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1. 发明专利

JP2012162738A Polyimide film 有权
标题翻译：聚酰亚胺膜
公开(公告)号：JP2012162738A
公开(公告)日：2012-08-30
申请号：JP2012105760
申请日：2012-05-07
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： TSUTSUMI MASAYUKI , KITAGAWA SUSUMU , AZUMA MASAO , MAEDA SATOSHI , KAWAHARA KEIZO , TAKAHASHI NORIKO , YABUKI HIROKO
IPC分类号： C08J5/18 , B32B15/08 , B32B15/088 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film exhibiting high resistance to repeated flexing and high resistance to repeated twisting.SOLUTION: This polyimide film having high resistance to repeated flexing and high resistance to repeated twisting is obtained by the steps of: applying a polyamic acid being a precursor of polyimide including a benzoxazol structure to a substrate and drying it; and subsequently carrying out imidization using a process of performing tensile deformation between the crystallization onset temperature obtained by using high output X-ray diffraction and the 90% imidization-attaining temperature obtained by IR measurement.
摘要翻译：要解决的问题：提供对反复弯曲具有高抗性并且具有高抗反复扭曲的聚酰亚胺膜。解决方案：通过以下步骤获得对反复弯曲具有高抗性和高耐反复扭转的聚酰亚胺膜：将作为包含苯并恶唑结构的聚酰亚胺的前体的聚酰胺酸涂布到基材上并将其干燥; 使用通过使用高输出X射线衍射获得的结晶起始温度与通过IR测定得到的90％酰亚胺化获得温度之间进行拉伸变形的方法进行酰亚胺化。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2008155562A Manufacturing method of polymeric film 审中-公开
标题翻译：聚合物薄膜的制造方法
公开(公告)号：JP2008155562A
公开(公告)日：2008-07-10
申请号：JP2006349109
申请日：2006-12-26
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： MAEDA SATOSHI , KAMIMURA SHOICHI , FUJITA SHINJI , TSUTSUMI MASAYUKI , YOSHIDA TAKESHI
IPC分类号： B29C41/12 , B29K79/00 , B29L7/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a polymeric film, especially a polyimide film improved in surface adhesiveness and having a cleaned surface.
SOLUTION: In the method for manufacturing the polymeric film obtained by a casting film-forming method for taking up the polymeric film in a roll form, surface treatment including treatment for applying an ultrasonic wave of 30-500 kHz and treatment for passing air at a flow velocity of 1-300 m/sec is performed. The surface treatment is preferably performed during a process immediately before the polymeric film is taken up in the roll form. This surface treatment is performed at an environment temperature of 0-90°C.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造聚合物膜的方法，特别是提高表面粘附性并具有清洁表面的聚酰亚胺膜。解决方案：在通过用于卷取聚合物膜的流延膜形成方法获得的聚合物膜的制造方法中，表面处理包括施加30-500kHz的超声波的处理和通过的处理执行流速为1-300m / sec的空气。表面处理优选在聚合物膜以辊状吸收之前的过程中进行。该表面处理在0-90℃的环境温度下进行。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008024886A Polyimide film 有权
标题翻译：聚酰亚胺膜
公开(公告)号：JP2008024886A
公开(公告)日：2008-02-07
申请号：JP2006201641
申请日：2006-07-25
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： TSUTSUMI MASAYUKI , KITAGAWA SUSUMU , AZUMA MASAO , MAEDA SATOSHI , KAWAHARA KEIZO , TAKAHASHI NORIKO , YABUKI HIROKO
IPC分类号： C08J5/18 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film exhibiting excellent resistance to repeated flexing and resistance to repeated twisting.
