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    • 5. 发明专利
    • ELONGATE ELECTRONIC DEVICE
    • JPS63118272A
    • 1988-05-23
    • JP25772586
    • 1986-10-29
    • RICOH KK
    • SHINDO AKIHIROKOSAKA DAISUKEKAWAKAMI TOSHIOYOSHIMIZU TOSHIKAZU
    • B41J2/345B41J2/335H04N1/032H05K1/16
    • PURPOSE:To obtain a small device with high productivity and at a low manufacturing cost through a reduction in substrate size (width), by a construction wherein a part of a substrate to be provided with functional elements is raised relative to a part to be provided with a driving IC, to a height higher than the height of the driving IC being mounted, and the raised part is made to have a trapezoidal shape in cross section along the width direction of the substrate. CONSTITUTION:In a thermal head, for example, a part of an insulating substrate 14 to be provided with heat generating elements 4 is provided as a raised part 16 along the longitudinal direction of the substrate 14. The raised part 16 has a trapezoid shape in cross section along the width direction of the substrate. A vitreous glaze layer is foamed at least on the raised part 16 of the substrate 14, and the heat generating elements 4 are foamed in a row along the longitudinal direction on the glaze layer on the top surface of the raized part 16. The height DELTAy of the raised part 16 must be not less than the height of a driving IC 6 mounted on the substrate. Since it is necessary to provided electrodes, for connecting the elements 4 to the driving IC 6, on slant surfaces of the raised part 16, the angle theta of the slant surfaces is preferably set to be not more than 45 deg..
    • 6. 发明专利
    • ELECTRONIC DEVICE MOUNTED WITH INTEGRATED CIRCUIT DEVICE
    • JPS6329546A
    • 1988-02-08
    • JP17341886
    • 1986-07-22
    • RICOH KK
    • SHINDO AKIHIROMATSUMOTO SHOJI
    • G09F9/00H01L21/82
    • PURPOSE:To improve a manufacturing yield rate, by forming the functional parts of an electronic device and electronic circuits, which are more than the number required for driving or controlling said functional parts of the electronic device, on the same substrate or on the different substrates, confirming the operations of said electronic circuits, and thereafter connecting the selected normal electronic circuits and said functional parts of the electronic device. CONSTITUTION:On a substrate 2, a cell 4, integrated circuits 6, 6a, 8 and 8a and an input/output terminal 10 are formed. Before the final wiring process, the integrated circuits 6, 6a, 8 and 8a are tested. The normally operating integrated circuits are selected, and wirings 12 are provided. When the integrated circuit 6 is defective but the same integrated circuit 6a is normal, the wiring can be applied to the integrated circuit 6a. This is the same to the integrated circuit 8. When the integrated circuit 8a is defective, the wiring can be applied to the other same integrated circuit 8a. Thus, the manufacturing yield rate can be improved.