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1. 发明专利

JP2008214704A Amorphous metal or metal glass joined body 审中-公开
标题翻译：非晶金属或金属玻璃接合体
公开(公告)号：JP2008214704A
公开(公告)日：2008-09-18
申请号：JP2007055093
申请日：2007-03-06
申请人： Osaka Univ , Tohoku Univ , 国立大学法人大阪大学 , 国立大学法人東北大学
发明人： NOSHIRO KIYOSHI , NAKADA KAZUHIRO , KURODA TOSHIO , TAKEMOTO TADASHI , FUJII HIDETOSHI , ABE HIROYA , TSUMURA TAKUYA , MAEDA MASAKATSU , TERAJIMA TAKESHI , NISHIKAWA HIROSHI , INOUE AKIHISA , KIMURA HISAMICHI , CHO ISAMU , DMITRI LOUZGUINE , FUKUHARA MIKIO , WANG XINMIN , WADA TAKESHI , SHA KOKUKYO , SEKI ICHIRO
IPC分类号： C22C45/00 , B23K1/19 , B23K11/16 , B23K20/00 , B23K20/10 , B23K20/12 , B23K26/32 , B23K103/18
摘要： PROBLEM TO BE SOLVED: To provide a joined body which is small in ΔT(=Tx-Tg) (Tx: crystallization temperature, Tg: glass point) and in which a joined surface is not crystallized in an amorphous metal or metal glass. SOLUTION: There is provided the amorphous metal joined body obtained by joining the amorphous metal having an irregular crystal structure by a thermal method or a method using plastic deformation. Particularly, the joined body has a nanocrystal precipitated in a joint portion. Also, the metal glass having an extensive supercooling liquid region and a distinct glass transition point is joined by the thermal method or the method using the plastic deformation. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供ΔT（= Tx-Tg）（Tx：结晶温度，Tg：玻璃点）小的接合面在非晶金属或金属中未结晶的接合体玻璃。解决方案：提供通过热法或使用塑性变形的方法将具有不规则晶体结构的非晶态金属接合而获得的非晶金属接合体。特别是，接合体具有在接合部分析出的纳米晶体。另外，通过热法或使用塑性变形的方法将具有广泛的过冷液体区域和不同的玻璃化转变点的金属玻璃接合。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2010199387A Method of bonding conductor wire to metal glass layer 有权
标题翻译：将导线连接到金属玻璃层的方法
公开(公告)号：JP2010199387A
公开(公告)日：2010-09-09
申请号：JP2009044049
申请日：2009-02-26
申请人： Hiroshi Nishikawa , Panasonic Electric Works Co Ltd , Tadashi Takemoto , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 正竹本 , 宏西川
发明人： SANAGAWA YOSHIHARU , KUBO MASAO , SAKAI TAKAMASA , TAKEMOTO TADASHI , NISHIKAWA HIROSHI , FUKUHARA MIKIO , INOUE AKIHISA
IPC分类号： H01L21/607 , H04R19/00
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2224/78301 , H01L2224/85186 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of bonding a conductor wire to metal glass which can stably bond a conductor wire to a metal glass layer. SOLUTION: In bonding a conductor wire 2 to a metal glass substrate 1 that is a metal glass layer, the conductor wire 2 is pressed against a bonding surface 1a of the metal glass substrate 1 and then ultrasonic energy is given to the conductor wire 2 from an ultrasonic tool 3 to bond the conductor wire 2 to the metal glass substrate 1. When an Al-based bonding wire is used as the conductor wire 2, a wedge tool is used as the ultrasonic tool 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种将导线连接到金属玻璃上的方法，金属玻璃可以将导线稳定地结合到金属玻璃层。解决方案：在将导体线2与作为金属玻璃层的金属玻璃基板1接合时，将导体线2压在金属玻璃基板1的接合面1a上，然后向导体施加超声波能量电线2从超声波工具3将导线2接合到金属玻璃基板1上。当使用Al基接合线作为导体线2时，使用楔形工具作为超声波工具3。（C）2010，JPO＆INPIT

