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1. 发明专利

JP2003189444A ELECTRIC CONNECTION BOX 审中-公开
公开(公告)号：JP2003189444A
公开(公告)日：2003-07-04
申请号：JP2001377081
申请日：2001-12-11
申请人： YAZAKI CORP
发明人： TANAKA YOSHIYUKI , ASHIYA HIROYUKI
IPC分类号： H05K7/12 , H02G3/16
摘要： PROBLEM TO BE SOLVED: To provide an electric connection box in which the anomalous heat generation of a busbar associated with an eddy current is surely detected. SOLUTION: A contact segment 20c having a cross section of an L shape is integrally formed at part of the side edge of the busbar 20. A hinge 50g having a cross section of a U shape is integrally formed at part of a resin plate 50. A temperature detection element 80 is sandwiched in a gap G formed between the contact segment 20c and the hinge 50g so as to be press-contacted to the contact segment 20c by the elasticity of the hinge 50g. Since the width of the gap G is set smaller than the width W of the temperature detection element 80, the contact segment 20c surely contacts with the temperature detection element 80. Furthermore, the temperature detection element 80 is constantly and stably press-contacted to the contact segment 20c of the busbar 20 by the elasticity of the hinge 50g having the cross section of the U shape. COPYRIGHT: (C)2003,JPO

2. 发明专利

JP2002270263A HOLDING STRUCTURE OF TERMINAL 失效
公开(公告)号：JP2002270263A
公开(公告)日：2002-09-20
申请号：JP2001063154
申请日：2001-03-07
申请人： YAZAKI CORP
发明人： ASHIYA HIROYUKI , TANAKA YOSHIYUKI , MAKI YAYOI
IPC分类号： H01R12/32
摘要： PROBLEM TO BE SOLVED: To provide a holding structure of a terminal which can alleviate a soldering stress due to heat acting on the soldered part and securely prevent generation of soldering cracks. SOLUTION: With the holding structure of the terminal 26 in which a soldered part 26b of the terminal 26 is held on a land part 23 of a board 21 by soldering, a pair of soldered parts 26b, 26b are formed by dividing the soldered part of the terminal 26. A connection hole each 21b, 21b is formed at a position opposing the pair of the soldered parts 26b, 26b of the board 21 and a pair of round- shaped terminal insertion holes 23a, 23a at a position opposing the pair of soldered parts 26b, 26b of the land part 23. Further, a constricted part each 23b is formed around the land part 23 between the pair of the terminal insertion holes 23a, 23a of the land part 23.

3. 发明专利

JP2001135156A FLAT CABLE 失效
公开(公告)号：JP2001135156A
公开(公告)日：2001-05-18
申请号：JP31597699
申请日：1999-11-05
申请人： YAZAKI CORP
发明人： TANAKA YOSHIYUKI , YOSHIKAWA TOMOKI
IPC分类号： H01R35/04 , B60R16/02 , B60R16/027 , H01B7/08 , H01R35/02 , H02G11/02
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable flat cable, maintaining insulating property, achieving multiple circuits, offering applicability to complicated shapes and allowing a reduced thickness. SOLUTION: A flat cable 7, which makes electric connection between a fixed body consisting of an undercover 1 and a cover 2 and a rotor being coaxially rotatable with respect to the fixed body and consisting of an upper cover 3 and a rotator 4, has a plurality of conductors 13 formed in an etching or plating method and laminated in two or more layers while preventing conduction of the conductors 13 in each layer to each other, the laminated conductors 13 being held between insulating films 14 into multilayers.

4. 发明专利

JP2000174412A PROTECTIVE STRUCTURE FOR SOLDERING PORTION OF HEAT GENERATING PART, AND FORMING METHOD OF THE PROTECTIVE STRUCTURE 失效
公开(公告)号：JP2000174412A
公开(公告)日：2000-06-23
申请号：JP34904898
申请日：1998-12-08
申请人： YAZAKI CORP
发明人： SUZUKI MASATAKA , SUZUKI MASASHI , MARUO HISAFUMI , TANAKA YOSHIYUKI , ASHIYA HIROYUKI , MAKI YAYOI
IPC分类号： H05K1/18 , H01R12/32
摘要： PROBLEM TO BE SOLVED: To provide a protective structure for the soldering portions of heat generating parts, wherein its heat radiating quality is satisfactory and the size of a protective unit can be reduced. SOLUTION: In a lower case 11, heat-generating parts 12, 13, 14, an electrical component 15, and a control board 16, etc., are stored for changing a resin 18 into the lower case 11. Terminals 12A, 13A, 14A, 15A, 16A of the respective electrical components are soldered to an FPC 19, and the soldering portions can be protected by fitting an upper case 20 onto the lower case 11. Also, since through soldering the terminals 12A-15A to the FPC 19, the stresses due to heat generations from the electrical component side are absorbed by the FPC 19, the soldering portions can be protected surely.

