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1. 发明专利

JP2019027948A 偏光フィルムの撮像装置、及び検査装置、並びに検査方法审中-公开
公开(公告)号：JP2019027948A
公开(公告)日：2019-02-21
申请号：JP2017148174
申请日：2017-07-31
申请人： NITTO DENKO CORP , UNIV UTSUNOMIYA
发明人： SASAKI SHUNSUKE , SUEHIRO ICHIRO , SHIBATA SHUHEI , DAVID SERRANO , OTANI YUKITOSHI
IPC分类号： G01N21/88 , G01N21/958
摘要：【課題】偏光フィルムの欠陥を強調した画像を得ることができる撮像装置、及び該撮像装置を備えた検査装置、並びに該撮像装置を用いた検査方法を提供することを課題とする。【解決手段】検査対象となる偏光フィルムFに向けて光を照射するための光源2と、該光源の光軸上において前記光源とは反対側で前記偏光フィルムに向けて配置される撮像部3とを備え、前記光源と前記偏光フィルムとの間に配置される円偏光板4、及び前記偏光フィルムと前記撮像部との間に配置された波長板5の少なくとも何れか一方を備える偏光フィルムの撮像装置1、及び該撮像装置を備える偏光フィルムの検査装置、並びに該撮像装置を用いる偏光フィルムの検査方法。【選択図】図1

2. 发明专利

JP2013028139A Resin sheet, method for manufacturing the same, and through-hole forming apparatus 审中-公开
标题翻译：树脂片，其制造方法和通孔形成装置
公开(公告)号：JP2013028139A
公开(公告)日：2013-02-07
申请号：JP2011167224
申请日：2011-07-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO
IPC分类号： B29C67/20 , B26F1/44 , B29L7/00
CPC分类号： B26F1/14 , Y10T428/24273
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin sheet which can accurately form a through-hole in the resin sheet, the resin sheet obtained by the manufacturing method, and a through-hole forming apparatus used for the manufacturing method.SOLUTION: In the method for manufacturing a resin sheet 2, a through-hole 3 that penetrates the resin sheet 2 in a vertical direction is formed by arranging the resin sheet 2 between a base material 4 and a mold 5 arranged opposing the base material 4, and pressing the mold 5 relatively to the base material 4. The mold 5 includes a first protrusion 7 protruding to a lower side, and at a peripheral edge part of a low end of the first protrusion 7, a second protrusion 9 protruding lower side. The low end of the second protrusion 9 is formed an acute angle in the cross sectional view along the vertical direction.
摘要翻译：要解决的问题：提供一种可以精确地形成树脂片中的通孔的树脂片的制造方法，通过制造方法获得的树脂片和用于制造的通孔形成装置方法。解决方案：在制造树脂片2的方法中，通过将树脂片2布置在基底材料4和与之相对设置的模具5之间来形成贯穿树脂片材2的垂直方向的通孔3 基材4，并且相对于基材4按压模具5.模具5包括突出到下侧的第一突起7和在第一突起7的低端的周缘部，第二突起9 突出下侧。第二突起9的低端在垂直方向的截面图中形成锐角。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2006156329A Light guide plate for direct backlight and direct backlight 审中-公开
标题翻译：直接背光和直接背光的指导板
公开(公告)号：JP2006156329A
公开(公告)日：2006-06-15
申请号：JP2005086200
申请日：2005-03-24
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO , HARADA NORIAKI , HOTTA YUJI
IPC分类号： F21V8/00 , F21Y101/02 , G02B6/00 , G02F1/13357
CPC分类号： G02B6/0061 , G02B6/0018 , G02B6/0038
摘要： PROBLEM TO BE SOLVED: To provide a light guide plate for direct backlight capable of making light emission amount on a surface of the direct backlight mort uniform, and a direct backlight having more uniform light emission amount on its surface.
SOLUTION: The light guide plate has a light reflection part on its upper face, and a light dispersion part constituted by a plurality of circular grooves or protrusions arranged on upper face and/or lower face in concentric-circle form. The areas between respective concentric circles are practically same with each other. The direct backlight is provided with the light guide plate for the direct backlight.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于直接背光源的表面上的发光量的用于直接背光的导光板，并且在其表面上提供具有更均匀的发光量的直接背光。解决方案：导光板在其上表面上具有光反射部分，以及由多个圆形槽或突起构成的光分散部分，该多个圆形槽或突起以同心圆形形式布置在上表面和/或下表面上。各个同心圆之间的区域实际上是相同的。直接背光源设置有用于直接背光的导光板。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005235581A Direct projecting back light 审中-公开
标题翻译：直接投射背光
