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1. 发明专利

JP2011009644A Ferrite core and electronic component 有权
标题翻译：铁素体和电子元件
公开(公告)号：JP2011009644A
公开(公告)日：2011-01-13
申请号：JP2009153997
申请日：2009-06-29
申请人： Tdk Corp , Tdk株式会社
发明人： YAMAZAKI TSUNEHIRO , OKUBO HITOSHI , SHIBUYA YOSHITAKA , MIURA YUTAKA , CHIBA KAZUNORI , MATSUI SHIGEKI
IPC分类号： H01F27/255 , H01F17/04
摘要： PROBLEM TO BE SOLVED: To provide a ferrite core with the initial permeability (μi) improved.SOLUTION: The ferrite core 1 includes a core portion 2 constituted of ferrite compositions, and a coating layer 10 formed at least on a part of a surface of the core portion, and the thermal expansion coefficient of the coating layer 10 is lower than that of the core portion.
摘要翻译：要解决的问题：提供初始磁导率（μi）提高的铁氧体磁心。解决方案：铁氧体磁芯1包括由铁氧体组成构成的芯部2和至少形成在一部分表面上的涂层10 芯部分和涂层10的热膨胀系数低于芯部的热膨胀系数。

2. 发明专利

JP2014058007A Inductance core manufacturing method and inductance core 有权
标题翻译：电感核心制造方法和电感核心
公开(公告)号：JP2014058007A
公开(公告)日：2014-04-03
申请号：JP2012203349
申请日：2012-09-14
申请人： Tdk Corp , Tdk株式会社
发明人： KOMATSU HIDEKI , ONIZUKA MASAHIRO , SOMA MANABU , ABE YOICHI , SHIBUYA YOSHITAKA , NAGAO TAKEFUMI
IPC分类号： B24B19/02 , H01F41/02
摘要： PROBLEM TO BE SOLVED: To provide an inductance core manufacturing method or the like that enables a core portion to be shaped differently from a flange portion and enables the core portion to be accurately formed.SOLUTION: The inductance core manufacturing method performs the steps of: preparing a workpiece 10 that has a columnar substrate 12 and a rotation reference portion 20 which is molded integrally with the substrate and connected to one end of the substrate and comprises a reference outer peripheral surface 22, at least one part of which is positioned nearer an outer diameter than the side peripheral surface 18 of the substrate; and grinding a part of the substrate while rotating the workpiece along the reference outer peripheral surface of the rotation reference portion.
摘要翻译：要解决的问题：提供一种电感芯制造方法等，其使得芯部能够与凸缘部分不同地成形，并且能够使芯部精确地形成。解决方案：电感芯制造方法执行以下步骤：准备具有柱状基板12和旋转基准部分20的工件10，该基准部分20与基板一体模制并连接到基板的一端并且包括参考外圆周表面22，其基准外圆周表面22的至少一部分位于外径比基板的侧周面18高; 在沿着旋转基准部的基准外周面旋转工件的同时研磨基板的一部分。

3. 发明专利

JP2011014845A Electronic component 有权
标题翻译：电子元件
公开(公告)号：JP2011014845A
公开(公告)日：2011-01-20
申请号：JP2009160055
申请日：2009-07-06
申请人： Tdk Corp , Tdk株式会社
发明人： OKUBO HITOSHI , YAMAZAKI TSUNEHIRO , CHIBA KAZUNORI , SHIBUYA YOSHITAKA , MIURA YUTAKA , SAITO HIROSATO
IPC分类号： H01F17/04 , H01F27/24 , H01F37/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic component having a coating film formed while effectively preventing the chipping and film thickness variation of the coating film and the adhesion of foreign matter to the coating film and the like.SOLUTION: In the electronic component 1 including a component body 2, and the coating film 3 formed on a surface of the component body 2, the coating film 3 includes at least a surface layer 3b present on the surface side of the coating film 3 and an inner layer 3a present on an inner side relative to the surface layer; and the softening point of a surface layer glass constituent included in the surface layer 3b is higher than that of an inner layer glass constituent included in the inner layer 3a. The surface layer 3b may contain a crystalline material having a melting point higher than the softening point of the inner layer glass constituent.
摘要翻译：要解决的问题：提供一种具有形成的涂膜的电子部件，同时有效地防止涂膜的碎裂和膜厚变化以及异物与涂膜等的粘合。解决方案：在包括组分体2和形成在构件体2的表面上的涂膜3，涂膜3至少包括存在于涂膜3的表面侧的表面层3b和存在于涂层膜3的内层3a上的内层3a 相对于表层; 并且表面层3b中包括的表面层玻璃成分的软化点高于包含在内层3a中的内层玻璃成分的软化点。表面层3b可以含有熔点高于内层玻璃成分的软化点的结晶材料。

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