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1. 发明专利

JPH09329646A TEST DEVICE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09329646A
公开(公告)日：1997-12-22
申请号：JP14351096
申请日：1996-05-14
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO , AGARI HIRONOBU
IPC分类号： G01R31/26 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide a test device for semiconductor device capable of performing test, by using a kind of a test board for semiconductor devices different in size and the number of lead pins. SOLUTION: The wiring pattern 11 of a test board 2 has wiring pattern groups 11a-11d respectively extending in mutually orthogonal four directions at regular intervals equal to the intervals (p) of the lead pins of a device to be measured, and the center part of each wiring pattern group 11a-11d is formed in the form of a sharp wedge. The center part of a positioning jig is fixed to be matched to a center part 12 of the wiring pattern 11 on the patterns 11a-11d, and the center part of a device to be measured is positioned so as to be matched to the center part 12 of the pattern 11 by a positioning jig. Thus, the lead pins of the device to be measured is brought into contact with each wiring of each pattern group 11a-11d of the wiring pattern 11.

2. 发明专利

JPS63118272A ELONGATE ELECTRONIC DEVICE 失效
公开(公告)号：JPS63118272A
公开(公告)日：1988-05-23
申请号：JP25772586
申请日：1986-10-29
申请人： RICOH KK
发明人： SHINDO AKIHIRO , KOSAKA DAISUKE , KAWAKAMI TOSHIO , YOSHIMIZU TOSHIKAZU
IPC分类号： B41J2/345 , B41J2/335 , H04N1/032 , H05K1/16
摘要： PURPOSE:To obtain a small device with high productivity and at a low manufacturing cost through a reduction in substrate size (width), by a construction wherein a part of a substrate to be provided with functional elements is raised relative to a part to be provided with a driving IC, to a height higher than the height of the driving IC being mounted, and the raised part is made to have a trapezoidal shape in cross section along the width direction of the substrate. CONSTITUTION:In a thermal head, for example, a part of an insulating substrate 14 to be provided with heat generating elements 4 is provided as a raised part 16 along the longitudinal direction of the substrate 14. The raised part 16 has a trapezoid shape in cross section along the width direction of the substrate. A vitreous glaze layer is foamed at least on the raised part 16 of the substrate 14, and the heat generating elements 4 are foamed in a row along the longitudinal direction on the glaze layer on the top surface of the raized part 16. The height DELTAy of the raised part 16 must be not less than the height of a driving IC 6 mounted on the substrate. Since it is necessary to provided electrodes, for connecting the elements 4 to the driving IC 6, on slant surfaces of the raised part 16, the angle theta of the slant surfaces is preferably set to be not more than 45 deg..

3. 发明专利

JPS62276843A SEMICONDUCTOE INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPS62276843A
公开(公告)日：1987-12-01
申请号：JP11994386
申请日：1986-05-23
申请人： RICOH KK
发明人： SHINDO AKIHIRO , YOSHIMIZU TOSHIKAZU , KURIHARA KENICHI , TAMAOKI SHUNPEI , KAWAKAMI TOSHIO
IPC分类号： H01L21/60
摘要： PURPOSE: To reduce the lengths of wirings connecting pads to functional parts and increase a processing speed and reduce the size of an IC chip by forming the pads over the whole surface of the IC chip. CONSTITUTION:Pads 10 are formed not only on the circumferential part of the surface of an IC chip 8 but also on the central part of the surface. Wirings are provided between the pads 10 and functional parts in the IC chip 8. The wirings are so formed as to connect the functional parts to the pads 10 close to them. With this constitution, the lengths of the wirings between the functional parts in the IC chip and the pads 10 can be reduced so that the processing speed can be increased and, as the wiring regions can be narrowed, the size of the IC chip can be reduced.

