专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006080099A Bonding method and bonding device 审中-公开
标题翻译：接合方法和接合装置
公开(公告)号：JP2006080099A
公开(公告)日：2006-03-23
申请号：JP2002280607
申请日：2002-09-26
申请人： Tadatomo Suga , Toray Eng Co Ltd , 東レエンジニアリング株式会社 , 唯知須賀
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/16 , H01L2224/75 , H01L2224/7501 , H01L2224/751 , H01L2224/75252 , H01L2224/75702 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/14 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide bonding method/device with which adhesion of a foreign material layer to a cleaned bonding face is properly prevented until bonding after bonded objects whose bonding faces are cleaned by an energy wave are taken out into the atmosphere and bonding in the atmosphere is securely and easily performed.
SOLUTION: In bonding the bonded objects having metallic bonding parts on a surface of a substrate, the bonding faces of the metallic bonding parts are cleaned by the energy wave. The atmosphere of the cleaned bonding face is substituted for special gas and a special film derived from special gas is formed on the bonding face. The metallic bonding parts are bonded while the special film is removed or destroyed in the atmosphere.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够适当地防止异物层与清洁的接合面的粘合的接合方法/装置，直到在通过能量波清洁接合面的接合物体被取出到大气中之后的接合之前并且可靠且容易地进行大气中的接合。解决方案：在基板表面上粘结具有金属粘结部分的粘结物体时，通过能量波清洁金属粘合部分的粘合面。清洁的粘合面的气氛代替特殊气体，在接合面上形成由特殊气体衍生的特殊膜。在大气中去除或破坏特殊薄膜的同时粘结金属粘合部分。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2014220415A 基板表面処理方法及び装置有权
标题翻译：基板表面处理方法和装置
公开(公告)号：JP2014220415A
公开(公告)日：2014-11-20
申请号：JP2013099380
申请日：2013-05-09
申请人：須賀唯知 , Tadatomo Suga , 唯知須賀 , ボンドテック株式会社 , Bondtech Inc
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24 , C23C14/46 , H01L21/304
CPC分类号： B23K20/00 , B23K20/24 , C23C14/46 , H01L21/02 , H01L21/30
摘要：【課題】一方の基板に対する表面処理により飛散するスパッタ粒子が他方の基板に影響をあたえずに、ライン式粒子ビーム源を用いた基板表面の処理方法及び処理装置を提供することを目的とする。【解決手段】2つの対向する基板の間に配置されたライン式粒子ビーム源を用いて、一方の基板の表面に対してビーム照射を行うことと、ビーム照射の際に、2つの基板の間に配置された遮蔽部材を用いて、一方の基板から放出される物質が他方の基板に付着することを防ぐことと、を備える基板表面処理方法。【選択図】図1
摘要翻译：要解决的问题：提供一种使用线型粒子束源的基板表面的处理方法和处理装置，其中通过一个基板的表面处理散射的溅射颗粒不影响另一个基板。解决方案：基板表面处理方法包括通过使用布置在彼此面对的两个基板之间的线型粒子束源来对一个基板的表面进行光束照射，并且在光束照射期间通过使用屏蔽构件来防止从一个基板释放的物质与另一个基板的粘附布置在两个基板之间。

3. 发明专利

JP2011119717A Bonding system and bonding method 有权
标题翻译：粘接系统和粘接方法
公开(公告)号：JP2011119717A
公开(公告)日：2011-06-16
申请号：JP2010247508
申请日：2010-11-04
申请人： Bondtech Inc , Tadatomo Suga , ボンドテック株式会社 , 唯知須賀
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60
CPC分类号： H01L24/80 , H01L24/81 , H01L2224/13021 , H01L2224/16111 , H01L2224/80895 , H01L2224/80896 , H01L2224/81895 , H01L2224/81896
摘要： PROBLEM TO BE SOLVED: To provide a bonding technology capable of securing the favorable bonding strength of both objects to be bonded without forming a resin layer necessarily when both the objects to be bonded are connected electrically.
