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1. 发明专利

JPH1166245A CARD-IN OPERATION TYPE ELECTRONIC EQUIPMENT 失效
公开(公告)号：JPH1166245A
公开(公告)日：1999-03-09
申请号：JP21788597
申请日：1997-08-12
申请人： YAMAICHI ELECTRIC CO LTD
发明人： SATO SHIGERU
IPC分类号： G06K13/06 , G06K17/00 , H01R13/633
摘要： PROBLEM TO BE SOLVED: To eliminate card damages due to extraction by fingers and spoiling of the outward appearance and size reduction due to the installation of an eject button by enabling card ejecting operation through depression by fingers in the insertion direction. SOLUTION: When the rear edge of a memory card 1 in an inserted state is pressed against the elasticity of a spring 23 after the memory card 1 has been used, a card tray 8 and a slide cam 16 move forwards within the range of a back stroke and the slide cam 16, while disengaged from an engagement part slides on a 2nd slanting cam surface toward the other end of a 1st slanting cam surface which is provided at the front end of a guide part 19. When the memory card 1 is released from being pressed by fingers, the card tray 8 and slide cam 16 move back along the guide path 19 on the other side of a fixed cam 15 from the end part of the 2nd slanting cam surface with the accumulated elastic force of the card ejecting spring 23 to pass by the rear end of the fixed cam 15 and in this returning process, they reach the rear end of the guide path 19 under the guidance of a 3rd slanting cam surface 24, thereby forming a card ejection position.

2. 发明专利

JPH1145905A CONTACT CONVERSION STRUCTURE FOR IC CHIP AND METHOD OF FORMING THE SAME 失效
公开(公告)号：JPH1145905A
公开(公告)日：1999-02-16
申请号：JP19894497
申请日：1997-07-24
申请人： YAMAICHI ELECTRIC CO LTD
发明人： SUZUKI NOBUSHI , OHIRA HIROSHI , IMAMURA EIJI
IPC分类号： H01L21/60 , H05K1/11 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a contact conversion structure for an IC chip which permits the chip and shape of electrodes of the chip to be advantageously converted in the face-down system and accomplishes a high-reliability connection with a simple structure, without using an interposer board of the contact conversion structure in the conventional face-down system, in addition at a low cost. SOLUTION: The surface of an IC chip 2 on which electrodes 2 are disposed is covered with an insulation sheet 3 overlaid on the opposite side having leads 4 having outer contacts 5 thereon. The leads 4 have local portions plastically bent to the electrodes 2 through the insulation sheet 3 to form bent parts 6 electrically connected to the electrodes 2.

3. 发明专利

JPH10303327A CONTACT POINT CONVERSION STRUCTURE OF SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP COMPRISING CONTACT POINT CONVERSION STRUCTURE 失效
公开(公告)号：JPH10303327A
公开(公告)日：1998-11-13
申请号：JP10633597
申请日：1997-04-23
申请人： YAMAICHI ELECTRIC CO LTD
发明人： SUZUKI NOBUSHI , OHIRA HIROSHI , IMAMURA EIJI
IPC分类号： H01L21/3205 , H01L23/12 , H01L23/29 , H01L23/485 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To make packaging on a wafer easier, by pasting a film of liquid crystal polymer on a semiconductor chip, and connecting electrodes on the semiconductor chip to external connection points formed on an outside surface of the liquid crystal polymer film through the liquid crystal polymer film. SOLUTION: On a surface on such side of a semiconductor chip 13 as multiple electrodes 15 are allocated, a liquid crystal polymer film 11 is so pasted as to cover the electrodes 15, and on the surface on the side opposite to such surface as to be pasted to the liquid crystal polymer film 11, respective external contact points 12 corresponding to the electrodes 15 are allocated. Then, each external contact point 12 and each electrode 15 are electrically connected together through the liquid crystal polymer film 11, and the external contact point 12 is constituted as a connection means for surface-mounting to a wiring circuit substrate, etc. Thus, a packaging at a semiconductor wafer level is appropriately promoted, for achieving cost reduction.