SOLUTION: The polyimide film having excellent resistance to repeated flexing and resistance to repeated twisting is obtained by coating on a support a polyamide acid obtained from a diamine containing ≥50 mol% paraphenylenediamine and a tetracarboxylic acid anhydride containing ≥50 mol% 3,3'-4,4' biphenyltetracarboxylic acid dianhydride, drying, and performing imidation treatment by using a process for performing tensile deformation between the crystallization starting temperature obtained by using high output X-ray diffraction and the 90% imidation attaining temperature obtained by IR measurement.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供对反复弯曲具有优异的抗性和耐反复扭转的聚酰亚胺膜。解决方案：通过在载体上涂布由含有≥50摩尔％对苯二胺的二胺和含有≥50摩尔％3的四羧酸酐得到的聚酰胺酸，获得具有优异的耐反复弯曲和耐反复扭转的聚酰亚胺膜，3'-4,4'-联苯四羧酸二酐，通过使用在通过使用高输出X射线衍射获得的结晶起始温度和通过IR获得的90％酰亚胺化获得温度之间进行拉伸变形的方法进行干燥和进行酰亚胺化处理测量。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007302756A Metallized polyimide film 审中-公开
标题翻译：金属化聚酰亚胺薄膜
公开(公告)号：JP2007302756A
公开(公告)日：2007-11-22
申请号：JP2006130995
申请日：2006-05-10
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： OKUYAMA TETSUO , TSUTSUMI MASAYUKI , KURAHARA SHUNJI , MAEDA SATOSHI
IPC分类号： C08G73/10 , C23C14/20
摘要： PROBLEM TO BE SOLVED: To provide a metallized polyimide film forming a metal thin film and suppressing trouble by heat received during formation of the metal thin film without causing wrinkles or peeling according to a dry film-forming method. SOLUTION: The metallized polyimide film is obtained by forming a metal layer having 0.5-5 μm thickness and formed on at least one surface of a polyimide film having 0.1-100 ppm content of a residual solvent according to the dry film-forming method. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供形成金属薄膜的金属化聚酰亚胺膜，并且根据干膜形成方法抑制金属薄膜形成期间接收的热量而不引起褶皱或剥离的麻烦。解决方案：金属化聚酰亚胺膜是通过形成厚度为0.5-5μm的金属层而形成的，该聚酰亚胺膜的至少一个表面具有根据干膜形成的残留溶剂含量为0.1-100ppm 方法。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007301781A Metallized polyimide film and circuit board 审中-公开
标题翻译：金属化聚酰亚胺薄膜和电路板
公开(公告)号：JP2007301781A
公开(公告)日：2007-11-22
申请号：JP2006130994
申请日：2006-05-10
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： OKUYAMA TETSUO , TSUTSUMI MASAYUKI , KURAHARA SHUNJI , MAEDA SATOSHI
IPC分类号： B32B15/088 , B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a metallized polyimide film suitable for an electronic part which also withstands the use at extremely high temperature.
SOLUTION: The metallized polyimide film is prepared by forming a metal layer at least on one side of a polyimide film obtained by the polycondensation of an aromatic diamine and an aromatic tetracarboxylic acid, especially a polyimide film having a least a pyromellitic acid residue as the residue of the aromatic tetracarboxylic acid and an aromatic diamine residue having a benzooxazole structure as the residue of the aromatic diamine and characterized in that the residual solvent amount in the polyimide film is 0.1-100 ppm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种适合于在极高温度下使用的电子部件的金属化聚酰亚胺膜。解决方案：金属化聚酰亚胺膜通过在通过芳族二胺和芳族四羧酸的缩聚获得的聚酰亚胺膜的至少一面上形成金属层来制备，特别是具有至少一个均苯四酸酸残基的聚酰亚胺膜作为芳香族四羧酸的残基和具有苯并恶唑结构的芳香族二胺残基作为芳香族二胺的残基，其特征在于，聚酰亚胺膜中的残留溶剂量为0.1〜100ppm。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006306109A Method for manufacturing polyimide benzooxazole film 审中-公开
标题翻译：制备聚酰胺苯并噻唑薄膜的方法
公开(公告)号：JP2006306109A
公开(公告)日：2006-11-09
申请号：JP2006167987
申请日：2006-06-16
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： KAMIMURA SHOICHI , NAGAYOSHI TETSUYASU , KAWAHARA KEIZO , OKAMOTO KAZUTAKE , YOSHIDA TAKESHI , MORINO MORIO , TSUTSUMI MASAYUKI
IPC分类号： B29C41/24 , B29K79/00 , B29L7/00 , C08G73/10 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a film comprising an organic material which combines heat resistance, high frequency correspondence and flexible properties at a higher level.