4. 发明专利

JPS6044371A DRIVING METHOD FOR THERMAL HEAD 失效
公开(公告)号：JPS6044371A
公开(公告)日：1985-03-09
申请号：JP15206983
申请日：1983-08-20
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO , MORI MASAAKI , OKADA CHIHARU
IPC分类号： B41J2/36
摘要： PURPOSE:To enable to record images with a constant density, by changing the combination of blocks in accordance with the contents of recording data so that the number of heating resistors in the blocks simultaneously supplied with electric currents by a strobe signal is leveled off. CONSTITUTION:Thermal heads U1-Un (partly shown) are driven in a partitioned manner at 8 timings of strobe signals SB1-SB8, and the respective heating elements R1-R32 are supplied with electric currents corresponding to latched data on a time division basis. Where the total number of the blocks is 2 and two blocks are simultaneously driven, 2 blocks on the side on which the number of black dots is large and 2 blocks on the side on which said number is small are first driven simultaneously, then similar simultaneous driving is conducted for the remaining blocks, and the partition driving is repeated 2 times, thereby recording a one-line amount of data. Accordingly, the number of the heating elements in the blocks simultaneously supplied with electric currents is leveled off, and images are recorded with a constant density.

5. 发明专利

JPS6044369A DRIVING METHOD FOR THERMAL HEAD IN THERMAL RECORDER 失效
公开(公告)号：JPS6044369A
公开(公告)日：1985-03-09
申请号：JP15180883
申请日：1983-08-19
申请人： RICOH KK
发明人： ISHIWATARI TATSUMI , MORI MASAAKI , OKADA CHIHARU , KAWAKAMI TOSHIO
IPC分类号： B41J2/355 , B41J2/36
摘要： PURPOSE:To enable to drive a heating element at high speed without raising the peak temperature of the heating element, prolong the useful life of the heating element and enable to obtain a favorable developed color density even on a low- sensitive thermal recording paper, by impressing electric power in the form of a plurality of pulses on the heating element to print. CONSTITUTION:A trigger pulse T is delayed by delay circuits 10-12 and one- shot multivibrators 20-22, and is converted into pulses S0-S2 having a predetermined pulse width. The pulses 3 are passed through an OR gate 3, and an electric current is fed to a heating resistor R through a switching transistor 5 while synchronizing it with printing data D by an AND gate circuit 4, and this operation is repeated fro each printing cycle time. Accordingly, since a plurality of pulses, e.g., S0-S2, are used for driving the heating resistor R, the heating resistor R can be driven at high speed without raising the peak temperature of the heating resistor R. In addition, in the case of driving with the same impressed energy as that in a conventional method, no rise in the peak temperature ensures a prolonged useful life, and the amount of energy impressed can be increased, so that a favorable developed color density can be obtained even on a lower-sensitive thermal recording paper.

6. 发明专利

JPS6042073A DRIVING METHOD FOR THERMAL HEAD 失效
公开(公告)号：JPS6042073A
公开(公告)日：1985-03-06
申请号：JP14990983
申请日：1983-08-17
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO , MORI MASAAKI , OKADA CHIHARU , ISHIWATARI TATSUMI
IPC分类号： B41J2/36
摘要： PURPOSE:To prevent a heating element from being cooled before a predetermined density is reached and enhance recording speed, by setting the width of a pulse impressed first to be longer than that of the subsequent pulses. CONSTITUTION:Until a thermal recording paper starts forming a color or a predetermined density is reached, a pulse tau with a large width is impressed, and the number of the pulses with small width impressed thereafter is varied to control recorded density. Pulse numbers corresponding to gradation levels are written in a ROM10, signals (a) indicating the gradation levels are address-inputted, and pulse number signals (b) are outputted and are set on a counter 11. An oscillator 13 outputs a pulse (f) with a width tau, while an oscillator 12 outputs the subsequent pulses (d) with a width of smaller than tau. The counter 11 counts down the pulses (d), and when the counted value reaches 0, a resetting signal (c) is outputted by the counter 11 to reset the oscillator 12. An OR gate circuit 15 impresses current-passing pulses (g) on a thermal recording head.