4. 发明专利

JPH10294552A MOUNT CIRCUIT DEVICE 失效
公开(公告)号：JPH10294552A
公开(公告)日：1998-11-04
申请号：JP10188897
申请日：1997-04-18
申请人： YAMAICHI ELECTRIC CO LTD
发明人： OHIRA HIROSHI
IPC分类号： H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a mount circuit device which holds and displays reliability in good yield while making it possible to easily mount, demount, and replace a mounted electronic component and repair the mount circuit device. SOLUTION: A base wiring board 5 which has a connected part 5a on its main surface is provided and a connection terminal 7a is positioned at the connected part 5a of the base wiring board 5 to mount an electronic component 7. Here, a magnetic field producing means 6 is provided to electrically and mechanically connect and fix the connected part 5a of the base wiring board and the connection terminal 7a of the electronic component 7 opposite with a magnetic force.

5. 发明专利

JPH10294158A IC SOCKET FOR IC PACKAGE 失效
公开(公告)号：JPH10294158A
公开(公告)日：1998-11-04
申请号：JP10068197
申请日：1997-04-17
申请人： YAMAICHI ELECTRIC CO LTD
发明人： MATSUDA EIJI , SATO SHIGERU , ISHII RYOJI
IPC分类号： H01R33/76 , G01R31/26 , H01L23/32 , H05K7/10
摘要： PROBLEM TO BE SOLVED: To prevent deflection of a pressure member and to facilitate removal of an IC package by surely holding the IC lead of the IC package in contact with the contact of a socket. SOLUTION: An IC pedestal 13 is vertically movably interposed between a socket 3 and a pressure member 4, a contact 5 having a vertical slit 6 is inserted into a through hole 19 provided in the IC pedestal 13, an IC lead 2 is depressed by the pressure member 4 together with the IC pedestal 13, and as the end of the contact 5 is raised out of the through hole 19 in the IC pedestal 13 with the depressing of the IC lead 2, the IC lead 2 is pushed into the vertical slit 6.

6. 发明专利

JPH10144418A CARD CONTACT STRUCTURE 失效
公开(公告)号：JPH10144418A
公开(公告)日：1998-05-29
申请号：JP29540496
申请日：1996-11-07
申请人： YAMAICHI ELECTRIC CO LTD
发明人： IGARASHI MINORU
IPC分类号： H01R24/00 , G06K7/00 , H01R23/68 , H01R23/02
摘要： PROBLEM TO BE SOLVED: To properly accumulate a pre-load in a contact for card contact when a card is inserted, prevent production of elastic deterioration by previously accumulating the pre-load at stand-by as in the past, and prevent production of deformation due to pressing of the card by excessively heightening a protruding amount of a contact part of contact. SOLUTION: In almost a vertical direction relating to a card insert direction, a floating member 6 provided vertically movably in provided, the floating member 6 is depressed by a card 4, to be arranged so as to lower down in the almost vertical direction, a contact 5 arranged so as to come into press contact with an electrode pad 10, arranged in a lower surface of the card 4, is depressed by the floating member 6 lowered down, displaced downward and arranged so as to accumulate upward elastic force.

7. 发明专利

JPH09318397A METHOD AND DEVICE FOR RECORDING DATA OF IMPULSE VIBRATION WAVEFORM 失效
公开(公告)号：JPH09318397A
公开(公告)日：1997-12-12
申请号：JP13385496
申请日：1996-05-28
申请人： YAMAICHI ELECTRIC CO LTD , TOSHIBA CORP
发明人： YABUSHITA SHUICHI , MIURA SHINSUKE , ITOI TAKESHI , OZAWA TAMOTSU
IPC分类号： G01D9/00 , G06F17/40
摘要： PROBLEM TO BE SOLVED: To provide the method and the device for recording the data of impulse vibration waveform, which are useful when the data of the impulse vibration waveform for a long time are recorded by using an IC memory card, and to provide the above dercibed method and device, which can perform the simultaneous measurement and recording at a plurality of measuring points of a structure rationally at the same time. SOLUTION: This device continuously detects impulse vibrations as the data of the vibrating waveform with a plurality of sensors 1 arranged at a plurality of measuring points and temperaturily stores the vibration-waveform data, which are continuously detected in these sensors 1 alternately in a plurality of buffer memory parts 5 and 6 in time series. Then, at every time the amount of tempoary memories in the respective buffer memory parts 5 and 6 reach the specified amount, these temporary memory data are alternately transferred into a memory card 8, recorded in time series and maintained by themselves.