3. 发明专利

JP2010202907A Method for manufacturing crystal metal-alloy product using metallic glass or metallic amorphous, and crystal metal-alloy product 审中-公开
标题翻译：使用金属玻璃或金属非晶体制造晶体金属合金产品的方法和晶体金属合金产品
公开(公告)号：JP2010202907A
公开(公告)日：2010-09-16
申请号：JP2009047815
申请日：2009-03-02
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： FUKUHARA MIKIO , SHA KOKUKYO , INOUE AKIHISA , ABE HIROYA , NISHIKAWA HIROSHI , TAKEMOTO TADASHI
IPC分类号： C22C1/00 , C23F1/00
摘要： PROBLEM TO BE SOLVED: To solve such problem as that since a meso-scopic metallic cluster is different in catalyst, electron, photo-electron, magnetic characteristic, with a bulky metal, caused by the effect of comparative large surface area and few atomic number, this meso-scopic metal cluster is expected to the future development, but this scale is accumulated by making small into nano-meter size and further, is necessary to operate in the room temperature, and thus, crystal metal or alloy manufacturing method with the conventional mechanical or thermal cutting method, chemical-physical vapor-deposition coating method or corrosion method, can be not used. SOLUTION: An integrated fine structure (cell) which performs supper-fine patterning or quantum dot-tunneling, is manufactured with a manufacturing method for the metal or the alloy having nano-crystal by utilizing amorphous/crystal transition in the room temperature and by selectively melting the compositional elements in a metallic glass or metallic amorphous in the acidic solution without adding the outer energy, such as heat, light, electric charge. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：为了解决由于比较大的表面积和效果而引起的催化剂，电子，光电子，磁特性与庞大的金属不同的中观观察金属簇的问题原子序数很少，这种中观的金属簇有望在未来发展，但是这种尺度是通过将其纳入纳米尺寸而进一步累积的，这是在室温下运行所必需的，因此，晶体金属或合金制造方法采用常规的机械或热切割方法，化学物理气相沉积涂覆法或腐蚀方法，不得使用。解决方案：通过在室温下利用非晶/晶体转变的金属或具有纳米晶体的合金的制造方法制造执行超精细图案化或量子点隧穿的集成精细结构（单元）并且通过选择性地熔化金属玻璃中的组成元素或在酸性溶液中金属无定形的溶液中，而不增加诸如热，光，电荷的外部能量。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2008207241A Method for soldering metal or alloy 审中-公开
标题翻译：焊接金属或合金的方法
公开(公告)号：JP2008207241A
公开(公告)日：2008-09-11
申请号：JP2007048943
申请日：2007-02-28
申请人： Osaka City , Osaka Univ , Urban Materials Co , 国立大学法人大阪大学 , 大阪市 , 株式会社アーバンマテリアルズ
发明人： OKANDA KAHEI , NAGAOKA TORU , FUKUZUMI MASAO , TAKEMOTO TADASHI
IPC分类号： B23K1/06 , B23K1/19 , B23K103/10
摘要： PROBLEM TO BE SOLVED: To provide a method for strongly soldering a metal or an alloy with a simple method even when an oxide film is formed on the metal or the alloy.