5. 发明专利

JPH0950841A JOINING PORTION OF FLAT CABLE AND LEAD WIRE AND ITS FORMATION 失效
公开(公告)号：JPH0950841A
公开(公告)日：1997-02-18
申请号：JP1755496
申请日：1996-02-02
申请人： YAZAKI CORP
发明人： TANAKA YOSHIYUKI , SUZUKI MASATAKA , ASHIYA HIROYUKI , TSUJINO NOBUYUKI , ICHIKAWA HIDEHIRO
IPC分类号： H01R43/02 , H01R4/02 , H01R9/07
摘要： PROBLEM TO BE SOLVED: To improve the workability of a post-process, and the stability and reliability of the electrical and mechanical connection by forming the conductor portions of a flat cable into terminals in the case of the connection between the conductors of the flat cable and lead wires. SOLUTION: In a joining portion in which a flat cable 1 having plural conductors 1a and lead wires 6 are connected mutually via a joint terminal 3, one sides 3a of the joint terminal 3 are formed in coincident with the pitch of the respective conductors 1a and the other sides 3b are formed in coincident with the disposed pitch of the lead wires. The respective conductors 1a of the flat cable 1 are welded and connected in a state sandwiched between the other sides 3a of the joint terminal 3 and auxiliary terminals 5, and to other sides 3b of the respective joint terminal 3, the corresponding conductors 6a of the lead wires 6 are connected.

6. 发明专利

JP2004039377A Structure for applying moisture-proof agent onto terminal connection portion in electronic component 审中-公开
公开(公告)号：JP2004039377A
公开(公告)日：2004-02-05
申请号：JP2002193241
申请日：2002-07-02
申请人： Yazaki Corp , 矢崎総業株式会社
发明人： ASHIYA HIROYUKI , TANAKA YOSHIYUKI , MAKI YAYOI
IPC分类号： H01R43/00 , H01R13/52 , H01R12/04
摘要： PROBLEM TO BE SOLVED: To surely apply a moisture-proof agent onto a connection portion in a terminal by simple structure, even when an applying portion for the moisture-proof agent is narrow. SOLUTION: When an attaching plate 30 is overlapped with a prescribed clearance δfrom a substrate 20, and when the terminal 51 of an electronic component 50 mounted on the attaching plate 30 is connected to the substrate 20, an envelope wall 35 for enveloping the connection portion 52 is formed to close the clearance δfrom the attaching plate 30, an injection port 36 is formed in the attaching plate 30 to be communicated to an inside of the envelope wall 35, the moisture-proof agent is injected into the inside of the envelope wall 35 from the injection port 36, a flow-out port 37 for the moisture-proof agent is formed in one portion of the envelope wall 35, the moisture-proof agent injected from the injection port 36 flows out from the flow-out port 37, and the moisture-proof agent is thereby developed uniformly in the inside of the envelope wall 35 to be surely deposited evenly to the connection portion 52 of the terminal 50. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004031807A Supporting structure for electronic component with lead 审中-公开
公开(公告)号：JP2004031807A
公开(公告)日：2004-01-29
申请号：JP2002188369
申请日：2002-06-27
申请人： Yazaki Corp , 矢崎総業株式会社
发明人： SUZUKI MASASHI , TANAKA YOSHIYUKI , MATSUURA SHINGO
IPC分类号： H05K7/08 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To provide a supporting structure for an electronic component with leads which allows an assured support of an electronic component while reducing the number of components.
SOLUTION: On an installation plate 30 which is laid on a substrate 20 and is joined therewith, the electronic component 50 is mounted, being separated from the substrate 20. A lead 51 projecting from a side end face 50a of the electronic component 50 is connected to the substrate 20 by soldering 52. The installation plate 30 is equipped with a projecting upright portion 34e which has at least a height H corresponding to a height h of the side end face 50a and is abutted against nearly the center of the side end face 50a of the electronic component 50. The behavior of the electronic component 50 which tends to swing around the lead 51 by vibration is suppressed by the projecting portion 34e.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003178661A RELAY ELEMENT AND ITS MOUNTING STRUCTURE 审中-公开
公开(公告)号：JP2003178661A
公开(公告)日：2003-06-27
申请号：JP2001377219
申请日：2001-12-11
申请人： YAZAKI CORP
发明人： ASHIYA HIROYUKI , SUZUKI MASATAKA , TANAKA YOSHIYUKI , MATSUURA SHINGO
IPC分类号： H05K3/34 , H01H1/58 , H01H45/04 , H01H45/14 , H01H50/14 , H01H50/44 , H05K1/18 , H05K3/30
摘要： PROBLEM TO BE SOLVED: To absorb stress opposing to an outside force generating in each terminal by expansion and contraction of a cover caused by heat generated from an electromagnetic coil or others, without damaging electrical connection between a terminal and a wiring board. SOLUTION: A plurality of terminals 11, 13 for electrical connection are soldered on the wiring board 20 at the tip parts 11b, 13b, Base end parts 11a, 13a of the terminals 11, 13 projected out to the outside from the cover 7 made of a thermally expanding material to which outside force is applied from the cover 7 by thermal expansion caused by heat generated from the electromagnetic coil 5, and terminals 11, 13 are formed so as to have the specified length L' in the extending direction so that the specified length L necessary for giving flexibility is ensured in the middle parts 11c, 13c so as to absorb stress opposing to the outside force by the bending deformation of the middle parts 11c, 13c of terminals 11, 13 positioned nearer to the cover 7 than the wiring board 20 in a state mounted on the wiring board 20. COPYRIGHT: (C)2003,JPO