SOLUTION: In a bonding system, two objects 91 and 92 to be bonded each having a bonding part PT1 composed of one of Au(gold), Cu(copper) and Al(aluminum) and a bonding part PT2 composed of one of one of Si(silicon), SiO
2 (silicon dioxide) or glass on bonding surfaces thereof are bonded. In the bonding system, each bonding surface of two objects 91 and 92 to be bonded is subjected to hydrophilic treatment by an energy wave, and then the two objects 91 and 92 to be bonded are pressed and bonded in a state that the bonding parts PT1 of the two objects 91 and 92 to be bonded and the bonding parts PT2 of the two objects 91 and 92 to be bonded are brought into contact with each other.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种接合技术，其能够在要被接合的物体两端电连接的同时，在不形成树脂层的情况下确保两接合物的良好的接合强度。解决方案：在接合系统中，要结合的两个物体91和92具有由Au（金），Cu（铜）和Al（铝）之一组成的接合部分PT1和由一个的Si（硅），SiO 2 （二氧化硅）之一或其结合面上的玻璃。在接合系统中，要接合的两个物体91和92的每个接合表面通过能量波进行亲水处理，然后在待接合的两个物体91和92被压接和接合在接合部分PT1 要接合的两个物体91和92的两个物体91和92的接合部分PT2彼此接触。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2008093801A Sealing joint performance evaluation device, manufacturing method for sealing joint performance evaluation device, sealing joint performance evaluation method and sealing joint performance evaluation system 有权
标题翻译：密封性能评估装置，密封性能评估装置的制造方法，密封性能评估方法和密封性能评估系统
公开(公告)号：JP2008093801A
公开(公告)日：2008-04-24
申请号：JP2006280174
申请日：2006-10-13
申请人： Matsushita Electric Works Ltd , Tadatomo Suga , 松下電工株式会社 , 唯知須賀
发明人： BABA TORU , SUZUKI YUJI , SANAGAWA YOSHIHARU , SUGA TADATOMO , ITO HISAHIRO , OKADA HIRONAO
IPC分类号： B81B3/00 , B81C99/00 , H01L23/02
摘要： PROBLEM TO BE SOLVED: To easily evaluate sealing performance of sealing joint.
SOLUTION: The sealing joint performance evaluation device is provided with a frame part 4 having an opening 3; a plurality of vibration bodies 5a, 5b, 5c supported in the opening 3 of the frame part 4; a light-transmitting cap part 6 formed on an upper surface of the frame part 4; and a silicon substrate 7 joined to a lower surface of the frame part 4. The opening 3 is air-tightly sealed by the cap part 6 and the silicon substrate 7. Further, the vibration bodies 5a, 5b, 5c are vibrated, the vibration bodies 5a, 5b, 5c are irradiated with a light through the cap part 6, and the light reflected in the vibration bodies 5a, 5b, 5c is received. Resonance characteristic of the vibration bodies is measured from the received light, and a vacuum degree in the opening 3 is calculated from the measured resonance characteristic.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：容易评估密封接头的密封性能。解决方案：密封接头性能评估装置设置有具有开口3的框架部分4; 支撑在框架部分4的开口3中的多个振动体5a，5b，5c; 形成在框架部4的上表面上的透光帽部6; 以及与框架部4的下表面接合的硅基板7.开口部3由盖部6和硅基板7气密地密封。此外，振动体5a，5b，5c振动，振动主体5a，5b，5c通过盖部6照射光，并且接收在振动体5a，5b，5c中反射的光。从接收的光测量振动体的共振特性，并根据测量的谐振特性计算开口3中的真空度。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007110050A Bump forming method 有权
标题翻译： BUMP形成方法
公开(公告)号：JP2007110050A
公开(公告)日：2007-04-26
申请号：JP2005302144
申请日：2005-10-17
申请人： Namics Corp , Tadatomo Suga , Katsuhide Tsukamoto , ナミックス株式会社 , 勝秀塚本 , 唯知須賀
发明人： SUGA TADATOMO , TSUKAMOTO KATSUHIDE , YOSHII AKITO , KITAMURA MASAHIRO , YAMAGUCHI HIROSHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11 , H01L2924/01322 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a fine bump forming method indispensable to high density packaging, especially a bump forming method which is cheap as compared with cases based on a photolithographic technique and a plating technique, and is less subject to an environmental side since many chemicals and water are not used.
