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    • 10. 发明专利
    • Cylindrical sputtering target and method for manufacturing the same
    • 圆柱喷溅目标及其制造方法
    • JP2012140658A
    • 2012-07-26
    • JP2010292584
    • 2010-12-28
    • Tosoh Corp東ソー株式会社
    • YATSUTSUHA TOSHISUKEONOMI KENJISATO MASARUSHIBUTAMI TETSUO
    • C23C14/34
    • PROBLEM TO BE SOLVED: To provide a cylindrical sputtering target in which a bonding surface of a cylindrical ceramics target material is subjected to electrolytic reduction to form a metal layer which is used as an underlayer, thereby a sufficient bonding rate and strength can be attained only by solidification through cooling without pressing the bonding part during bonding, and peeling off or cracking caused by the effects of heat during sputtering does not occur.SOLUTION: The cylindrical sputtering target is manufactured by electrolytically reducing an inner circumferential surface of a cylindrical ceramics target material 21 to form an underlayer 31 formed of a reduced metal of the target material, and then bonding the cylindrical ceramics target material to the outer circumferential surface of a cylindrical support base material 11.
    • 要解决的问题:为了提供一种圆柱形溅射靶,其中圆柱形陶瓷靶材的接合表面经受电解还原以形成用作底层的金属层,从而足够的结合速率和强度可以 只有通过冷却而凝固而不在接合期间按压接合部分,并且不会发生由溅射期间的热影响而产生的剥离或破裂。 解决方案:通过电解还原圆筒状陶瓷靶材21的内周面,形成由目标材料的还原金属形成的下层31,然后将圆筒状陶瓷靶材与 圆柱形支撑基材11的外圆周表面。(C)2012,JPO&INPIT