9. 发明专利

JPH0952185A ULTRASONIC WELDDING MACHINE 失效
公开(公告)号：JPH0952185A
公开(公告)日：1997-02-25
申请号：JP20688095
申请日：1995-08-14
申请人： YAZAKI CORP
发明人： SUZUKI MASATAKA , ASHIYA HIROYUKI , TANAKA YOSHIYUKI , MOCHIZUKI SHINOBU , KOIKE HIROSHI
IPC分类号： B06B3/00 , B23K20/10 , B23K20/12
摘要： PROBLEM TO BE SOLVED: To surely weld a flat conductor to other joining member with reducing welding trace. SOLUTION: Curved chamfered parts 15, 16 for joining members 6, 9, plural recessed grooves 17, 18 orthogonally crossing in the vibrating direction of horn tip and flat faces 11a, 13a in contact with joining members are formed to one or both of a horn tip 11 and anvil 13. The curved chamfered part, recessed groove and flat part are formed as facing to a low strength conductive member 6. The recessed grooves 17, 18 are formed in the width narrower than that of the flat part and curved chamfered part 20 are formed at the intersecting points with flat faces.

10. 发明专利

JPH11312568A CONNECTOR FOR CONNECTING WIRE TO FLAT CABLE IN ELECTRICAL CONNECTION DEVICE FOR STEERING 失效
公开(公告)号：JPH11312568A
公开(公告)日：1999-11-09
申请号：JP11718898
申请日：1998-04-27
申请人： YAZAKI CORP
发明人： TANAKA YOSHIYUKI , IMAI TARO
IPC分类号： B60R16/027 , B60R16/02 , B62D1/04 , H01R4/02 , H01R35/02 , H01R35/04 , H01R23/66
摘要： PROBLEM TO BE SOLVED: To provide a connection with improved reliability by facilitating the securing of insulation between the adjacent circuits of the connection, regardless of the increase in the number of signal circuits. SOLUTION: A plurality of bus bars 1 are insert molded in a holder while having spaces 7 adjoining to one anther in the cross direction of the bus bars 1, and by having an ultrasonic wave generating jig 6 having a wire abutting recess part 9f which is formed to have an opening width d1 greater than the width of the busbar 1 and a sufficient depth d2 to encompass the core wire part 4a of the wire 4, the core wire part 4a of the wire 4 is welded ultrasonically in place by being pressed against the wire abutting recess part 9. Circuits for the respective bus bars 1 are isolated from one another through insertion into the space parts 7 at the insulating wall 12a of a protective case 11 which is assembled to the holder after a flat cable 2, and the wire 4 are welded in place.

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