会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明专利
    • MANUFACTURE OF RESONATOR AND FILTER
    • JPH09148811A
    • 1997-06-06
    • JP33282295
    • 1995-11-27
    • TOKIN CORP
    • WATABE YOHEITAKEDA TSUGIOIWATA SHINICHIYOSHIDA EIKICHI
    • C25D5/12H01P11/00
    • PROBLEM TO BE SOLVED: To obtain high reliability and high productivity without any deterioration in transmission characteristic by plating a conductive film with Ni and further plating the nickel film with solder, and then forming an input/output electrode. SOLUTION: The conductive film covering the outside surface of a dielectric block and a through hole wall is formed by applying, for example, Ag paste by dipping, dried for 10 minutes at a temperature of 120 deg.C, and baked by being placed in an atmosphere and in a reductive atmosphere. The conductive film is >=10μm thick. Then a barrel is used to plate the conductive film Ni by electrolytic plating to 0.2-1.0μm and further the Ni-plated film is plated with solder to 1-3μm. In this case, the Ni-plated film is a protective film which prevents Sn in the solder coating component from being diffused to the conductive film. Consequently, cracking and electrode peeling due to the stress of the plated film of the input/output electrode and the corrosion of ceramic due to plating liquid can be prevented.
    • 6. 发明专利
    • DIELECTRIC FILTER
    • JPH0955603A
    • 1997-02-25
    • JP20804295
    • 1995-08-15
    • TOKIN CORP
    • TAKEDA TSUGIOWATABE YOHEIIWATA SHINICHIYOSHIDA EIKICHI
    • H01P1/205
    • PROBLEM TO BE SOLVED: To configure a filter circuit with a high degree of design freedom, and having provision for various characteristic requirements and to obtain a small sized dielectric filter configured at a low cost. SOLUTION: The dielectric filter is made up of a dielectric block IC having two non-throughholes 2 extended in parallel and whose entire surface is covered with a conductive film 5. Two input output electrodes 6 opposite to each other formed to the conductive film 5 with electric insulation in the vicinity of the two non-throughholes 2 are provided over two adjacent sides at the outer face of the block IC. A slit 3 with a size to block the two non-throughholes 2 is formed from an exposed face on which the two non-throughholes 2 are exposed toward an opposed face opposite to the exposed face between the two non- throughholes 2, and a circuit configuration section 4 is provided to a part between the opposite face and each end bottom face of the two non-throughholes 2. The surface of the slit 3 is covered with a conductive film 5 being a coupling interrupt part with a size to block the two non-throughholes 2.