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1. 发明专利

JPH04348536A RESIN MOLDING DIE 失效
公开(公告)号：JPH04348536A
公开(公告)日：1992-12-03
申请号：JP12061091
申请日：1991-05-27
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： B29C45/26 , B29C45/37 , B29C45/40 , B29L31/34 , H01L21/56
摘要： PURPOSE:To eliminate the remaking of an expensive molding die according to the resin sealing height even if the resin sealing height of electronic components differs from type to type, concerning the molding die for resin- sealing the electronic components. CONSTITUTION:This molding die has a cope cavity and a drag cavity, the bottom of at least one of which moving up and down. The movable bottom of the cavity serves as a knockout pin. The depth of the drag cavity 4 can be adjusted by installing with a screw 10 a knockout block 14 onto which the cavity bottom also serving as a knockout pin 6 is secured on a base plate 16 through an exchangeable spacer 11 having desired height.

2. 发明专利

JPH01244630A METHOD OF BONDING SEMICONDUCTOR PELLET 失效
公开(公告)号：JPH01244630A
公开(公告)日：1989-09-29
申请号：JP7253188
申请日：1988-03-26
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： H01L21/60 , B01J19/10 , H01L21/607
摘要： PURPOSE:To eliminate the need for a heating reflow process and flux, and to facilitate automatic positional correction by forming a bump composed of a conductor to the bonding electrode of one of an insulating substrate and a semiconductor pellet and ultrasonic-bonding both the bonding electrode and the bump. CONSTITUTION:A semiconductor pellet 3 is sucked under a vacuum by a collet 5 so that bumps 4 turn downward. The collet 5 is moved in the horizontal direction, and the semiconductor pellet 3 is shifted onto a section near a position to be bonded in an insulating substrate 1. The semiconductor pellet 3 is positioned completely, and the collet 5 is lowered with the semiconductor pellet 3 kept sucked under the vacuum. When a contact between the insulating substrate 1 and the semiconductor pellet 3 is detected by a touch sensor, the lowering of the collet 5 is stopped at the position of the pellet 3. Ultrasonic waves are applied to the collet 5 by an ultrasonic bonding device 6, and the semiconductor pellet 3 is vibrated in the direction parallel with a contact surface as shown in the arrow. Accordingly, the bumps 4 and a conductor pattern 2 are welded, thus completing their bonding.

3. 发明专利

JPH08290286A METHOD FOR DIVIDING CIRCUIT BOARD 失效
公开(公告)号：JPH08290286A
公开(公告)日：1996-11-05
申请号：JP9228895
申请日：1995-04-18
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： B26F3/16 , B23K26/00 , B23K26/14 , B23K26/38 , B23K26/40 , H01L21/301 , H05K3/00
摘要： PURPOSE: To dispense with exclusive split dies, in dividing a circuit board with electronic parts mounted into pieces of a prescribed size each, to prevent dust from generating from the end face of the circuit board thus divided or to prevent the insulation of the circuit board from deteriorating. CONSTITUTION: A condenser lens 3 is provided by which a circuit board 1 with electronic parts mounted is irradiated with a laser beam 4, and also a blowing nozzle 6 is provided by which an oxygen gas containing glass powder is blown to the laser machining part. As a result, exclusive dies are no longer required for dividing the circuit board 1. In addition, carbon dust is prevented from generating from the end face of the circuit board 1 on account of the heating by the laser beam, or the deterioration of the insulation is also prevented.

4. 发明专利

JPH04107854A LEAD FRAME FOR RESIN SEALING TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04107854A
公开(公告)日：1992-04-09
申请号：JP22619090
申请日：1990-08-28
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： H01L23/50
摘要： PURPOSE:To make it unnecessary to manufacture various kinds of lead frames for each kind of a package in the case of small-quantity production of a hybrid IC etc., by a method wherein lead patterns for a semiconductor device with the number of pins of at least different 2 kinds or more are disposed on a sheet of lead frame. CONSTITUTION:Lead patterns for a plurality of hybrid ICs, for example, 5 hybrid ICs are provided on a sheet of lead frame 1. The lead patterns corresponding to each hybrid IC comprise an inner lead 4 and an outer lead 5. Each lead is coupled by a tiebar 3 playing a role as a resin stopper when resin-sealing and an outer frame 6 which is a supporting body. Further, an inside of the inner lead 4 comprises an island 7, which is coupled to the outer frame 6 by a suspending pin 12. The number of lead corresponding to each hybrid IC is respectively varied. For example, a right end is the hybrid IC having 42 pins and the left adjacent to the right end comprised the hybrid IC having 24 pins.

