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    • 1. 发明专利
    • Wire-wound electronic part
    • 有线电子部分
    • JP2005294307A
    • 2005-10-20
    • JP2004102973
    • 2004-03-31
    • Toko Inc東光株式会社
    • SASAMORI KUNIOOMURO KATSUYOSHISAKURADA KUNIYOSHI
    • H01F27/29
    • PROBLEM TO BE SOLVED: To provide a wire-wound electronic part which has high connecting reliability of a direct attachment electrode in the substrate solder of an electronic apparatus.
      SOLUTION: The wire-wound electronic part includes a winding core, a base having an electrode forming unit provided integrally with or separate from the winding core, an external electrode provided at the electrode forming unit, and a wire wound on an insulating film lead wire. In the wire-wound electronic part, chamfering or a sector-like recess is provided or a sectional L shape recess is provided on the outer periphery or the part of the outer periphery of the end corner of the electrode forming unit.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种在电子设备的基板焊料中直接附着电极具有高连接可靠性的绕线电子部件。 线绕电子部件包括绕组芯,具有与绕组芯一体设置或分离的电极形成单元的基座,设置在电极形成单元处的外部电极和缠绕在绝缘体上的线 薄膜导线。 在绕线电子部件中,设置倒角或扇形凹部,或者在电极形成单元的端部角部的外周或​​部分设置有L形凹部。 版权所有(C)2006,JPO&NCIPI