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1. 发明专利

JP2012164454A Conductive particle and anisotropic conductive material using the same 审中-公开
标题翻译：导电颗粒和使用相同的异相导电材料
公开(公告)号：JP2012164454A
公开(公告)日：2012-08-30
申请号：JP2011022451
申请日：2011-02-04
申请人： Sony Chemical & Information Device Corp , Sony Corp , ソニーケミカル&インフォメーションデバイス株式会社 , ソニー株式会社
发明人： FUKAYA TATSURO , YAMAMOTO JUN , KONISHI MISAO , SHIMADA RYU , MOTOMURA ISATO , KATORI KENJI , SUDO HAJIME
IPC分类号： H01B5/00 , H01B1/20 , H01L21/60 , H01R11/01
CPC分类号： H01B1/02 , H01L24/29 , H01L2224/2939 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/32225 , H01L2924/15788 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide conductive particles which improve connection reliability in a fine circuit, and to provide an anisotropic conductive material using the same.SOLUTION: The conductive particles are used, each of which comprises: a resin particle 11; an electroless metal plating layer 12 covering a surface of the resin particle; and a sputtered non-Au metal layer 13 forming the outermost layer. Since the hard sputtered metal layer 13 is formed as the outermost layer, the conductive particles can be made to bite into wiring, thereby allowing high connection reliability to be obtained.
摘要翻译：要解决的问题：提供提高精细电路中的连接可靠性的导电颗粒，并提供使用其的各向异性导电材料。解决方案：使用导电颗粒，每个导电颗粒包括：树脂颗粒11; 覆盖树脂颗粒表面的无电镀金属层12; 以及形成最外层的溅射非金属金属层13。由于硬质溅射金属层13形成为最外层，所以可以使导电粒子咬入布线，从而可以获得高连接可靠性。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011076808A Anisotropic conducting film and method for manufacturing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：JP2011076808A
公开(公告)日：2011-04-14
申请号：JP2009225771
申请日：2009-09-30
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： FUKAYA TATSURO , MATSUSHIMA TAKAYUKI , YAMAMOTO JUN , AIZAKI RYOTA , KUDO KATSUYA , FURUTA KAZUTAKA
IPC分类号： H01R11/01 , H01B5/16 , H01B13/00 , H01L21/60 , H01R43/00
CPC分类号： C09J9/02 , C08K9/02 , C09J7/10 , C09J2201/36 , C09J2203/326 , C09J2205/102 , H01L24/29 , H01L24/83 , H01L2224/29082 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01R4/04 , H01R12/62 , H01R12/7076 , H05K3/323 , H05K3/361 , H05K2203/1189 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： PROBLEM TO BE SOLVED: To simultaneously mount electronic components of differing sizes with high accuracy. SOLUTION: An anisotropic conductive film has a two-layer structure of a first resin layer 11, having a tacking force of 200 kPa or more and a second resin layer 12 containing conductive particles. By loading the electronic components on the first resin layer 11, sharing of IC, FPC and SMD becomes possible and simultaneous mounting becomes possible. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：同时以高精度同时安装不同尺寸的电子部件。解决方案：各向异性导电膜具有第一树脂层11的双层结构，其粘合力为200kPa以上，第二树脂层12含有导电性粒子。通过将电子部件装载在第一树脂层11上，可以实现IC，FPC，SMD的共用，能够同时进行安装。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2012015544A Method of manufacturing connecting structure, and connecting structure and connecting method 审中-公开
标题翻译：制造连接结构的方法，连接结构和连接方法
公开(公告)号：JP2012015544A
公开(公告)日：2012-01-19
申请号：JP2011200882
申请日：2011-09-14
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： HIRAYAMA KENICHI , FUKAYA TATSURO
IPC分类号： H01L21/60
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/07811 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a connecting method and a connecting structure suppressing the occurrence of short circuit, and achieving a good conduction state, and a method of manufacturing the connecting structure.SOLUTION: On a connection surface 11 of a glass substrate 1, a guide plate 13 equipped with guide surface portions 131 and 132 controlling a moving direction of conductive particles is formed. The guide plate 13 is raised on one side in an opposite area through an area between adjacent wiring electrodes 12. The guide surface portions 131 and 132 turn a side surface direction orthogonal to a rising direction of the guide plate 13 to the wiring electrodes 12. The glass substrate 1 and an IC chip are pressure-bonded and connected through an anisotropic conductive film by thermal pressurizing, and the wiring electrodes 12 and bumps are anisotropic-conductive connected.
摘要翻译：要解决的问题：提供一种抑制短路发生并实现良好导通状态的连接方法和连接结构，以及制造连接结构的方法。解决方案：在玻璃基板1的连接表面11上，形成一个导向板13，该引导板13配备有控制导电颗粒移动方向的引导表面部分131和132。引导板13通过相邻布线电极12之间的区域在相对的区域的一侧上升。引导表面部分131和132将与引导板13的上升方向垂直的侧面方向转动到布线电极12。玻璃基板1和IC芯片通过热压加压粘合并通过各向异性导电膜连接，并且布线电极12和凸块被各向异性导电连接。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011082582A Method of manufacturing connection structure, method of anisotropic conductive connection, and connection structure 有权
标题翻译：制造连接结构的方法，各向异性导电连接方法及连接结构
公开(公告)号：JP2011082582A
公开(公告)日：2011-04-21
申请号：JP2011012744
申请日：2011-01-25
申请人： Sony Chemical & Information Device Corp , ソニーケミカル&インフォメーションデバイス株式会社
发明人： YAMAMOTO JUN , FUKAYA TATSURO
IPC分类号： H01L21/60
CPC分类号： H01L2224/83101 , H01L2924/07811 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure capable of improving the connection reliability of a connected portion. SOLUTION: In an arrangement step, a translucent substrate 2 in which a plurality of first electrodes 1 are provided on the surface, a concave portion 6 is formed between the first electrodes 1, and a polymer 7 is arranged at the concave portion 6; and an electronic component 4, having second electrodes 3, are arranged so that the first electrodes 1 and the second electrodes 3 face via anisotropic conductive adhesive 5, containing epoxy resin and polymerization initiator. In a connection step, heating pressing is performed from the surface 4a side that does not come in contact with the anisotropic conductive adhesive 5 of the electronic component 4, a light is emitted from the surface 2a side that does not come into contact with the anisotropic conductive adhesive 5 of the translucent substrate 2 after the heating pressing is started; and after a lapse of a predetermined time period, and the emitted light is radiated to the polymer 7; and accordingly, a connection body in which the first electrode 1 and the second electrode 3 are electrically connected is obtained. Furthermore, the refractive index of the polymer 7 is set smaller than those of the anisotropic conductive adhesive 5 and the translucent substrate 2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造能够提高连接部分的连接可靠性的连接结构的方法。解决方案：在布置步骤中，在表面上设置有多个第一电极1的半透明基板2，在第一电极1之间形成凹部6，并且在凹部设置聚合物7 6; 并且具有第二电极3的电子部件4被配置成使得第一电极1和第二电极3通过含有环氧树脂和聚合引发剂的各向异性导电粘合剂5面对。在连接步骤中，从不与电子部件4的各向异性导电粘合剂5接触的表面4a侧进行加热加压，从不与各向异性接触的表面2a侧发射光加热按压后的透光性基板2的导电性粘合剂5开始; 并且经过预定时间段后，发射的光照射到聚合物7上; 从而获得其中第一电极1和第二电极3电连接的连接体。此外，聚合物7的折射率被设定为小于各向异性导电粘合剂5和透光性基板2的折射率。（C）2011，JPO＆INPIT

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