10T29/49179 , Y10T29/49826 , H01L2924/01014 , H01L2924/04941 , H01L2924/00014 , H01L2924/01051 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a method for joining two electronic components. SOLUTION: Two electronic components (12, 16) are joined by insertion a hollow-opening insertion part (50) into a convex filling element (14) with lower hardness than that of the insertion part (50). In the joining method, when the insertion part (50) is inserted into the filling element (14), at least one surface (52) in the opening end (54) of the insertion part (50) remains open because it is necessary to form a passage to discharge gas existing in the insertion part (50). COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于连接两个电子部件的方法。解决方案：通过将中空开口插入部分（50）插入到具有比插入部分（50）低的硬度的凸形填充元件（14）中来连接两个电子部件（12,16）。在接合方法中，当插入部分（50）插入到填充元件（14）中时，插入部分（50）的开口端（54）中的至少一个表面（52）保持打开，因为必须形成用于排出存在于插入部（50）中的气体的通道。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2008251539A Improvement of wire harness 审中-公开
标题翻译：线束的改进
公开(公告)号：JP2008251539A
公开(公告)日：2008-10-16
申请号：JP2008121711
申请日：2008-05-07
申请人： Delphi Technologies Inc , デルファイ・テクノロジーズ・インコーポレーテッド
发明人： GOURASH JAMES A , HSIEH SHAO , KIGHTLINGER JOHN THOMAS , LOPRIRE NICK M , MCFALL ROBERT A , MCLANE JOHN C , BUNGO EDWARD M , RODONDI ANDREW F , VANDEN WYMELENBERG MARK J
IPC分类号： H01B13/012 , B23K20/10 , B23K37/047 , B23K101/38 , B23P19/00 , G08B1/00 , H01B7/00 , H01B13/34 , H01R4/02 , H01R13/436 , H01R13/46 , H01R43/02 , H01R43/042 , H01R43/048 , H01R43/052 , H01R43/055 , H01R43/20 , H01R43/28 , H02G1/14
CPC分类号： B23K37/047 , B23K20/10 , B23K2201/32 , B23K2201/34 , B23K2201/38 , H01R4/023 , H01R13/436 , H01R13/465 , H01R43/0207 , H01R43/0228 , H01R43/052 , H01R43/055 , H01R43/20 , H01R43/28 , Y10T29/49117 , Y10T29/49174 , Y10T29/49179 , Y10T29/49181 , Y10T29/4919 , Y10T29/49192 , Y10T29/5187 , Y10T29/5193 , Y10T29/532 , Y10T29/53209 , Y10T29/53213 , Y10T29/53217 , Y10T29/53226 , Y10T29/53235 , Y10T29/53243 , Y10T29/53261 , Y10T29/5327
摘要： PROBLEM TO BE SOLVED: To provide an electric connector which can be used for a wire harness formed by an automated electric wire harness manufacturing equipment. SOLUTION: The wire harness manufacturing method includes a process in which a wafer of an electric connector of a wire harness having narrow and long terminal cavities (114) is arranged, a process in which the terminal cavities of the wafer are arranged in order for a terminal inserting station (64) through a conveyor (58), a process in which long and narrow terminals (54) are inserted in a lengthwise direction into the terminal cavities through the terminal inserting station, a process in which the inserted terminals are arranged in order on a wire loader station (66) by the conveyor, and a process in which a loading cycle of the wire loader station is started so that ends of electric insulated wires (46) can be loaded to the terminal cavities in a cross-wise direction against the terminals. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可用于由自动电线束制造设备形成的线束的电连接器。线束制造方法包括其中布置具有窄且长的端子空腔（114）的线束的电连接器的晶片的处理，其中晶片的端子空腔被布置在通过输送机（58）的终端插入台（64）的顺序，通过终端插入台将长而窄的端子（54）沿长度方向插入端子腔的过程，其中插入的端子通过输送机按顺序布置在送丝机装置（66）上，并且开始装载工位站的装载周期的过程，使得电绝缘线（46）的端部能够被加载到端子腔与端子相交的方向。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008160802A Piezoelectric vibrator and method of fabricating piezoelectric vibrator, and oscillator, electronic apparatus and radio wave timepiece which have piezoelectric vibrator 有权
标题翻译：压电振动器和压电振动器的制造方法以及振动器，具有压电振动器的电子设备和无线电波形时间
公开(公告)号：JP2008160802A
公开(公告)日：2008-07-10
申请号：JP2007260565
申请日：2007-10-04
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： KAWADA YASUO , OKU SADAO , NUMATA MICHIYUKI
IPC分类号： H03H9/10 , H01L23/04 , H03B5/30 , H03H3/02 , H03H9/02
CPC分类号： H03H9/1021 , H01L2224/45144 , H01L2224/48091 , Y10T29/42 , Y10T29/49169 , Y10T29/49179 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being short-circuited to each other and enabling to fabricate the piezoelectric vibrating piece easily. SOLUTION: There is provided a piezoelectric vibrator 1 including a case 3 in a shape of a bottomed cylinder having an opening portion 3a and having conductivity, a ring 12 substantially in a cylindrical shape press-fitted to the opening portion 3a of the case 3 and having conductivity, one piece of a lead 13 inserted to the ring 12 and having an inner lead portion 15 and an outer lead portion 16, a filling member 14 having an insulating property for sealing an interval between the lead 13 and the ring 12 in airtight, and a piezoelectric vibrating piece 2 which is constituted by substantially a plate-like shape arranged at the inside of the case 3 and includes exciting electrodes 8, 9 at both faces thereof and in which the exciting electrode 8 is supported by the inner lead portion 15 by being subjected to bump connection with the inner lead portion 15 of the lead 13 and the exciting electrode 9 is subjected to wire bonding with the ring 12. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了实现压电振动器的小尺寸形成，同时防止设置在压电振动片的两个面处的激励电极彼此短路，并且能够容易地制造压电振动片。解决方案：提供一种压电振动器1，其包括具有开口部分3a并具有导电性的有底圆筒形状的壳体3，基本上为圆柱形的环12压配合到开口部分3a的开口部分3a 壳体3具有导电性，插入环12中的一片导线13并具有内引线部分15和外引线部分16，具有用于密封引线13和环之间的间隔的绝缘性能的填充部件14 12是密封的，压电振动片2由布置在壳体3的内部的大致板状构成，并且在其两面包括励磁电极8,9，其中激励电极8由通过与引线13的内部引线部分15和激励电极9进行凸起连接的内部引线部分15与环12进行引线接合。版权所有（C）2008，JPO＆INPIT

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