8. 发明专利

JPH09204970A ENTANGLEMENT PREVENTING MECHANISM IN THREE-CONTACT PIECE TYPE CONTACT 失效
公开(公告)号：JPH09204970A
公开(公告)日：1997-08-05
申请号：JP3289696
申请日：1996-01-26
申请人： YAMAICHI ELECTRIC CO LTD
发明人： KANEKO TETSUYA
IPC分类号： H01R13/11 , H01L23/32 , H01R13/115 , H01R24/00 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To suppress the intervention of another contact to a slit formed between respective adjacent edge parts of each of a first and a second contact piece and a third contact piece in a three-contact piece type contact, and effectively prevent three-contact piece type contacts from being mutually entangled to obstruct the automatic planting of the contact to a socket base or cause the deformation of the contact. SOLUTION: In a three-contact piece type contact having a first contact piece 1 and a second contact piece 2 arranged opposite to each other to nip the lead pin of an IC, and a third contact piece 3 arranged so as to be capable of contacting one side of the lead pin on one side between the opposed surfaces of the first contact piece 1 and the second contact piece 2, the third contact piece 3 has entanglement preventing pieces 7 on each of the adjacent edge parts to the first contact piece 1 and the second contact piece 2, and the entanglement preventing pieces 7 are protruded into a slit 5 extended between adjacent edge parts 1a or 2a, and 3a of each of the first contact piece 1 and the second contact piece 2 and the third contact piece 3 to prevent the intervention of another contact into the slit 5.

9. 发明专利

JPH09185980A IC SOCKET 失效
公开(公告)号：JPH09185980A
公开(公告)日：1997-07-15
申请号：JP35319095
申请日：1995-12-28
申请人： YAMAICHI ELECTRIC CO LTD
发明人： TSUBOTA EISAKU
IPC分类号： H01R13/639 , H01L23/32 , H01R33/76 , H05K7/10
摘要： PROBLEM TO BE SOLVED: To facilitate the assembling and the detaching of an IC pressing member and at the same time to facilitate replacement when a pressing pad is worn by assembling the IC pressing member with a pressing cover through an elastically engaging mechanism. SOLUTION: An elastically engaging mechanism comprising an elastic support piece 13 and a protruding part 12 is provided in the central part of the respective opposed side surfaces of an IC pressing member 3, namely, in the side surface of the central part upon which the rotatable fulcrum of the member 3 is positioned. The base end of the support piece 13 is connected to the side surface of the member 3, and a projecting part 12 is integratedly molded and projected in the outside surface of the free end part (the lower end part) of the support piece 13 extended downward in the longitudinal direction along the side surface of the member 3 from the connection end. The part 12 is assembled into the recessed part 11 of the IC pressing cover 2 so as to be able to elastically engage therewith and elastically get away therefrom. Namely, the rotation fulcrum of the cover 2 exists in the upper part of the elastically engaging mechanism, and the connection end which is the elastic deformation fulcrum of the support piece 13 exists right under the rotation fulcrum of the cover 2. Therefore, the assembling and the detaching of the member 3 and the replacement of the pressing pad 5 can be facilitated and an assembling property can be enhanced.

10. 发明专利

JPH09178805A CONTACT STRUCTURE OF IC 失效
公开(公告)号：JPH09178805A
公开(公告)日：1997-07-11
申请号：JP34984995
申请日：1995-12-21
申请人： YAMAICHI ELECTRIC CO LTD
发明人： MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a sound contact even when the contact area is limited by pressing an IC by the thermal expansion of a thermal expanding member to finelymove the IC, and causing a wiping in the contact critical surface between the IC and a contact object by the fine movement of the IC. SOLUTION: A square IC 1 has an infinite number of fine contacts 2 arranged at fine pitches on the surface, and contacts 3 of contact object are vertically pressurized to and brought into contact with the surfaces of the contacts 2. A thermal expanding member 4 is arranged to regulate the side surface of the IC 1, thereby functioning it as a positioning member, while it presses the side surface of the IC 1 by thermal expansion to provide a wiping action. One of the opposed side surfaces of the IC 1 is regulated by the member 4, the other is elastically regulated by a side surface regulating member 5 elastically held by a spring member 6, and the member 4 is arranged so as to press the IC 1 against the elastic force of the member 5. The member 6 elastically presses the member 5 to one side surface of the IC 1, and the member 4 finely moves the IC 1 against the pressing force of the members 5, 6.

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