公开(公告)号：JP2005235581A
公开(公告)日：2005-09-02
申请号：JP2004043261
申请日：2004-02-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO , HOTTA YUJI , HARADA NORIAKI , SADAYORI NAOKI
IPC分类号： G02F1/13357 , F21S2/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a direct projecting back light which has a thin thickness with the uniform luminance of a light emitting surface.
SOLUTION: (1) A space formed of a light reflection surface 4 is sealed with a resin curing material 3. (2) The light reflection surface is reverse gimlet-like shape. (3) The refractive index of the resin curing material is 1.5 or more. (4) The resin is a polycarbodiimide.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有发光表面的均匀亮度的薄的厚度的直接投射背光。解决方案：（1）由光反射表面4形成的空间用树脂固化材料3密封。（2）光反射表面是反向的小球状。（3）树脂固化物的折射率为1.5以上。（4）树脂是聚碳化二亚胺。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004172313A Thermally conductive heat dissipating sheet and semiconductor device using the same 审中-公开
公开(公告)号：JP2004172313A
公开(公告)日：2004-06-17
申请号：JP2002335780
申请日：2002-11-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , SUEHIRO ICHIRO , HOTTA YUJI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipating sheet having high conduction efficiency from a heat generator to a heat sink and having high reliability in heat dissipating effects irrespective of the changes in surrounding conditions. SOLUTION: The heat dissipating sheet is provided, having an arrangement wherein a plurality of metal projections are arranged/formed at any positions on opposite surfaces of a metal foil, and at least one portion of the gap between the metal projections on at least one surface is filled with a resin which exerts adhesiveness in melting or flowing conditions after heating and pressurization. The heat dissipating sheet used in semiconductor devices is so arranged that through-holes are formed at portions of the metal foil where no metal projections are formed. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2002124542A ANISOTROPIC CONDUCTIVE FILM AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002124542A
公开(公告)日：2002-04-26
申请号：JP2000316894
申请日：2000-10-17
申请人： NITTO DENKO CORP
发明人： SUEHIRO ICHIRO , HOTTA YUJI
IPC分类号： H01R11/01 , H01B5/16 , H01B13/00 , H01L21/60 , H01R43/00 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film that has superior deformability for sufficiently following the shape of the surface (terminal formation surface) of an object to be connected, and allows a continuity path to reliably come into contact with (connect to) the terminal (electrode) of an object to be inspected at low pressure especially when the anisotropic conductive film is used as a connector for inspection, and to provide a method for manufacturing the anisotropic conductive film. SOLUTION: This anisotropic conductive film has a plurality of strip anisotropic conductive and insulating regions A1 and B. In the strip anisotropic conductive regions A1, a plurality of continuity paths 3 made of a conductive material are mutually insulated in an insulating resin layer 2 for passing through the insulating resin layer 2 in a thickness direction, and at the same time both the ends section of each continuity path 3 are exposed on both the main surfaces of the insulating resin layer. The strip insulating regions B are made of woven or nonwoven fabric. In the anisotropic conductive film, the strip anisotropic conductive and insulating regions A1 and B are alternatively arranged in one row.