5. 发明专利

JPH0212943A METHOD OF SCRIBING CERAMIC SUBSTRATE 失效
公开(公告)号：JPH0212943A
公开(公告)日：1990-01-17
申请号：JP16432788
申请日：1988-06-30
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： H01L21/301 , H01L21/78
摘要： PURPOSE:To scribe a ceramic substrate without deteriorating the characteristics of a thin film by coaxially forming an air diffusing nozzle and air sucking nozzle, and sucking and removing red-heated ceramic powder dust heated and melted by using a CO2 laser beam and blown by air at the time of scribing. CONSTITUTION:A ceramic substrate 1 is secured, and radiated from above with a CO2 laser beam. The radiated beam is condensed by a condensing lens 4 to locally heat and melt a region having approx. 0.05mm of diameter on the surface of the substrate 1. On the other hand, air introduced from an air inlet 6 is blown from an air diffusing nozzle 3 to the surface of the substrate 1. Accordingly, the melted ceramics are blown as sparks by the air. Further, the blown sparks are cooled while being sucked by an air sucking nozzle 2 to become powder dust, and collected through an air discharge port 7 to a dust collector.

6. 发明专利

JPS62213146A CUTTING AND MOLDING METHOD FOR LEAD 失效
公开(公告)号：JPS62213146A
公开(公告)日：1987-09-19
申请号：JP5575386
申请日：1986-03-13
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA , SATO HARUO
IPC分类号： H01L23/50 , H01L21/48 , H01L23/48 , H05K3/30
摘要： PURPOSE:To insert a lead for a hybrid IC easily by obliquely notching both side edges of the angular lead formed to the hybrid IC extending over a nose, askew crushing a surface in the direction orthogonal to the sideedges extending over the nose and molding and working the nose of the lead to a drill shape. CONSTITUTION:A hybrid IC 4 before cutting and molding leads is set onto a cutting type die 5, and a saw-tooth-shaped punch 6 is lowered, thus aslant notching both side edges of the angular leads 1 shaped to the hybrid IC 4 extending over noses, then molding the ends of the leads to a V shape. The lower surface of the hybrid IC 4 orthogonal to the side edges is set onto a bottom-force lead hold-down 7, the upper surfaces of the leads 1 are pressed down by a top-force lead hold-down 8, and both surfaces of the hybrid IC 4 are crushed obliquely extending over the noses by a top force 10 and a bottom force 9, thus molding the ends of the leads to a drill shape. Accordingly, when the hybrid IC is mounted to a printed board and the like by using a robot, the hybrid IC can easily be inserted into a hole for the printed board, employing the pointed ends of the noses of the leads as guides.

7. 发明专利

JPS6240972A SUPPLY DEVICE FOR PASTE SOLDER 失效
公开(公告)号：JPS6240972A
公开(公告)日：1987-02-21
申请号：JP18066885
申请日：1985-08-16
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： B23K3/06 , H05K3/34
摘要： PURPOSE:To stably supply paste solder without variance by providing a horizontal moving mechanism in addition to a lifting mechanism for a syringe to a supply device for paste solder so that almost all of the paste solder discharge from a needle can be coated to a soldering land. CONSTITUTION:A syringe holder 2 is lowered by a lifting air cylinder 3 to bring the tip of the needle 8 to the height of a prescribed distance from the soldering land 6 on a circuit board 5. The paste solder discharged in a specified amt. to the tip of the needle is pressed to the land 6. The needle 8 is horizontally moved by a horizontally moving air cylinder 7 and is raised so that almost all the paste solder discharged from the needle 8 is coated on the land 6. The needle 8 is further raised by the cylinder 3 and is thereafter reset to the origin by the cylinder 7, by which one cycle of the paste solder supply is completed.

