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    • 1. 发明专利
    • Photodetector with plasmon structure
    • 具有等离子体结构的光电转换器
    • JP2011133471A
    • 2011-07-07
    • JP2010263641
    • 2010-11-26
    • Commissariat A L'energie Atomique & Aux Energies Alternativesコミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ
    • GRAVRAND OLIVIERDESTEFANIS GERARDLE PERCHEC JEROME
    • G01N21/27
    • H01L31/1032G01J5/0853G01J5/10G01J5/20H01L27/14603H01L27/14625H01L27/1465H01L31/022408H01L31/0232H01L31/03529Y02E10/50
    • PROBLEM TO BE SOLVED: To provide a photodetector which can detect electromagnetic radiation to obtain optimal response time regardless of plasmon structure to be used, for solving problems.
      SOLUTION: This photodetector can detect electromagnetic radiation, equipped with a doped semiconductor absorption layer (12) to the radiation which can convert this radiation into charge carrier, a reflective layer (22) located under the semiconductor layer (12) to reflect any incident radiation not absorbed by the semiconductor layer (12) towards the layer (12) itself, and a metallic structure (16) arranged on the semiconductor layer (12) to form a surface plasmon resonator jointly with the semiconductor layer (12) so as to concentrate the incident radiations to the metallic structure (16) into electromagnetic field concentration zones of the semiconductor layer (12). Thus a semiconductor zones (24) for collecting any charge carriers doped opposite to doping of the semiconductor layer (12) are formed within the semiconductor layer (12) to have topology complementing the topology of the electromagnetic field concentration zones.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了解决问题,提供一种可以检测电磁辐射以获得最佳响应时间而不管使用等离子体结构的光电检测器。 解决方案:该光电检测器可以检测电磁辐射,该电磁辐射配备有可将该辐射转换为电荷载体的辐射的掺杂半导体吸收层(12),位于半导体层(12)下方的反射层(22) 任何不被半导体层(12)吸收到层(12)本身的入射辐射和布置在半导体层(12)上以与半导体层(12)共同形成表面等离子体共振器的金属结构(16) 以将入射的辐射集中到金属结构(16)到半导体层(12)的电磁场集中区域中。 因此,在半导体层(12)内形成用于收集与半导体层(12)掺杂相反掺杂的任何电荷载流子的半导体区(24),以具有补充电磁场浓度区的拓扑的拓扑。 版权所有(C)2011,JPO&INPIT
    • 2. 发明专利
    • Manufacture of infrared detector
    • 红外探测器的制造
    • JPS61139073A
    • 1986-06-26
    • JP26108684
    • 1984-12-10
    • Mitsubishi Electric Corp
    • HISA YOSHIHIRO
    • H01L31/02H01L31/103
    • H01L31/1032
    • PURPOSE:To obtain a PV type infrared detector having large Ro and high performance by making the forbidden band width of a surface layer section in a compound semiconductor substrate larger than that of the substrate through an interdiffusion. CONSTITUTION:A surface layer 8, forbidden band width thereof is larger than Hg1-xCdxTe(x=0.2) and which consists of a compound semiconductor such as CdTe, is formed to the upper section of a compound semiconductor substrate 1. An interdiffusion layer 9 is shaped on these opposite surface through treatment at a high temperature. The layers upper than the surface of the substrate 1 are removed, an impurity intrusion preventive layer functioning as an electrical insulating layer in combination is formed, an impurity is doped to the surface of the substrate 1 from an opening section in the layer 2 to shape an impurity doped layer 4, and a P-N junction is formed near the layer 4. Lastly, an electrically insulating protective film 6 through which infrared rays are transmitted is shaped onto the surface of the impurity doped layer 4, and a metallic electrode 3 is formed.
    • 目的:通过相互扩散,通过使化合物半导体衬底中的表面层部分的禁带宽度大于衬底的宽度,获得具有大Ro和高性能的PV型红外检测器。 构成:在化合物半导体衬底1的上部形成表面层8,其禁带宽度大于Hg1-xCdxTe(x = 0.2),并由化合物半导体如CdTe组成。相互扩散层9 通过高温处理在这些相对的表面上成形。 除去基板1的表面以上的层,形成作为电绝缘层组合起来的杂质侵入防止层,从层2的开口部向基板1的表面掺杂杂质成形 在层4附近形成杂质掺杂层4和PN结。最后,在杂质掺杂层4的表面上形成透射红外线的电绝缘保护膜6,形成金属电极3 。
    • 3. 发明专利
    • Manufacture of semiconductor element
    • 半导体元件的制造
    • JPS5979582A
    • 1984-05-08
    • JP19105982
    • 1982-10-29
    • Fujitsu Ltd
    • UEDA TOMOSHIYOSHIKAWA MITSUOITOU MICHIHARUMARUYAMA KENJI
    • H01L31/10H01L21/308H01L31/103
    • H01L31/1032
    • PURPOSE:To reduce the pollution of a crystal growing layer for forming an element and to simplify an element forming procedures by a method wherein a crystal growing layer for forming an element and a crystal layer for impurity diffusing mask are continuously laminated on a substrate. CONSTITUTION:A crystal layer 2 made of Hg1-xCdxTe and another crystal layer 21 made of highly resistive CdTe as a protective layer are successively formed on a semiconductor substrate 1 made of CdTe. Firstly after coating the surface of the layer 21 with a resist film 4 and patterning the film 4 as specified, a part of the layer 21 only corresponding to the specified area region 5 on the surface of the layer 2 is selectively removed by etching to expose the surface of the region 5 using the patterned film 4 as a mask. Secondly an impurity is diffused on the exposed layer 2 using the layer 21 as a mask to form the layer 2 and a reverse conductive type element active region 6. Through these procedures, the element forming process may be simplified and the pollution on the surface of the crystal layer 2 protected by the layer 21 may be reduced remarkably.