SOLUTION: A solder is interposed between joining faces of two base metals of the metal or the alloy. In this state, the assembly is heated to a temperature, which brings the solder to a solid-liquid two-phase state, and ultrasonic vibration is applied to at least one of the base metals to solder the two base metals.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在金属或合金上形成氧化膜，也提供一种用简单的方法强烈焊接金属或合金的方法。
解决方案：在金属或合金的两种贱金属的接合面之间插入焊料。在这种状态下，将组件加热到使焊料成为固液两相状态的温度，并且将超声波振动施加到至少一个基础金属上以焊接两个母材。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007308762A Low environmental load type metal recovery method using cyanogen formation and decomposition bacteria 审中-公开
标题翻译：使用氰化物形成和分解细菌的低环境负荷型金属回收方法
公开(公告)号：JP2007308762A
公开(公告)日：2007-11-29
申请号：JP2006139108
申请日：2006-05-18
申请人： Osaka Univ , 国立大学法人大阪大学
发明人： TAKEMOTO TADASHI , KITA YOSHITO , NISHIKAWA HIROSHI
IPC分类号： C22B3/18 , C12P9/00 , C22B7/00 , C22B11/00 , C22B13/00 , C22B15/00 , C22B19/30 , C22B21/00 , C22B23/00 , C22B25/06 , C22B30/00 , C22B34/32 , C22B61/00
CPC分类号： Y02P10/228 , Y02P10/232 , Y02P10/234 , Y02P10/238
摘要： PROBLEM TO BE SOLVED: To provide an improved low environmental load type metal recovery method which can highly efficiently perform repeated cyanogen formation and decomposition by carrying out a time-consuming cyanogen decomposition/detoxification process in a shorter period of time. SOLUTION: The method for recovering a metal from a metal-containing material using cyanogen formation decomposition bacteria comprises the steps of: (1) culturing the cyanogen formation decomposition bacteria in an eutrophic culture medium to form cyanogen; (2) dissolving the metal from the metal-containing material using the cyanogen formed in the step (1); (3) adding a glutamic acid derivative and/or serine derivative and glucose to the culture medium to change it into a nutrient deprived culture medium and culturing the cyanogen formation decomposition bacteria to decompose the cyanogen remaining in the step (2); and (4) recovering the metal from a solution of the metal in the step (2) or step(3). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种改进的低环境负荷型金属回收方法，其可以在更短的时间内进行耗时的氰分解/解毒过程，从而高效地进行重复的氰化物形成和分解。解决方案：使用氰化物形成分解细菌从含金属材料中回收金属的方法包括以下步骤：（1）在富营养培养基中培养氰化物分解细菌以形成氰; （2）使用在步骤（1）中形成的氰原将金属从含金属材料中溶解; （3）向培养基中添加谷氨酸衍生物和/或丝氨酸衍生物和葡萄糖，将其变为营养缺失培养基，培养上述氰化物形成分解菌以分解步骤（2）中残留的氰原; 和（4）在步骤（2）或步骤（3）中从金属溶液中回收金属。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006181637A Flux, and soldering method using the same 审中-公开
标题翻译：焊剂和使用其的焊接方法
公开(公告)号：JP2006181637A
公开(公告)日：2006-07-13
申请号：JP2005071757
申请日：2005-03-14
申请人： Osaka Univ , Tamura Fa System Co Ltd , Tamura Kaken Co Ltd , Tamura Seisakusho Co Ltd , タムラ化研株式会社 , 国立大学法人大阪大学 , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： OKANO TERUO , IIJIMA MASAKI , YOSHIDA SHUNICHI , TAKAHASHI YOSHIYUKI , TAKEMOTO TADASHI , NISHIKAWA HIROSHI
IPC分类号： B23K35/363 , B23K1/08 , B23K35/26 , B23K101/42 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent erosion of a solder bath caused by lead-free solder.
