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    • 5. 发明专利
    • Powder removing apparatus, molding system, and method of manufacturing molded object
    • 粉末去除装置,成型系统及其制造方法
    • JP2013049137A
    • 2013-03-14
    • JP2011186676
    • 2011-08-30
    • Sony Corpソニー株式会社
    • MORIKAWA HIROAKI
    • B29C67/00
    • B28B17/04B29C64/153B29C64/35B29C67/0077B29C67/0096B33Y40/00
    • PROBLEM TO BE SOLVED: To provide a powder removing apparatus capable of removing power, and to provide a molding system and a method of manufacturing a molded object equipped with the same.SOLUTION: The powder removing apparatus includes: a box; a stage moving mechanism; and a powder removing processing mechanism. The box includes: a body with an opening; and a stage movably provided in the body. The box can accommodate a molded object and non-bonding powder to arrange the molded object, which is formed using powder according to a rapid prototyping technique, on the stage together with the non-bonding powder. The stage moving mechanism can move the stage upward relative to the body inside the body. The powder removing processing mechanism removes the non-bonding powder existing around the molded object extruded by a driving operation of the stage moving mechanism through the opening.
    • 要解决的问题:提供一种能够去除电力的粉末去除装置,以及提供一种模制系统及其制造方法。 解决方案:粉末去除装置包括:盒; 阶段移动机制; 和粉末去除处理机构。 盒子包括:一个开放的身体; 以及可移动地设置在身体中的台。 该盒可以容纳成型物体和非粘合粉末,以使用粉末形成的成型物体,其与快速成型技术一起在非接合粉末的台面上。 舞台移动机构可以相对于身体内的身体向上移动舞台。 粉末去除处理机构通过开口移除由台架移动机构的驱动操作而挤出的模制品周围存在的非粘结粉末。 版权所有(C)2013,JPO&INPIT