SOLUTION: The bump forming method comprises the steps of forming conductive resin layers covering a substrate and an electrode front surface on the substrate; removing the conductive resin layer on the substrate by a laser, while leaving the conductive resin layer on the electrode front surface on the substrate; and forming a bump consisting of conductive resin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供与高密度封装不可缺少的微小凸起形成方法，特别是与基于光刻技术和电镀技术的情况相比便宜的凸块形成方法，并且较少受环境影响因为许多化学品和水不被使用。解决方案：凸块形成方法包括以下步骤：在基板上形成覆盖基板的导电树脂层和电极前表面; 通过激光去除基板上的导电树脂层，同时将导电树脂层留在基板上的电极前表面上; 并形成由导电树脂组成的凸块。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2004327718A Method of mounting electronic component 有权
标题翻译：安装电子元件的方法
公开(公告)号：JP2004327718A
公开(公告)日：2004-11-18
申请号：JP2003120408
申请日：2003-04-24
申请人： Fujitsu Ltd , Hitachi Ltd , Matsushita Electric Ind Co Ltd , Mitsubishi Electric Corp , Nec Corp , Oki Electric Ind Co Ltd , Rohm Co Ltd , Sanyo Electric Co Ltd , Sharp Corp , Shinko Electric Ind Co Ltd , Sony Corp , Tadatomo Suga , Toshiba Corp , シャープ株式会社 , ソニー株式会社 , ローム株式会社 , 三洋電機株式会社 , 三菱電機株式会社 , 富士通株式会社 , 新光電気工業株式会社 , 日本電気株式会社 , 松下電器産業株式会社 , 株式会社日立製作所 , 株式会社東芝 , 沖電気工業株式会社 , 唯知須賀
发明人： SUGA TADATOMO , ITO HISAHIRO , NAKAZAWA HIDETO , AKAGAWA MASATOSHI
IPC分类号： H05K1/18 , H01L21/52 , H01L21/60 , H01L23/498 , H05K3/34
CPC分类号： H01L24/81 , H01L23/49816 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/81054 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/81894 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H05K3/3436 , H05K2203/085 , H05K2203/086 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49197 , H01L2224/05624 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a mounting method for connecting electronic components to a board through normal temperature jointing, without applying severe pretreatment for a connection surface due to CMP (chemical mechanical polish) or electrolytic polishing, in order to suppress dispersions in roughness or the height of connection surfaces of the electronic components, such as semiconductor chips, semiconductor packages or the like or bumps on the mounting board. SOLUTION: A connection member of at least one of the electronic component and the substrate is formed of a solder material, and the electronic component is contacted with the connecting member of the substrate at a normal temperature. As the solder material, a material, in which a load upon showing the changing amount of 8μm in the direction of the height of a spherical bump, having a diameter of 130μm in a direction parallel to an electronic component body is not larger than 100g, when a vertical load is applied, is employed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供通过常温接合将电子部件连接到电路板的安装方法，而不对CMP（化学机械抛光）或电解抛光对连接表面进行严格的预处理，以便抑制分散体粗糙度或电子部件的连接表面的高度，例如半导体芯片，半导体封装等或安装板上的凸块。解决方案：电子部件和基板中的至少一个的连接部件由焊料材料形成，并且电子部件在常温下与基板的连接部件接触。作为焊料材料，在与电子部件主体平行的方向上具有直径为130μm的球状凸块的高度方向上显示8μm的变化量的负载的材料不大于100g，当施加垂直载荷时。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2014179422A Component pressurizing device, and heating system using component pressurizing device 有权
标题翻译：组件加压装置和使用组件加压装置的加热系统
公开(公告)号：JP2014179422A
公开(公告)日：2014-09-25
申请号：JP2013051682
申请日：2013-03-14
申请人： Alpha- Design Kk , アルファーデザイン株式会社 , Tadatomo Suga , 唯知須賀 , Masataka Mizukoshi , 正孝水越