SOLUTION: A flux F to be applied to a printed wiring board P before immersing it into melted solder contains an arsenic removing component. Therefore, when the flux has been applied to the printed wiring board P, the arsenic stuck to the printed wiring board P is changed to chromium arsenide, or the arsenic unchanged to the chromium arsenide and the arsenic stored in the molten solder after the flux F has entered the molten solder are changed to chromium arsenide. The chromium arsenide, of course, cannot produce the chromium arsenide by reacting on the stainless steel of the solder bath. In other words, because the arsenic has been substantially removed, the erosion of the solder bath can be prevented. Further, when the flux F is used, there is no need to modify the solder bath. Therefore, the flux F can be applied to existing solder baths.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：防止由无铅焊料引起的焊料槽的侵蚀。解决方案：在将其浸入熔化的焊料中之前施加到印刷线路板P的焊剂F含有除砷组分。因此，当将焊剂施加到印刷线路板P上时，在焊剂F之后，粘附到印刷线路板P上的砷变为砷化铬，或者砷变化为砷化铬和存储在熔融焊料中的砷已经进入熔融焊料变成了砷化铬。当然，砷化铬不能通过在不锈钢上焊接而产生砷化铬。换句话说，由于砷已被基本除去，所以可以防止焊料槽的腐蚀。此外，当使用焊剂F时，不需要改变焊料槽。因此，焊剂F可以应用于现有的焊料槽。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006181636A Tool for reducing erosion of solder bath, and soldering device having the same 有权
标题翻译：用于减少焊锡槽腐蚀的工具，以及具有其的焊接装置
公开(公告)号：JP2006181636A
公开(公告)日：2006-07-13
申请号：JP2005071756
申请日：2005-03-14
申请人： Osaka Univ , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 国立大学法人大阪大学 , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： OKANO TERUO , IIJIMA MASAKI , YOSHIDA SHUNICHI , TAKEMOTO TADASHI , NISHIKAWA HIROSHI
IPC分类号： B23K3/06 , B23K1/08 , B23K3/08 , B23K35/26 , B23K101/42 , C22C13/00 , C22C38/00 , C22C38/18 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a tool for reducing the erosion of a solder bath caused by arsenic contained in lead-free solder. SOLUTION: The erosion reducing tool 12 for reducing the erosion of the solder bath 11 due to the arsenic contained in the solder is arranged in the bath of molten solder S. The erosion reducing tool is a plate having a chrome plated film 122 formed on the surface of iron 121. Because the chrome plated film 122 is made of pure chrome, the chrome plated film 122 can collect the arsenic more than the stainless steel of the solder bath 11 containing few chrome. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种减少由无铅焊料中所含砷引起的焊料槽侵蚀的工具。解决方案：用于减少由焊料中含有的砷引起的焊料槽11的侵蚀的侵蚀减少工具12布置在熔融焊料S的槽中。侵蚀减少工具是具有镀铬膜122的板形成在铁121的表面上。由于镀铬膜122由纯铬制成，镀铬膜122可以比含有少量铬的焊料槽11的不锈钢更多地收集砷。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006260951A Conductive copper paste 审中-公开
标题翻译：导电铜浆
公开(公告)号：JP2006260951A
公开(公告)日：2006-09-28
申请号：JP2005077021
申请日：2005-03-17
申请人： Harima Chem Inc , Osaka Univ , ハリマ化成株式会社 , 国立大学法人大阪大学
发明人： TAKEMOTO TADASHI , NISHIKAWA HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H01B1/22 , H01B1/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive copper paste capable of, as a main part of a conductive filler, manufacturing a conductive adhesive layer showing excellent conductivity by using copper particles, with the formed conductive adhesive layer capable of keeping excellent conductivity for a long period.
