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1. 发明专利

JP2009294196A Measurement method of light-emitting diode tangential plane temperature 审中-公开
标题翻译：发光二极管平板温度的测量方法
公开(公告)号：JP2009294196A
公开(公告)日：2009-12-17
申请号：JP2008233496
申请日：2008-09-11
申请人： National Central Univ , 國立中央大學
发明人： CHIN SHIJIN , KO BONKUN , KYO KOKUKUN , CHEN KUAN-CHIEH , LIN FENG-LONG
IPC分类号： G01K7/01
CPC分类号： H05B33/089
摘要： PROBLEM TO BE SOLVED: To provide a measurement method of a tangential plane temperature of a light-emitting diode. SOLUTION: A temperature oscillation status of the light-emitting diode is determined by performing for a light-emitting diode: a first step of preparing a temperature curve of a light-emitting diode; a second step of inputting at least a fixed amount AC voltage into the light-emitting diode; a third step of measuring a temperature of an external package body specific position of the light-emitting diode, introducing a temperature measured from the specific position into a temperature curve, calculating a tangential plane temperature of the light-emitting diode by means of an interpolation method; and a fourth step of substituting the calculation result of the third step into a predetermined numerical analysis pattern. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供发光二极管的切向平面温度的测量方法。解决方案：通过执行发光二极管来确定发光二极管的温度振荡状态：制备发光二极管的温度曲线的第一步骤; 将至少一定数量的AC电压输入到所述发光二极管中的第二步骤; 第三步骤，测量发光二极管的外部封装体特定位置的温度，将从特定位置测量的温度引入温度曲线，通过插值法计算发光二极管的切平面温度方法; 以及将第三步骤的计算结果代入预定数值分析模式的第四步骤。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2006179894A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2006179894A
公开(公告)日：2006-07-06
申请号：JP2005354020
申请日：2005-12-07
申请人： National Central Univ , 國立中央大學
发明人： CHIN SHIJIN , SHU KANGEN , KYO KOKUKUN , KO BONKUN , TEI KENKO
IPC分类号： H01L33/62 , H01L23/34 , H01L33/64
CPC分类号： H01L33/645 , H01L25/167 , H01L33/648 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which has a intensified heat dissipation capability and is suitable to electric power recycling. SOLUTION: The light emitting device comprises a substrate, at least one luminescence chip, and a first heat dissipation element. The substrate has a crestal plane and a base, and a contact is arranged at the crestal plane. The luminescence chip arranged at the crestal plane of the substrate is got into touch with the contact. The luminescence chip comprises a light emitting layer, a positive electrode, and a negative electrode. Light is emitted by a current impressed between the positive and negative electrodes. The operating temperature of the luminescence chip can be lowered in such a way that the first heat dissipation element is arranged at the base of the substrate, so that a heat generated by the luminescence chip may be transferred from the light emitting device. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有增强的散热能力并适用于电力回收的发光装置。解决方案：发光器件包括衬底，至少一个发光芯片和第一散热元件。基板具有拱形平面和基部，并且在波峰平面上布置有触点。布置在基板的波峰平面处的发光芯片与触点接触。发光芯片包括发光层，正极和负极。光被正向和负极之间的电流照射。可以降低发光芯片的工作温度，使得第一散热元件布置在基板的基部，使得由发光芯片产生的热量可以从发光器件传输。版权所有（C）2006，JPO＆NCIPI

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