7. 发明专利

JP2011029668A Method of manufacturing sheet for sealing optical semiconductor element 有权
标题翻译：用于密封光学半导体元件的制造方法
公开(公告)号：JP2011029668A
公开(公告)日：2011-02-10
申请号：JP2010249894
申请日：2010-11-08
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , SUEHIRO ICHIRO , HOTTA YUJI , YOSHIMURA TAKUYA
IPC分类号： H01L33/54 , H01L33/56 , H01L33/58
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a sheet for sealing an optical semiconductor element capable of obtaining a uniform white light with a high light extraction efficiency, and capable of efficiently manufacturing a thin optical semiconductor device. SOLUTION: The sheet for sealing the optical semiconductor element is constituted by laminating a plurality of resin layers, wherein one or more interfaces of each resin layer have an irregularity form. The method of manufacturing a sheet for sealing an optical semiconductor element includes a step of sticking a resin sheet not having the irregularity form and a resin sheet having the irregularity form, so that the irregularity form that the resin sheet having the irregularity form has is faced with the resin sheet not having the irregularity form. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造用于密封光学半导体元件的方法，该光学半导体元件能够以高的光提取效率获得均匀的白光，并且能够有效地制造薄的光学半导体器件。解决方案：用于密封光学半导体元件的片材通过层叠多个树脂层而构成，其中每个树脂层的一个或多个界面具有不规则形式。制造用于密封光半导体元件的片材的方法包括粘贴不均匀的树脂片和具有不规则形状的树脂片的步骤，使得具有不规则形式的树脂片的不规则形状面对树脂片不具有不规则形式。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009231750A Resin sheet for sealing optical semiconductor element and the optical semiconductor device 有权
标题翻译：用于密封光学半导体元件和光学半导体器件的树脂片
公开(公告)号：JP2009231750A
公开(公告)日：2009-10-08
申请号：JP2008078352
申请日：2008-03-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO , AKAZAWA MITSUHARU , USUI HIDEYUKI
IPC分类号： H01L23/29 , H01L23/31 , H01L33/48 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L21/561 , H01L24/97 , H01L33/44 , H01L33/483 , H01L33/52 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01L2924/181 , Y10T428/24851 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an encapsulating process of an optical semiconductor element, a resin sheet for encapsulating the optical semiconductor element, can effective encapsulation by simplifying the process of disposing a metal layer on a substrate, and to provide an optical semiconductor device produced by encapsulating the optical semiconductor element which uses the resin sheet. SOLUTION: A resin sheet 1 for encapsulating optical semiconductor element is constituted of at least an encapsulating resin layer 3, an adhesive resin layer 4, a metal layer 5, and a protective resin layer 2. In the resin sheet for encapsulating the optical semiconductor element, the encapsulating resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacent. The protective resin layer is laminated on the encapsulating resin layer and the metal layer so as to cover both. The encapsulating resin layer has a tapered shape, extending to the protective resin layer. An optical semiconductor device is produced by encapsulating the optical semiconductor element, by using the resin seat for encapsulating the optical semiconductor element. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供光半导体元件的封装工艺，用于封装光半导体元件的树脂片可以通过简化在衬底上设置金属层的工艺来有效地进行封装，并且提供光学通过封装使用该树脂片的光半导体元件而制造的半导体器件。解决方案：用于封装光学半导体元件的树脂片1至少由封装树脂层3，粘合树脂层4，金属层5和保护树脂层2构成。在用于封装光学半导体元件的树脂片光学半导体元件，密封树脂层和附着在粘合树脂层上的金属层相邻配置。保护树脂层层压在封装树脂层和金属层上，以覆盖两者。封装树脂层具有锥形形状，延伸到保护树脂层。通过使用用于封装光学半导体元件的树脂座来封装光学半导体元件来制造光学半导体器件。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2006140362A Optical semiconductor device sealing sheet and optical semiconductor device manufacturing method using the same 审中-公开
标题翻译：光学半导体器件密封片和使用其的光学半导体器件制造方法
公开(公告)号：JP2006140362A
公开(公告)日：2006-06-01
申请号：JP2004329887
申请日：2004-11-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , HOTTA YUJI , SUEHIRO ICHIRO , SADAYORI NAOKI
IPC分类号： H01L33/32 , H01L33/54
CPC分类号： H01L33/56 , B29C43/003 , B29C43/18 , B29C43/203 , B29K2105/256 , B29K2995/0018 , B29L2011/0016 , B29L2031/3425 , H01L33/505 , H01L33/52 , H01L2933/005
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device sealing sheet that simplifies resin-sealing of a semiconductor device during manufacturing of the semiconductor device, and maintains high light extraction efficiency, by increasing directivity of the light from the optical semiconductor device.
SOLUTION: The optical semiconductor device sealing sheet comprises an outermost resin layer 2 (A-layer) that contacts the optical semiconductor device; a light diffusion layer 3 that is formed on the outermost resin layer 2 (A-layer), and includes light diffusing particles; and a resin layer 4 (B-layer) that is formed on the light diffusion layer 3, and has a refractive index lower than that of the outermost resin layer 2 (A-layer). The optical semiconductor device manufacturing method comprises a step (1) of laminating the optical semiconductor device sealing sheet on the surface of a wiring circuit board 5, on which an optical semiconductor device 6 is mounted, and a step (2) of pressure-forming the sheet laminated in the step (1).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种在半导体器件的制造期间简化半导体器件的树脂密封并且通过增加来自光学半导体器件的光的方向性而保持高的光提取效率的光学半导体器件密封片。解决方案：光学半导体器件密封片包括与光学半导体器件接触的最外层树脂层2（A层）; 形成在最外层树脂层2（A层）上的光扩散层3，并且包括光漫射粒子; 以及形成在光扩散层3上并且折射率低于最外层树脂层2（A层）的折射率的树脂层4（B层）。光半导体装置的制造方法包括将光半导体装置密封片层叠在配置有半导体装置6的布线电路基板5的表面上的工序（1）和压制成形工序在步骤（1）中层压的片材。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005294733A Sheet for sealing optical semiconductor element, and manufacturing method for optical semiconductor device using the sheet 审中-公开
标题翻译：用于密封光学半导体元件的片材以及使用该片材的光学半导体器件的制造方法
公开(公告)号：JP2005294733A
公开(公告)日：2005-10-20
申请号：JP2004111050
申请日：2004-04-05
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HARADA NORIAKI , HOTTA YUJI , SUEHIRO ICHIRO , SADAYORI NAOKI
IPC分类号： B29C51/10 , B29C43/18 , B29C43/20 , B29C51/14 , B29C59/02 , B29K63/00 , B29K79/00 , B29L9/00 , B29L31/34 , H01L23/29 , H01L23/31 , H01L33/54 , H01L33/56 , H01L33/00
CPC分类号： B29C43/203 , B29C43/18 , B29L2011/0016 , H01L33/52
摘要： PROBLEM TO BE SOLVED: To provide a sheet for sealing an optical semiconductor device that can easily carry out plastic sealing of an optical semiconductor element when manufacturing the optical semiconductor device, and maintain light extraction efficiency of an obtained optical semiconductor device at a high level.
SOLUTION: In the sheet for sealing an optical semiconductor element on which multiple resinous layers are laminated, a resinous layer having a refractive index smaller than that of an A layer (B layer) is laminated on the outermost resinous layer (A layer) on the side that is in contact with the optical semiconductor.
COPYRIGHT: (C)2006,JPO&NCIPI

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