8. 发明专利

JPS59145545A Method for airtight sealing of package for semiconductor device 失效
标题翻译：用于半导体器件封装的空气密封方法
公开(公告)号：JPS59145545A
公开(公告)日：1984-08-21
申请号：JP23742483
申请日：1983-12-16
申请人： Nec Corp
发明人： SUZUKI KATSUHIKO , TAKAHASHI MASANAGA
IPC分类号： C09J7/02 , B23K11/06 , H01L21/50 , H01L23/02
CPC分类号： H01L21/50
摘要： PURPOSE:To obtain the sealing method of high reliability, high yield rate and high efficiency by a method wherein a cap of square shape in plane view is placed on a seal frame, a roll electrode is brought to come in contact with the cap, the cap is rotated, and a current is applied to it. CONSTITUTION:A semiconductor package 41, whereon a square-shaped seal frame 44 which is smaller than a substrate 41' in square shape is provided on the square shaped substrate 41'. A square-shaped cap 43 is positioned and placed on a square-shaped seal frame 44 and a switch is turned ON. A roll electrode 35 is lowered by the power of an air cylinder and it presses the square-shaped cap 43. A rotating pedestal 42 begins to rotate in the direction shown by the arrow 50, and then a current is applied. The rotating pedestal is rotated and a welding work is conducted smoothly. A sealing of the shorter side and the longer side corner parts can be accomplished by the variation of vertical movement of the roll electrode 35 while the rotating pedestal 42 is being rotated at 360 deg..
摘要翻译：目的：为了获得高可靠性，高产率和高效率的密封方法，其中将平面图中的正方形盖放置在密封框架上的方法，使辊电极与盖接触，帽被旋转，并且电流被施加到它。构成：在方形基板41'上设置有比矩形的基板41'小的方形密封框架44的半导体封装41。方形盖43定位并放置在方形密封框架44上，并且开关被接通。辊电极35通过气缸的动力降低，并且按压方形盖43.旋转底座42开始沿箭头50所示的方向旋转，然后施加电流。旋转底座旋转，焊接作业平稳进行。短边和长边角部的密封可以通过辊旋转电极35的垂直运动的变化来实现，同时旋转底座42在360度旋转。

9. 发明专利

JPH0897240A WIRE BONDING METHOD OF HYBRID IC 失效
公开(公告)号：JPH0897240A
公开(公告)日：1996-04-12
申请号：JP22781694
申请日：1994-09-22
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： H01L23/12 , H01L21/60
摘要： PURPOSE: To prevent imperfect wire bonding of an hybrid IC wherein IC pellets are mounted on both surfaces of a board. CONSTITUTION: A diaphragm 4 seals the upper end of a recessed part 2 of a heater block 1. An IC pellet 7 is mounted on one surface of a wiring board 6, which is so put on the diaphragm 6 that a precoated surface comes into contact with the diaphragm. The wiring board 6 is fixed, and heating solution 5 is supplied to the recessed part 2. In the state that pressure is applied, an IC pellet 12 mounted on the other surface of the wiring board 6 is wire-bonded. Thereby deformation of the wiring board 6 can be prevented.

10. 发明专利

JPH02148746A WIRE BONDING DEVICE 失效
公开(公告)号：JPH02148746A
公开(公告)日：1990-06-07
申请号：JP30310688
申请日：1988-11-29
申请人： NEC CORP
发明人： TAKAHASHI MASANAGA
IPC分类号： H01L21/60
摘要： PURPOSE:To enable the confirmation during bonding and shorten the bonding time by mounting two cameras on the bonding head section of a device, and making one camera movable independently in the direction of X-Y moving together with the head. CONSTITUTION:When bonding is performed recognizing the position of each pellet a lead frame 7 is conveyed from the left side of a wire bonding device body 1, and the frame 7 is positioned by a mechanical pressing mechanism and a vacuum absorbing mechanism in a state that a hybrid IC1 has come under the second camera 5. At this time the camera 5 recognizes each recognition point S1, P1, P2,...,P10, S2, and the relative position of an IC1 board and the pellet on the board is calculated. Besides, the frame 7 is moved right by one pitch equivalent and positioned in a state that the board for the IC1 has come under the bonding tool 6. Then, the first camera 4 recognizes two points S1, S2, and the relative position of the IC1 board with the bonding head is calculated.

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