7. 发明专利

JPS6024968A DRIVE CONTROL METHOD FOR THERMAL HEAD 失效
公开(公告)号：JPS6024968A
公开(公告)日：1985-02-07
申请号：JP13229283
申请日：1983-07-20
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO , MORI MASAAKI , OKADA CHIHARU
IPC分类号： B41J2/36
摘要： PURPOSE:To obtain a recording with uniform density regardless of an adjacent dot heating by a method wherein a shift register which acts to both directions is employed, while a recording data is shifted by one dot distance to right and left directions, and a preheated driving of a thermal head is performed by heating for each thermal element. CONSTITUTION:As a shift register SR' to store recording data DATA of one line, a form of register which acts to both directions and also EX.OR gate G1', G2'... are provided. A data is stored in a shift register SR' which is shifted leftward by one dot for a dot pattern to be recorded. A strobe signal SB2 is fed to EX.OR gates G1, G2... of L level, and a strobe signal SB of H level is fed to AND gates G1, G2..., thereby a heat generating element is driven corresponding to a blank data, thus the first step preheating is performed. Then, the second step preheating is successively performed in the same manner by a pattern shifted rightward by one dot for a pattern to be recorded.

8. 发明专利

JPS609281A DRIVING SYSTEM OF THERMAL HEAD 失效
公开(公告)号：JPS609281A
公开(公告)日：1985-01-18
申请号：JP11642983
申请日：1983-06-28
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO
IPC分类号： B41J2/36 , H04N1/40 , H04N1/407
摘要： PURPOSE:To raise continuously the temperature of a heating element, to reproduce faithfully the density of a prescribed half tone level, and to execute a recording of a high quality by conducting to heat selectively with a picture data a thermal head provided with plural heating elements. CONSTITUTION:An ROM1 storing the number of pulses responded to a tonal level is provided on a circuit for driving a thermal head 7 provided with plural heating elements. Also, analog picture information is converted to the digital data of a tonal level by an A/D converter 4, and stored by one line each in an RAM6. This RAM6 and the ROM1, etc. are controlled by a controller 3, and a serial input data DI and a load signal -LD are given to the thermal head 7. Also, the pulse of the ROM1 is counted by a counter 2, and a strobe signal -SB is outputted, and applied to a unit pulse generator 5 and the thermal head 7. A thermistor TH is heated by the pulse of the generator 5 with a start instruction, its temperature is raised continuously to reproduce the density of a half tone level faithfully.

9. 发明专利

JPS58153180A TESTER FOR THERMAL HEAD 失效
公开(公告)号：JPS58153180A
公开(公告)日：1983-09-12
申请号：JP3506382
申请日：1982-03-08
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO
IPC分类号： G01R31/00 , G01R31/28
摘要： PURPOSE:To enable the detection of defective elements with the processing of electrical signals by comparing a test signal of a signal generator with output signals of the defective elements connected to the output terminal of a thermal head. CONSTITUTION:An output of a signal generator 1 which supplies a test signal is inputted to an input terminal D1 of a thermal head 2 and a comparator 3 which compares to detect a strain of signals. A test signal inputted into an input terminal of the thermal head 2 is tansferred through IC chips as elements to be tsted of the thermal head 2 and outputted from output terminals D01, D02...D0n provided on each of the IC chips. An output terminal D0n selected among these output terminals is electrically connected to the comparator 3 with a conductor 4. The comparator 3 compares output signals of IC chips as elements to be tested with the test signal to detect data errors of the output signals. Thus, the processing of electrical signals enables the detection of defective elements.

10. 发明专利

JP2003218144A METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003218144A
公开(公告)日：2003-07-31
申请号：JP2002015339
申请日：2002-01-24
申请人： RICOH KK
发明人： KAWAKAMI TOSHIO
IPC分类号： H01L21/66 , H01L21/301 , H01L21/56 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To enable a semiconductor wafer to be reduced in warpage after a sealing resin layer is formed in a wafer-level package manufacturing method. SOLUTION: Bonding pads 3, a final insulating layer 5, a re-wiring layer 7, and metal posts 9 are formed on a silicon wafer 1 on which a plurality of semiconductor elements are formed (A), and then a sealing resin 11 is formed (B). The silicon wafer 1 is much warped due to the shrinkage of the sealing resin 11 after the sealing resin 11 is formed. The sealing resin is removed from regions where cutting lines at which the silicon wafer 1 is cut into semiconductor chips in an after process are located to form notches 11a in the sealing resin 11 (C). The notches 11a are provided in the sealing resin 11, so that stress imposed on the silicon wafer 1 due to the shrinkage of the sealing resin can be relaxed, and the silicon wafer 1 is less warped. COPYRIGHT: (C)2003,JPO

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