    • 目的:为了减少用于形成元件的晶体生长层的污染,并且通过将用于形成元素的晶体生长层和用于杂质扩散掩模的晶体层连续地层叠在基板上的方法简化元件形成步骤。 构成:在由CdTe制成的半导体衬底1上依次形成由Hg1-xCdxTe制成的晶体层2和由高电阻CdTe制成的另一晶体层21作为保护层。 首先用抗蚀剂膜4涂覆层21的表面,并按规定对膜4进行图案化,仅通过蚀刻选择性地除去层2的仅与层2表面上的规定区域5相对应的部分,以露出 使用图案化膜4的区域5的表面作为掩模。 其次,使用层21作为掩模将杂质扩散到曝光层2上以形成层2和反向导电型元件有源区6.通过这些步骤,可以简化元件形成工艺,并且在表面上的污染 由层21保护的晶体层2可以显着地减小。
    • 7. 发明专利
    • Light detection element
    • 光检测元件
    • JP2011023720A
    • 2011-02-03
    • JP2010158017
    • 2010-07-12
    • Commissariat A L'energie Atomique Et Aux Energies Alternativesコミサリア ア エナジー アトミック エ オックス エナジーズ オルタネティヴ
    • BOUTAMI SALIMESPIAU DE LAMAESTRE ROCHLE PERCHEC JEROME
    • H01L31/10
    • H01L31/1032H01L31/101
    • PROBLEM TO BE SOLVED: To provide a light detection element having an extremely thin semiconductor layer.
      SOLUTION: The light detection element to detect light of which wavelength is close to λ
      0 in vacuum includes a semiconductor layer (1) of which refractive index is ns and thickness is in an range from λ
      0 /4ns to λ
      0 /20ns, a first medium (3) which is positioned on one side of the semiconductor layer (1), has a first refractive index smaller than the refractive index ns, and transmits the light, a second medium (6) which is positioned on another side of the semiconductor layer (1), has a second refractive index ns smaller than ns, and has an area (5) of which width is approximately equal to λ
      0 /ns, and a third medium (7) which is positioned on another side of the semiconductor layer (1) and on both sides of the area (5), has a third refractive index larger than the second refractive index, and forms a reflective interface with the second medium (6).
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供具有极薄半导体层的光检测元件。 解决方案:在真空中检测波长接近λ 0 的光的光检测元件包括折射率为ns的半导体层(1),并且厚度在λ的范围内 位于半导体层(1)一侧的第一介质(3)的第一折射率小于 折射率ns,并透射光,位于半导体层(1)的另一侧的第二介质(6)具有小于ns的第二折射率ns,并且具有宽度(5)的宽度 大约等于λ 0 / ns,并且位于半导体层(1)的另一侧上并位于区域(5)两侧的第三介质(7)具有第三 折射率大于第二折射率,并且与第二介质(6)形成反射界面。 版权所有(C)2011,JPO&INPIT
    • 8. 发明专利
    • Radiation detector
    • 辐射探测器
    • JP2010185753A
    • 2010-08-26
    • JP2009029668
    • 2009-02-12
    • Hitachi Cable Ltd日立電線株式会社
    • RYU SHUGENSUNAGA YOSHINORIKAWAUCHI HIDEKIINOUE SHINICHITAKAHASHI ISAO
    • G01T7/00G01T1/24
    • H01L31/1032H01L31/0203H01L31/0296
    • PROBLEM TO BE SOLVED: To provide a radiation detector which can be arranged at high density, and has high connection reliability. SOLUTION: This radiation detector 1 includes: a semiconductor element capable of detecting a radiation; a substrate 20 on which the semiconductor element is fixed; and a flexible substrate 40 having flexibility, and having a connection pattern to be connected to an electrode for an element provided on the opposite side to the substrate 20 of the semiconductor element. The semiconductor element is provided on one surface of the substrate 20, and the flexible substrate 40 is provided on the opposite side of the substrate 20 of the semiconductor element. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供可以以高密度布置并且具有高连接可靠性的辐射检测器。 解决方案:该辐射检测器1包括:能够检测辐射的半导体元件; 固定半导体元件的基板20; 以及具有柔性的柔性基板40,并且具有连接图案以连接到设置在与半导体元件的基板20相反的一侧上的元件的电极。 半导体元件设置在基板20的一个表面上,柔性基板40设置在半导体元件的基板20的相反侧。 版权所有(C)2010,JPO&INPIT