SOLUTION: Low melting-point alloy particles are used as well by less amount than copper particles. A thermo-curable phenol resin of a binder resin is added with flux agent, a trace amount of flux activity suppressing agent, and chelating agent. A conductive copper paste is thus configured. So, before curing of the binder resin, a low melting-point alloy having a low melting-point dissolves, to fill the gap among copper particles, forming metal bonding. Then, when the temperature rises for thermo-curing of resin, the flux activity suppressing agent reacts with the flux active component to lose activity of the flux, providing a conductive copper paste for manufacturing a conductive adhesive layer excellent in conductivity and anti-oxidation characteristics.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种导电铜浆，其能够作为导电填料的主要部分，通过使用铜颗粒制造显示出优异的导电性的导电粘合剂层，所形成的导电粘合剂层能够保持优异的导电性很长一段时间。
解决方案：低熔点合金颗粒的使用量也少于铜颗粒。加入粘合剂树脂的热固性酚醛树脂，添加助熔剂，微量助焊剂活性抑制剂和螯合剂。因此构成导电铜浆。因此，在粘合剂树脂固化之前，具有低熔点的低熔点合金溶解，以填充铜颗粒之间的间隙，形成金属粘合。然后，当树脂的热固化温度升高时，助焊剂活性抑制剂与助焊剂活性成分反应，失去助焊剂的活性，提供导电性铜膏，用于制造导电性和抗氧化特性优异的导电性粘合剂层。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2006159225A Method and apparatus for preventing erosion of solder bath 有权
标题翻译：防止焊膏腐蚀的方法和装置
公开(公告)号：JP2006159225A
公开(公告)日：2006-06-22
申请号：JP2004351932
申请日：2004-12-03
申请人： Osaka Univ , Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 国立大学法人大阪大学 , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： OKANO TERUO , IIJIMA MASAKI , YOSHIDA SHUNICHI , TAKEMOTO TADASHI , NISHIKAWA HIROSHI
IPC分类号： B23K3/06 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent erosion of a solder bath caused by lead-free solder.
SOLUTION: The erosion preventing apparatus 12 is for preventing a solder bath 11 from being eroded by arsenic contained in a molten solder S. The apparatus 12 is equipped with a pipe 122 which is installed in the molten solder S and formed with a blowing port 121 for blowing air A, and a pump 123 which sends the air A into the pipe 122. The air A is pushed into the pipe 122 by the pump 123 and released into the molten solder S from the blowing port 121, resulting in the formation of an arsenic oxide. Consequently, the arsenic is eliminated that reacts with stainless steel of the solder bath 11, thereby preventing the erosion of the solder bath 11. Since the erosion preventing apparatus 12 has only to be installed in the molten solder S, the apparatus is also applicable to an existing solder bath.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：防止由无铅焊料引起的焊料槽的侵蚀。防腐蚀装置12用于防止焊料槽11被包含在熔融焊料S中的砷侵蚀。装置12配备有管122，管122安装在熔融焊料S中并形成有用于吹送空气A的吹送口121和将空气A送入管122的泵123.空气A通过泵123被推入管122中，并从吹出口121释放到熔融焊料S中，导致形成一种氧化砷。因此，消除了与焊料槽11的不锈钢反应的砷，从而防止焊料槽11的腐蚀。由于防腐蚀装置12仅安装在熔融焊料S中，所以该装置也可应用于现有焊锡槽。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2014167145A Jointing material 有权
标题翻译：接合材料
公开(公告)号：JP2014167145A
公开(公告)日：2014-09-11
申请号：JP2013039151
申请日：2013-02-28
申请人： Osaka Univ , 国立大学法人大阪大学 , Fuji Electric Co Ltd , 富士電機株式会社 , Harima Chemicals Inc , ハリマ化成株式会社
发明人： YAMAKAWA TOMOHIRO , TAKEMOTO TADASHI , SHIMODA MASAYOSHI , SHIOKAWA KUNIO , MATSUBA YORISHIGE
IPC分类号： B22F1/00 , B22F1/02 , B22F9/00 , B82Y30/00 , B82Y40/00 , H01B1/00 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive jointing material which achieves sufficient joint strength without compression.SOLUTION: There is provided the jointing material comprising: a copper nanoparticle paste formed of a fluid dispersion formed by uniformly dispersing copper nanoparticles having a coating molecular layer on their surfaces into a dispersion solvent; and a copper micro particle or a copper sub-micro particle, or both of them. There are also provided a production method of electronic components using the same, and a joint method of metal members.
摘要翻译：要解决的问题：提供一种廉价的接头材料，其在没有压缩的情况下实现足够的接合强度。解决方案：提供接合材料，其包括：由具有涂层分子层的铜纳米颗粒均匀分散形成的流体分散体形成的铜纳米颗粒糊状物它们的表面成分散溶剂; 和铜微粒子或铜亚微粒子，或它们两者。还提供了使用其的电子部件的制造方法和金属部件的接合方法。

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