SOLUTION: The method for manufacturing a polyimide benzooxazole film comprises a first process of forming a polyamic acid by reacting aromatic diamines with a benzooxazole structure and aromatic tetracarboxylic anhydrides, a second process of coating a substrate with a solution containing the polyamic acid and drying it, to obtain a green film, and a third process of heat-treating the green film by the below described two stages. The first stage heat-treatment: a treatment at 150-250°C for 1-10 minutes. The second stage heat-treatment: a treatment at 400-600°C for 0.1-15 minutes.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造包含有机材料的薄膜的方法，所述有机材料在较高的水平上结合了耐热性，高频率对应性和柔性性质。解决方案：聚酰亚胺苯并恶唑膜的制造方法包括通过使芳族二胺与苯并恶唑结构和芳族四羧酸酐反应形成聚酰胺酸的第一种方法，用含有聚酰胺酸的溶液涂布基材的第二种方法，以及干燥，得到绿色膜，以及通过下述两个阶段对绿色膜进行热处理的第三种方法。第一阶段热处理：在150-250℃下处理1-10分钟。第二阶段热处理：在400-600℃下处理0.1-15分钟。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006291165A Polyimide film, method for producing the same, polyimide film roll and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜，其制造方法，聚酰亚胺膜及其制造方法
公开(公告)号：JP2006291165A
公开(公告)日：2006-10-26
申请号：JP2005319634
申请日：2005-11-02
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： TSUTSUMI MASAYUKI , OYAMA HIROKO , MAEDA SATOSHI , KAWAHARA KEIZO
IPC分类号： C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film holding heat resistance and flexibility at higher levels without causing warpage of the film for heat.
SOLUTION: The polyimide film is obtained as follows. A solution containing a precursor of the polyimide having a biphenyltetracarboxylic acid residue as a residue of at least aromatic tetracarboxylic acids and a phenylenediamine residue as a residue of aromatic diamines in an organic solvent is cast and applied onto a support to form a coated film. The resultant coated film is dried by heating so as to afford ≤5 difference in imidizing ratios on one surface side and the other surface side of the obtained precursor film. The resultant precursor film is then heat-treated to provide the polyimide film. The obtained polyimide film is wound into a roll shape with ≥100 N winding tension so as to provide a radius of curvature within the range of 30-600 mm with the surface A of the resultant film as the winding inside. Thereby, a polyimide film roll is obtained. The resultant polyimide film roll is composed of the polyimide film having ≤10% degree of curling after heat treatment at 300°C and ≤25% coefficient of variation (CV%) of the coefficient of linear expansion.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种保持耐热性和柔软性的聚酰亚胺膜，而不会引起膜热翘曲。解决方案：如下获得聚酰亚胺膜。将含有作为至少芳香族四羧酸的残基的联苯四羧酸残基的聚酰亚胺和作为有机溶剂中的芳香族二胺的残基的苯二胺残基的溶液浇铸并涂布在载体上以形成涂膜。通过加热干燥所得到的涂膜，从而在得到的前体膜的一个表面侧和另一个表面侧上的酰亚胺化比例≤5。然后对得到的前体膜进行热处理以提供聚酰亚胺膜。将得到的聚酰亚胺薄膜卷绕成≥100N卷绕张力的卷状，以使所得薄膜的表面A作为卷绕内部，提供在30〜600mm的范围内的曲率半径。由此，得到聚酰亚胺膜卷。得到的聚酰亚胺膜卷由在300℃下热处理后具有≤10％卷曲度的聚酰亚胺膜和线性膨胀系数的≤25％变异系数（CV％）组成。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006269615A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2006269615A
公开(公告)日：2006-10-05
申请号：JP2005083664
申请日：2005-03-23
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： MAEDA SATOSHI , YOSHIDA TAKESHI , TSUTSUMI MASAYUKI , KAWAHARA KEIZO
IPC分类号： H05K1/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a film-based multilayer printed wiring board configured by laminating a plurality of extremely thin printed wiring boards or printed wiring board of fine wiring to enable maintenance of film handling, industrial production easiness and stable circuit pattern formation.
