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    • 6. 发明专利
    • SWITCH
    • JPH0935576A
    • 1997-02-07
    • JP20020295
    • 1995-07-14
    • OMRON TATEISI ELECTRONICS CO
    • MAKINO OSAMUOKI MITSURU
    • H01H13/52
    • PROBLEM TO BE SOLVED: To reduce a cost and to form into hypersmall size while ensuring a margin of stress, by constituting a movable switch member bent after punch molding out of a plate material having conductivity and springiness. SOLUTION: A plate material having conductivity and springiness, after punch molding, is bent to constitute a movable switch member 4. In this member 4, a notch along the lengthwise direction is provided in a lateral direction with a prescribed interval in a plate main unit 10, to form a fixed contact part 14 and the first/second connection parts 17, 18 or the like. That is, the first connection part 17 for connecting the part 14, spring piece part 15, movable contact part 16 and the parts 14, 15, and the second connection part 18 for connecting the parts 15, 16, are formed in the member 4. The part 14 is bent in one direction (downward direction) relating to the part 17, and the part 15 is bent in the other direction (upward direction) relating to the part 17, to bend the part 16 in one direction (downward direction) relating to the part 18. In this way, a margin of stress is ensured, so that reducing a cost and forming hyper small size can be performed.
    • 7. 发明专利
    • SWITCH CIRCUIT CONNECTING STRUCTURE
    • JPH0212890A
    • 1990-01-17
    • JP16297988
    • 1988-06-30
    • OMRON TATEISI ELECTRONICS CO
    • MAKINO OSAMU
    • H05K1/14H01H1/58H05K3/36
    • PURPOSE:To improve workability and reliability by providing terminal pins on printed circuits to be connected with a flexible board while providing slits in the flexible board corresponding to the terminal pins so that the terminal pins are inserted into the slits, and engaged and held thereby. CONSTITUTION:In a switch circuit connecting structure for connecting printed circuits 7a to 7d on a switch board 2 with printed circuits 9a to 9d on a flexible board 6, terminal pins 8 are provided on the printed circuits 7a to 7d to be connected with the flexible board 6 while slits 10 are provided in the flexible substrate 6 corresponding to said terminal pins 8 so that the terminal pins 8 are inserted into the slits and engaged and held thereby. Thus, the boards can be soldered together without any deviation between the printed circuits 7a to 7d and the printed circuits 9a to 9d since the terminal pins 8 are positioned by inserting them into the slits 10 during the soldering process. Further, the soldered boards can be prevented from being peeled off. Accordingly, it is possible to provide products with stable accuracty and improved reliability.