发明人： SHIRATORI TOSHIYUKI , KAWASAKI KYO , SUGA TADATOMO , MIZUKOSHI MASATAKA
IPC分类号： H01L21/603 , H01L21/60
CPC分类号： H05K13/0478 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/95 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32145 , H01L2224/32225 , H01L2224/75272 , H01L2224/75301 , H01L2224/7598 , H01L2224/83193 , H01L2224/83203 , H01L2224/8383 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/14 , H05K3/32 , H05K13/046 , H05K2203/0278 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To miniaturize a device and improve productivity of the device while securing a highly close contact state of an electrode terminal of an electronic component and an electrode of a substrate.SOLUTION: The component pressurizing device comprises: a base case 2 that has a first base 3 and a second base 4 that can be coupled with and separated from each other, and in which an arrangement space 7 for arranging a substrate 51 and plural electronic components 52 with different height inside while the first base is coupled with the second base is formed; oil 17 sealed in the arrangement space; an oil sealing material 14 deformed according to pressure of the oil; and an oil hydraulic pressure change part 9 for changing the pressure of the oil. When the substrate and the plural electronic components are arranged in the arrangement space while each electrode terminal 52a is aligned with and located on each electrode 51a, the pressure of the oil is changed by the oil hydraulic pressure change part and the plural electronic components are pressurized by the oil sealing material, so that each electrode terminal is pressed to each electrode.
摘要翻译：要解决的问题：在确保电子部件的电极端子和基板的电极的非常接近的接触状态的同时确保器件的小型化并提高器件的生产率。解决方案：部件加压装置包括：基部壳体2，具有能够彼此耦合并分离的第一基座3和第二基座4，并且其中布置空间7用于布置衬底51和具有不同高度的多个电子部件52，同时第一基座与第一基座形成第二基地; 油17密封在布置空间中; 根据油的压力而变形的油封材料14; 以及用于改变油压的油压变化部9。当基板和多个电子部件布置在布置空间中，而每个电极端子52a与每个电极51a对准并且位于每个电极51a上时，油的压力由油压变化部分改变，并且多个电子部件被加压通过油封材料，使得每个电极端子被压到每个电极。

8. 发明专利

JP2013251404A Surface treatment method of chip, bonding method, and surface treatment device 有权
标题翻译：切片，接合方法和表面处理装置的表面处理方法
公开(公告)号：JP2013251404A
公开(公告)日：2013-12-12
申请号：JP2012125236
申请日：2012-05-31
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60 , B23K20/00 , B23K20/24 , C23C8/16 , C23G5/00
CPC分类号： H01L24/81
摘要： PROBLEM TO BE SOLVED: To provide a technique for bonding a plurality of chips to a substrate, such as a wafer, efficiently and stably by leaving no undesirable residue, such as an oxide, on a junction interface, thereby processing the chips in an oxidative atmosphere, such as the atmosphere, before and after surface treatment.SOLUTION: The surface treatment method of a metal region for bonding a chip having a chip side junction interface having one or a plurality of metal regions to a substrate includes a step S1 for preparing a chip where the surface of a metal region is coated with a volatile material, a step S2 for evaporating the volatile material and exposing the surface of the metal region, and a step S3 for performing surface activation by colliding particles having predetermined kinetic energy against the surface of the metal region in a non-oxidative atmosphere, following to the step for exposing the surface of the metal region, and further performing hydrophilic treatment by depositing the water.