SOLUTION: In the film-based printed wiring board, wiring patterns (conductor) are formed with line width of 10 μm or less, line gap of 5 μm or less and aspect ratio of 0.3 to 5 on one side or both sides of a polymer film (preferably of polyimide film or polyimide benzo-oxazole film) with tensile elastic modulus of 6 GPa or more, thickness of 10 μm or less and glass transition temperature of 150°C or higher.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过层叠多个极薄的印刷电路板或精细布线的印刷电路板而构成的薄膜基多层印刷布线板，以能够维持胶片处理，工业生产容易度和电路图形的稳定性形成。解决方案：在基于薄膜的印刷电路板中，布线图案（导体）形成为线宽为10μm以下，线间隙为5μm以下，纵横比为0.3〜5的一面或两面的聚合物膜（优选聚酰亚胺膜或聚酰亚胺苯并恶唑膜），其拉伸弹性模量为6GPa以上，厚度为10μm以下，玻璃化转变温度为150℃以上。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006190734A Printed wiring board 有权
标题翻译：印刷线路板
公开(公告)号：JP2006190734A
公开(公告)日：2006-07-20
申请号：JP2005000347
申请日：2005-01-05
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： MAEDA SATOSHI , YOSHIDA TAKESHI , TSUTSUMI MASAYUKI , KAWAHARA KEIZO
IPC分类号： H05K1/03 , C08J5/18 , C08L79/04 , H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an ultrathin multilayer printed wiring board where a film is set to be a base material, handling property of the film can be maintained, industrial production can easily be performed, a circuit pattern can stably be formed, and a plurality of ultrathin printed wiring boards and printed wiring boards of minute wiring are laminated. SOLUTION: In the printed wiring board of a film base, the wiring pattern with line width of 7 μm or below, interline gap of 8 μm or below, and thickness of 5 μm or below is formed on one face or both faces of a high polymer film (preferably polyimide film and polyimide benzo oxazole film). its modulus of elongation is 6 GPa or above, thickness is 10 μm or below, and glass dislocation temperature is 150°C or above. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供将薄膜设置为基材的超薄多层印刷线路板，可以保持薄膜的处理性能，可以容易地进行工业生产，可以稳定地形成电路图案并且层叠有多条超薄印刷线路板和微细布线的印刷线路板。解决方案：在薄膜基板的印刷电路板中，线宽为7μm以下，线间隙为8μm以下，厚度为5μm以下的布线图形形成在一个面或两面的高分子膜（优选聚酰亚胺膜和聚酰亚胺苯并恶唑膜）。其伸长模量为6GPa以上，厚度为10μm以下，玻璃脱位温度为150℃以上。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006077158A Polyimidebenzoxazole film 审中-公开
标题翻译：聚酰苯并噻唑胶片
公开(公告)号：JP2006077158A
公开(公告)日：2006-03-23
申请号：JP2004263869
申请日：2004-09-10
申请人： Toyobo Co Ltd , 東洋紡績株式会社
发明人： TSUTSUMI MASAYUKI , KAWAHARA KEIZO , YASUI JUN , MORINO MORIO
IPC分类号： C08J5/18 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a film composed of an organic material having slight temperature dependence and all of heat resistance, responsiveness to high frequency and flexibility at higher levels.
SOLUTION: The polyimidebenzoxazole film is a film consisting essentially of a polyimidebenzoxazole obtained by reacting aromatic diamines having a benzoxazole structure with aromatic tetracarboxylic anhydrides and is characterized as having the ratio ε
65 /ε
D of the dielectric constant ε
65 at 100 GHz of the film subjected to humidity conditioning under constant-temperature and constant-humidity conditions of 20°C and 65%RH for 94 h and measured by a cavity resonance perturbation method to the dielectric constant ε
D at 100 GHz of the film vacuum dried under conditions of 120°C for 24 h and measured by the cavity resonance perturbation method within the range of 1.00-1.10. The moisture content evaporated during heating at 500°C for 10 s is ≤5,000 ppm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种由具有轻微温度依赖性和全部耐热性，高频响应性和高灵敏度的有机材料构成的膜。解决方案：聚酰亚胺苯并恶唑膜是基本上由通过使具有苯并恶唑结构的芳族二胺与芳族四羧酸酐反应得到的聚酰亚胺苯并恶唑的膜，其特征在于其比例ε 65 /ε 在20℃和65％RH的恒温恒湿条件下进行湿度调节的膜在100GHz下的介电常数ε 65 的D 94小时，并测量通过空腔谐振扰动方法将膜在100GHz下的介电常数ε D 在120℃的条件下进行真空干燥24小时，并通过腔共振扰动法在1.00- 1.10。在500℃加热10秒时蒸发的水分含量≤5,000ppm。版权所有（C）2006，JPO＆NCIPI

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