摘要翻译：要解决的问题：提供一种通过在接合界面上不留下不需要的残留物（例如氧化物）将多个芯片与晶片等基板（例如晶片）结合而成的技术，从而将芯片加工成氧化气氛，如大气，表面处理前后的处理。解决方案：将具有一个或多个金属区域的具有芯片侧接合界面的芯片接合到基板的金属区域的表面处理方法包括：步骤S1，用于制备金属区域的表面涂覆有挥发性材料的芯片，用于蒸发挥发性材料并暴露金属区域的表面的步骤S2，以及通过使具有预定动能的颗粒碰撞而进行表面活化的步骤S3 在非氧化性气氛中的金属区域的表面，接着暴露金属区域的表面的步骤，并进一步进行亲水处理放水。

9. 发明专利

JP2009111399A Reflow soldering method 审中-公开
标题翻译：反射焊接方法
公开(公告)号：JP2009111399A
公开(公告)日：2009-05-21
申请号：JP2008290965
申请日：2008-11-13
申请人： Senju Metal Ind Co Ltd , Shinko Seiki Co Ltd , Tadatomo Suga , 千住金属工業株式会社 , 神港精機株式会社 , 唯知須賀
发明人： SUGA TADATOMO , SAITO KEISUKE , MATSUURA YOSHIKAZU , TAKEUCHI TATSUYA , KAGAMI JOJI , KATO RIKIYA , YAMAGATA SAKIE
IPC分类号： H05K3/34 , B23K1/00 , B23K1/008 , B23K1/20 , B23K31/02 , B23K35/22 , B23K35/26 , B23K35/363 , B23K101/42 , C22C13/00
CPC分类号： H05K3/3489 , B23K1/008 , B23K1/206 , H05K2203/043 , H05K2203/087
摘要： PROBLEM TO BE SOLVED: To provide a method for soldering, for example method for forming a solder bump, or implementation by soldering, to achieve solder bonding without residue using lead-free soldering by a solder paste printing method.
SOLUTION: The method is provided for performing solder paste reflow by supplying free radical gas. After applying the solder paste by a printing method, when performing reflow by supplying hydrogen radical obtained from hydrogen plasma, a flux component of the solder paste is evaporated at a reflow temperature.
COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2007317897A Multilayer printed circuit board and manufacturing method thereof 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：JP2007317897A
公开(公告)日：2007-12-06
申请号：JP2006146174
申请日：2006-05-26
申请人： Namics Corp , Tadatomo Suga , Katsuhide Tsukamoto , ナミックス株式会社 , 勝秀塚本 , 唯知須賀
发明人： SUGA TADATOMO , TSUKAMOTO KATSUHIDE , YOSHII AKITO , KITAMURA MASAHIRO , YAMAGUCHI HIROSHI
IPC分类号： H05K3/46 , B23K26/00 , B23K26/38 , B23K101/42 , H05K1/09 , H05K3/08
摘要： PROBLEM TO BE SOLVED: To provide a reliable multilayer printed circuit board and its manufacturing method, in which fine wiring can be formed with the low resistance of the wiring. SOLUTION: In the multilayer printed circuit board, an insulating layer 101 and a patterned conductive layer 104 are stacked, and a conductive resin 103 filled in a via hole 102 formed at the insulating layer 101 establishes electrical connection between the conductive layers 104. The multilayer printed circuit board is a multiple conductive layer in which each of the patterned conductive layers 104 is composed of at least one layer of metal foil 106 and at least one layer of a conductive resin layer 105. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供可靠的多层印刷电路板及其制造方法，其中可以以低布线的电阻形成精细布线。解决方案：在多层印刷电路板中，堆叠绝缘层101和图案化导电层104，填充在形成于绝缘层101的通孔102中的导电树脂103建立导电层104之间的电连接多层印刷电路板是多导电层，其中每个图案化导电层104由至少一层金属箔106和至少一层导电树脂层105组成。版权所有（C））2008，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式